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FormNo:D2-001-11Rev.018TY-MQC1.2.3.4.4.14.24.34.45.6.6.16.26.36.46.56.66.76.7.16.7.26.7.36.7.46.7.5/6.7.6/6.7.7(G/F)6.7.8//6.7.9/V-CUT6.7.10/Finish6.7.116.7.12PCBPCB1.PCB2.PCB3.4.4.1IPC-T-50E4.24.1.1CR4.1.2MA4.1.3MI4.34.45.5.1IPC-A-600FAcceptabilityofPrintedBoard5.2IPC-6012QualificationandPerformanceSpecificationForRigidPrintedBoards5.3IPC-R-700ReworkMethods&QualityConformance5.4IPCJ-STD–003SolderabilityTestsforPrintedBoards5.5PE-8-2-E0025.8PCBA(Q3-017)6.6.16.1.1Q2-009PCBSQEPCBIQCAQL0.65MIL-STD-105ELevelIIAQL(MA)0.65(MI)1.5CR016.1.26.2MICROMETERPINGAUGE1050(MRX)X-RAY(TDR)V-Cut2.56.36.3.1Q2-009PCB6.3.2////6.4:PCBPCB6.4.1a.V-cutPTHNon-PTHb.X-Ray(finalfinish)c.PCBTDR6.4.2a.BGAV-Cut()(OSP)6.4.3a.b.PCBc.(2)d.6.5(1)//(2)/FABDRAWINGARTWORK(3)OEM/(4)(5)IPC6.6(1)(2)IPC(3)/PCBIPCCLASSIIDedicatedServiceElectronicProductsPCB1./√2.6.7.11√3.√4.√5.V-cutRDV-cut√6.PTHPTHM/BPCICPUDDRAGP√7.Non-PTHNon-PTH√8.√9.√10.OSP√√11.√12.√13.√14.check√15.√16.√17..√18.6.7.1√19.6.7.2√20.6.7.3√21.6.7.4√22./6.7.5√23./6.7.6√24.6.7.7√25.6.7.8,6.7.9√1.PCB-5PNL-5PNL-5PNLPCB1.1-11-21-3ULMark1-4FlammabilityClass1-5DateCode2-22-3///PeelingTest(3M#600Tape)/2-43./3-1LISTPTH,NON-PTH3-2///3-3FINISH3-3-1/63±5%/37±5%3-3-2/3-3-3/3-3-4OSP/3-4/3-4-1/3-4-23-4-3/----IMM--ToolingHole--//4./4-1PERANSI/J-STD-003245±5°C,5sec(MIN),95%coverage(MIN)/J-STD-0034-26.4µg.NaCl/Sq.in4-3/100%4-4(Thermalstress)288±5°C,10sec(MIN)/IPC-6012-4-5(PeelStrength)4-65./5-1/5-2-5-3()-5-45.4V-Cut//6.6-16-2PCB6-36.76.7.120%(10mil2mil)21%()30%MI31%MA5020%(10mil2mil)21%()30%MI31%MA5010MA10CR1.1/3MI1/2MA2.+/-20%MA50(1)MA(2)MA1050/(1)47mil1.2mil(2)47mil1mil(3)/20mil50MA10MA(1)BGAMA(2)0.1MI1050/50MA0.1250MA0.150MA0.450MA10MA10MA0.150MAPAD0.1PAD50MABGA10MASCMA80%~100%50MA50MA””()50MAPCB10MA0.120.1250MA0.120.120.40.450MA0.120.10.150MA0.10.12PAD0.1,PAD50MAPAD0.120.10.10.12PAD50MA0.11.0.12.80-100%3.4.R0.25.0.52.03MNo.60030sec906.50MAOKNGNGOKNGNG6.7.2(PTH)PTH,3milpingaugeMAPTHPTHMA10MA(1)110(2)10%(3)25%10MIMA10pingaugeMAMAMA10MA(NON-PTH)DIPToolingHoleFANNONPTHNON-PTH2milpingaugeMAToolingHolesPCBToolingHole(1)ToolingHolePCB(2)ToolingHole3mil(3)ToolingHole2milpingaugeMANONPTHMINONPTHNONPTH(1)MI(2)MI(3)MIPingauge(1)(2)PAD0.002PAD0.002PAD0.002[][](3)PAD(4)PAD[][](5)(6)PAD[][]ASUSLayoutTeam1050MAMAMA1.AR(AspectRatio)=H/1=0.3~0.362=1–1(mil)3.T=0.6~1.2(mil)1tolerance25%2tolerance25%HRCC1microvia()2microvia()MA12T6.7.3(RingPADSMTPADBGAPADTESTPAD)DIP(RingPAD)Ring2mil(1)AR1milMI(2)AR1milMAAR5010MA///10MA//(1)/(2)/(3)(AR1mil)--20%3--20%2(1)/-MA(2)-MA(3)/-MI(MA)10SMTBGAPADTESTPADSMT(1)SMT20%(2)QFPSMT15%1050MA20%51050MI10MA//10MA(1)10%5(2)SMTPADPitch50mil1milPADPitch50mil2mil1050MAPADPAD50%(1)FinePitch(24mil)PADPADPAD50%MAMI(2)CR10SMTSMT(1)(2)(3)(4)10MIMIBGAMAMA(1)pad90%10%dewetting()(2)50()1050BGABGAPADBGA10%1050MABGAPADonpad1050MABGAPADBGAPAD1050MABGAPAD1050MABGAPADBGAPAD1050MA(1)PADBGAPAD(2)()1050MABGAPADMA1050MATestViaRingTestPAD//.(TestViaRing)(1)1milRing/MA1mil(2)(TestVia)25%MIMA(3)/MA.(TestPad)(1)(0.012)///MI0.012(2)(12mil)25%MIMA(3)SMT+/-20%MA105010MA///10MA6.7.4(1)1.2(30mm)3MI(2)/(3)()1050//(1)0.12*0.12(3mm*3mm)0.04(1mm)3MI(2)-Function5mil2MI-MA0.04(3)BGAMA1050SMT(1)SMTfinepitchpad(0.024)0.2(5mm)30.80.8(20mm20mm)MISMT(2)BGAMA(3)10MA1050SMT(1)BGA(2)SMT1010MA10MI(1)(2)5%()MI0.04(1)Function0.040.08MI(2)-Function0.04MIMA-Function0.04MIMA0.040.04(3)BGAMA(4)1050MA0.080.080.080.08(1)(2)0.21.0(5mm25.4mm)0.320.32(8mm*8mm),MI(3)()S5(2+3)C6(3+3)MI(4)MI(5)0.8MA(6)SMTPAD(BGA)MA10501050MA3M#600MARDULMA0.4mil1.4milMA6.7.5/MA()MAG/F(1)SMT0.6(15mm)ViaHole(2)SMTPCB1050MA(1)(2)(3)ViaholeringMABGAtouchupMA)(4)/ViaholeSMTFinePitchPAD0.6(15mm)ViaHoleViaHole1/2MASMTPCB1050MAViaHoleViaHoleBGA6.7.6(1)LogoFCC,CEmark(2)(3)()(1)(2)MIPCBMIMIMIMI6.7.7(G/F)RR0.047R(chamfer)(Beveling)R(Fillet)(1)R0.0470.008(2)0.0400.008*455,0.030-0.050(3)(3.1)0.020+0.008-0.005*4530.060(3.2)0.055+0.006-0.006*2031050MI(1)AGPCARD&PCICARD(2)NLXM/B(3)DIMMM/BCARDPINGAUGE1050MA0.075+0.004-0.0020.356+0.004-0.0020.075+0.004-0.0020.360+0.004-0.002/50MAG/FMAG/FG/FASUS(1)//(2)/MI(3)//MA1050G/F///(1)10mil(2)(3)10mil10%PIN1050MAG/F(1)non-critical10mil5(2)50%1050MIG/F10%(MA)20%(MI)50G/F/(1)/MA(2)MAG/FMAMAG/F(1)(2)/MA(3)10MAG/Fnon-critical12mils3milpcs550MIG/FMAMI10G/F0.523MNO.60030sec903M#600MAG/F(1)(2)(3)MIMIPCIAGPnon-criticalareacriticalarea6.7.8()PCB0.75%IPC-TM-650pingaugeMA462mil6mil10%MicrometerMA6.7.9V-CUT10milRAMMODULE6milMA(1)(IPC-A-6002.1.1.1)------(2)(3)GF(4)10MAV-CUT30milV-CUT()/34milV-CUTMAV-CUTMAV-CUT303453603MAV-CUT5milMAV-CUTV-CutMA6.7.10/FinishBGAPADQFP(1)SMT80(min)~1000µ(max)(2)SMT100(min)~1000µ(max)(1)SSMT(2)BGAPAD(3)BGAQFPfinepitchPADQFPfinepitchPAD32milX-RayMA()Ni100µAu3µKEYPADX-RayMA()(1)CARDG/FNi100µAu10µ(2)M/BG/FNi150µAu30µX-RayMAAg8~15µX-RayMA(1)0.7mil(2)1.2mil()(1)MRXMA:µ)EnthoneCu106A0.25~0.4:F20.2~0.35Tamura:WPF-210.2~0.4OSPTamura:WPF-2070.2~0.4(1)OSP:PCBSQERDRD(2)OSPMA6.7.11(1)(MA)(2)()(MI)(3)(MI)PCB(1)PCB()0.8(2cm)MI(2)MA(3)(20PNL25PNL)D/CMI(4)(MI)-MA(D/C)PCBDatecode(1)PCBPCB(2)5%(3)A.()15B.30C.(25