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FlowChartofPCBProcess123487651211109IQCTRIMDRILLBLACKHOLEDRYFILMLAMINATING1819201415101723222127262524EXPOSURE13DEVELOPMENTPATTERNPLATINGETCHINGINSPECTINGS/MSURFACECLEAN1’STLIQULDSCREENPRINTPRE-CURE2’STLIQULDSCREENPRINTPRE-CURES/MEXPOSURES/MDEVELOPMENTPOST-CURELEGENDPRINTCUREHAL/ENIGG/FPUNCH/NC-RV-CUTFINALCLEANCUREO/STEST/OSPHOLECOUNT2829303132FQCOQCPACKINGWARHHOUSHOUTGOINGSYMBOL□:QUANTITYINSPECTION◇:QULITYINSPECTION▽:STORAGE○:WORKING▲:100%INSPECTION(1)前制程治工具制作流程顾客CUSTOMER裁板LAMINATESHEAR业务SALESDEP.生产管理P&MCONTROLMASTERA/W底片DISK,M/T磁片磁带蓝图DRAWING数据传送MODEM,FTP网版制作STENCILDRAWING图面RUNCARD制作规范PROGRAM程式带钻孔,成型机D.N.C.工程制前FRONT-ENDDEP.工作底片WORKINGA/W(2)多层板内层制作流程曝光EXPOSURE压膜LAMINATION前处理PRELIMINARYTREATMENT去膜STRIPPING蚀铜ETCHING显影DEVELOPING黑化处理BLACKOXIDE烘烤BAKINGLAY-UP及预迭板迭板后处理POSTTREATMENT压合LAMINATION内层干膜INNERLAYERIMAGE预迭板及迭板LAY-UP蚀铜I/LETCHING钻孔DRILLING压合LAMINATION多层板内层流程INNERLAYERPRODUCTMLBAOI检查AOIINSPECTION裁板LAMINATESHEARDOUBLESIDE雷射钻孔LASERABLATIONBlindedVia(3)外层制作流程通孔电镀P.T.H.钻孔DRILLING外层干膜OUTERLAYERIMAGE二次铜及锡铅电镀PATTERNPLATING检查INSPECTION前处理PRELIMINARYTREATMENT二次铜电镀PATTERNPLATING蚀铜ETCHING全板电镀PANELPLATING外层制作OUTER-LAYERO/LETCHING蚀铜TENTINGPROCESSDESMER除胶渣E-LESSCU通孔电镀前处理PRELIMINARYTREATMENT剥锡铅T/LSTRIPPING去膜STRIPPING压膜LAMINATION锡铅电镀T/LPLATING曝光EXPOSURE液态防焊LIQUIDS/M外观检查VISUALINSPECTION成型FINALSHAPING检查INSPECTION电测ELECTRICALTEST出货前检查OQC包装出货PACKING&SHIPPING涂布印刷S/MCOATING前处理PRELIMINARYTREATMENT曝光EXPOSUREDEVELOPING显影POSTCURE后烘烤预干燥PRE-CURE喷锡HOTAIRLEVELING铜面防氧化处理OSP(EntekCu106A)HOTAIRLEVELINGG/FPLATING镀金手指镀化学镍金E-lessNi/Au印文字SCREENLEGEND选择性镀镍镀金SELECTIVEGOLD全面镀镍金GOLDPLATING(4)外观及成型制作流程典型多层板制作流程1.内层THINCORE2.内层线路制作(压膜)典型多层板制作流程4.内层线路制作(显影)3.内层线路制作(曝光)典型多层板制作流程5.内层线路制作(蚀刻)6.内层线路制作(去膜)典型多层板制作流程7.迭板8.压合LAYER2LAYER3LAYER4LAYER5LAYER1LAYER6典型多层板制作流程9.钻孔10.黑孔典型多层板制作流程11.外层线路压膜12.外层线路曝光典型多层板制作流程13.外层线路制作(显影)14.镀二次铜及锡铅典型多层板制作流程15.去干膜16.蚀铜(碱性蚀刻液)典型多层板制作流程17.剥锡铅18.防焊(绿漆)制作典型多层板制作流程15.浸金(喷锡……)制作干膜制作流程基板壓膜壓膜後曝光顯影蝕銅去膜典型之多层板迭板及压合结构...COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ迭合用之钢板迭合用之钢板10-12层迭合压合机之热板压合机之热板COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ迭合用之钢板迭合用之钢板1.下料裁板(PanelSize)COPPERFOILEpoxyGlassPhotoResist2.内层板压干膜(光阻剂)3.曝光4.曝光后Artwork(底片)Artwork(底片)PhotoResist光源5.内层板显影PhotoResist6.酸性蚀刻(Power/Ground或Signal)PhotoResist8.黑化(OxideCoating)7.去干膜(StripResist)9.迭板Layer1Layer2Layer3Layer4CopperFoilCopperFoilInnerLayerPrepreg(胶片)Prepreg(胶片)10.压合(Lamination)11.钻孔(P.T.H.或盲孔Via)(Drill&Deburr)墊木板鋁板12.镀通孔附着碳粉13.外层压膜(干膜Tenting)PhotoResist14.外层曝光(patternplating)15.曝光后(patternplating)16.外层显影17.线路镀铜及锡铅18.去膜19.蚀铜(碱性蚀刻)20.剥锡铅21.喷涂(液状绿漆)22.23.绿漆显影光源S/MA/W24.印文字25.喷锡(浸金……)R105WWEI94V-0R105WWEI94V-0光分解反应(正性工作)→底片,STENCIL(网版)光聚合反应(负性工作)→底片,STENCIL(网版)BURIEDVIALAY-UPA=THROUGHVIAHOLE(导通孔)B=BURIEDVIAHOLE(埋孔)C=BLINDVIAHOLE(盲孔)D=BLINDHOLEMLBVIA(多层盲孔)BLINDVIALAY-UPBLINDVIASEQUENTIALLAY-UPABBACCARESINB-STAGEBLINDANDBURIEDVIAOPTION(盲埋孔的选择)D6–SpindleDrillingMachine数控（镭射）钻孔机BlackHoleLine黑孔线Desmear除胶渣DryFilmLaminator自动贴膜机AutomaticExposureMachine自动曝光机PatternPlatingLine电镀磨刷机EtchingLine蚀刻褪膜线AutomaticS/MPrintingLine自动丝印绿油印刷线AutomaticExposureMachine线路曝光机PostCureLine二次硬化线AutomaticLegendPrintingLine自动丝印印刷线SolderLevelingMachine喷锡机O/STester检测1.何谓锡膏RosinOrganicAcidSolvent含铅锡膏无铅锡膏锡粉助焊剂松香or树脂活性剂溶剂2000倍3700倍混合搅拌