X-RAY测试产品焊接不良识别

X-RAY测试不良识别培训Date:2013.12.26Concentration,Profession,Focus,Zerodefect专注，专业，专心，零缺陷1、气泡不良：标准：气泡大于25%不可接受现象：在X-RAY的照射下，在IC测算框内的气泡大于25%原因：无铅焊料的表面张力大，移动速度慢，焊料的润湿性、扩散性差,有机物经过高温裂解后产生的焊剂挥发物质难以挥发出去.物料氧化及PCB焊盘处理工艺过程缺陷。锡膏特性及炉温设置不符合产品的要求。2、内部连锡：现象：元件内部焊盘与外层及插件孔联接。原因：产品补焊靠元件太近。焊锡在高温下渗入。Concentration,Profession,Focus,Zerodefect专注，专业，专心，零缺陷3虚焊：现象：元件焊盘有重影，焊锡与焊盘没完全焊接.原因：返修过程温度设定不能满足焊接要求Concentration,Profession,Focus,Zerodefect专注，专业，专心，零缺陷Concentration,Profession,Focus,Zerodefect专注，专业，专心，零缺陷4焊盘异常：现象：焊盘整体有部分没有焊锡原因：PCB污染或工艺处理缺陷。导致焊盘缩锡5、锡珠：现象：元件内层有独立的黒色锡点。原因：产品印刷错误后清洗后再次印刷。预防措拖：印刷不合格的PCB板，做报废处理。。Concentration,Profession,Focus,Zerodefect专注，专业，专心，零缺陷6MOSFET管下面飞件：现象：1、元件浮高。2、检查时在X光照射下元件焊锡收缩到另外一边。原因：吸嘴堵塞及吸料位置偏移。Concentration,Profession,Focus,Zerodefect专注，专业，专心，零缺陷7BGA飞件：Concentration,Profession,Focus,Zerodefect专注，专业，专心，零缺陷Concentration,Profession,Focus,Zerodefect专注，专业，专心，零缺陷8金线不良Concentration,Profession,Focus,Zerodefect专注，专业，专心，零缺陷9拒焊：现象：焊点中有白色呈现或焊点不饱满周边内缩Concentration,Profession,Focus,Zerodefect专注，专业，专心，零缺陷10冷焊Concentration,Profession,Focus,Zerodefect专注，专业，专心，零缺陷11漏印：Concentration,Profession,Focus,Zerodefect专注，专业，专心，零缺陷12BGA气泡：Concentration,Profession,Focus,Zerodefect专注，专业，专心，零缺陷13BGA短路：Concentration,Profession,Focus,Zerodefect专注，专业，专心，零缺陷14BGA短路：Concentration,Profession,Focus,Zerodefect专注，专业，专心，零缺陷15BGA短路：Concentration,Profession,Focus,Zerodefect专注，专业，专心，零缺陷16IC短路：Concentration,Profession,Focus,Zerodefect专注，专业，专心，零缺陷17锡球：