无铅制造04(元器件与PCB)

1Ceprei-Rac----www.rac.ceprei.comTechnologyonComponents&PCBforLead-freeProcessPCBwww.rac.ceprei.com,[e-mail],0086-20872369862Ceprei-Rac----www.rac.ceprei.com™™3Ceprei-Rac----www.rac.ceprei.com1•••4Ceprei-Rac----www.rac.ceprei.comRoHS0.1wt%PbJEIDA0.1wt%PbEUELVD0.1wt%PbNote:Solderswith85wt%Pbareexempted!1.2.5Ceprei-Rac----www.rac.ceprei.comIPC1066/JESD976Ceprei-Rac----www.rac.ceprei.comNote:ItemsthatcontainPbshallnotusethislabelevenifexemptedbyRoHS.Pb-Freelabelbeaminimumof75mmby50mm.7Ceprei-Rac----www.rac.ceprei.comMaterialsthatcontainindiumIndiumContainingMaterialswithBismuthBismuthContainingTin/Zinc=SnZn(noBi)orversionsZinccontainingSnAgCuandit’sversionsTin/Silver/CopperAu,NiPd,NiPdAuPureTin(Sn)SnCu,SnAg,SnAgCuXMaterialTypeMarkPreplatedmaterialsTinPlate(allforms)OtherPbFreesolders(NoBismuth)Categorizatione1e2e3e4e5e6e7IdentificationofInterconnectMaterialDifferencesIdentificationofInterconnectMaterialDifferences22ndndLevelConnectionLevelConnection––forpackagesandboardsforpackagesandboards8Ceprei-Rac----www.rac.ceprei.comBOARD/ASSEMBLYMARKINGSubstrateER–EpoxyResinUR–UrethaneResinAR–AcrylicResinSR–SiliconeResinXY–ParyleneSize:aminimumof22mmx25mmwiththeminimumdiameterofthecircle=18mm.Location:onPCBlayer1(topside)atthelowerrighthandsegment.Halogen-free:Resinsthatcontainlessthan900ppmbromine,andlessthan900ppmchlorine,andlessthan1500ppmtotalhalogens.NOTE:RoHSprohibitedbrominatedsubstancesarenotgenerallyfoundinprintedwiringboardmaterials.IEC612492219Ceprei-Rac----www.rac.ceprei.com1.410Ceprei-Rac----www.rac.ceprei.comCross-sectionof144LQFPpackageafterlevel2a/260Cindicatingcrackinmoldcompound.1Cross-sectionofthe2-layerPBGApackageafterlevel2a/260Cstressingindicatingdelaminationwithinthedieattachlayerandinternalsubstratelayers11Ceprei-Rac----www.rac.ceprei.com212Ceprei-Rac----www.rac.ceprei.com1.51.Solderability2.ResistancetoSolderHeatReflowflowHandsoldering3.ResistancetoDissolutionofMetallization(260-30s)4.WhiskerRisk5.MSL6.13Ceprei-Rac----www.rac.ceprei.comS∆TAw14Ceprei-Rac----www.rac.ceprei.comANSI/J-STD-002B,IEC60068-2-58,MIL-STD-202G15Ceprei-Rac----www.rac.ceprei.comDipandLook16Ceprei-Rac----www.rac.ceprei.comResistancetoSolderingHeatReflowflowHandsolderingHandsolderingwavesolderingReflow235(30S)Flow260(10S)Handsoldering350(5S)17Ceprei-Rac----www.rac.ceprei.com18Ceprei-Rac----www.rac.ceprei.com1.5.3(260-30s)---SMDResistancetoDissolutionofMetallization19Ceprei-Rac----www.rac.ceprei.comMoisture/ReflowSenstive20Ceprei-Rac----www.rac.ceprei.comWire-BondedPlasticBallGridArray(PBGA)PackagePlasticQuadFlatPack(PQFP)PackageMoldingCompoundChipDIEChipPCBPCBSnPbPlatedLeadBT(BismaleimideTriazine)SubstrateAuWireAuWireSolderJointSolderBallSolderPaste21Ceprei-Rac----www.rac.ceprei.com1.5.41(FloorLife)[](h)1≤30/85%RH16885/85%RH21≤30/60%RH16885/60%RH2a4≤30/60%RH67230/60%RH3168≤30/60%RH19230/60%RH472≤30/60%RH9630/60%RH548≤30/60%RH7230/60%RH5a24≤30/60%RH4830/60%RH6≤30/60%RH30/60%RH22Ceprei-Rac----www.rac.ceprei.com1.5.4223Ceprei-Rac----www.rac.ceprei.com1.5.4324Ceprei-Rac----www.rac.ceprei.com1.5.44crossectionXray25Ceprei-Rac----www.rac.ceprei.com26Ceprei-Rac----www.rac.ceprei.com27Ceprei-Rac----www.rac.ceprei.com1.5.5LeadingComponentFinishesPTHLeadedComponents:(e.g.,PGA)Sn(eitherplateordip)SMTLeadedComponents:(e.g.,PQFP)Matte-Sn(forshortlifecycleapplications)Matte-SnwithNibarrierunderlayer*SolderBalledComponents:(e.g.,PBGA)Sn4wt%AgCuDiscreteComponents:(e.g.,chipresistor)Matte-Sn28Ceprei-Rac----www.rac.ceprei.com1.5.5.11.10mm2.133003.Filament/Nodule/Column/Hillock4.29Ceprei-Rac----www.rac.ceprei.com1.5.5.2ForFinePitchLeadedComponentsTinWhiskersMayShortCircuits!VariousKindsofTinWhiskers30Ceprei-Rac----www.rac.ceprei.com31Ceprei-Rac----www.rac.ceprei.com1.5.5.232Ceprei-Rac----www.rac.ceprei.com1.5.5.3(1)ThediffusionofCuintoSnandtheformationofCu6Sn5cangeneratecompressivestressintheSnlayer.(2)Thethermalloads.(3)Themechanicalloads.(4)Theshockandvibrationloads.(5)Theself-diffusionofSnalongSngrainboundariestotherootofawhiskerwillsupplymoreSnatomstopushtheSnwhiskerupward(dislocationloopclimbingeffectonthegrainboundaries).(6)SnOxlayerwithweakspotsTinWhiskerMechanisms33Ceprei-Rac----www.rac.ceprei.com1.5.5.4NodulePicturesTakenPeriodically(x1700)34Ceprei-Rac----www.rac.ceprei.com1.5.5.535Ceprei-Rac----www.rac.ceprei.comSMTThestressintheSn-layerduetotheformationoftheNi3Sn4IMC(inter-MetallicCompound)isintension1µm10µm36Ceprei-Rac----www.rac.ceprei.comJEDECSTANDARDJESD22A121MeasuringWhiskerGrowthonTinandTinAlloySurfaceFinishes1.5.5.6(1)37Ceprei-Rac----www.rac.ceprei.comSonyTechnicalStandardSS-00245-8(10)[TinWhiskerevaluation]1)HighTemperature/HumidityTest:85oC,85%RHfor500hrs2)ThermalCyclingTest:-35oCfor30minto125oCfor30min500cyclesNotes:NoBiasVoltageandheattreatmentEvaluationcriteria:Whiskerformation50umorless1.5.5.6(2)38Ceprei-Rac----www.rac.ceprei.com1.5.5.6(3)Intel:Whiskergrowthnottoexceed50microns(2mils)atanytimeduringfollowingtests1.TemperatureCycling(-55to85C):„„--55+0,55+0,--1010Cto85+10,Cto85+10,--00CairtoairtemperatureCairto