覆铜板和PCB板翘曲成因与预防措施

Summarization&Comment28PrintedCircuitInformationCausesandPreventionofCopperCladLaminateandPCBWarpageZengGuanglongAbstractPCBWarpageisadeepconcernedproductdefect.Themajorfactoris“stress”.“Stress”isrelatedwithresinformula,impregnationchemicalquality,PCBproductionconditions.ThedistributionofcircuitlineonPCBaswellasthecomponentassemblycondition.Thus,tosolvethewarpageproblemwehavetoconsidertheabovefactors.KeywordslaminatewarpagecoppercladlaminatePCBCopperFoil&Laminate29PrintedCircuitInformationSummarization&CommentCopperFoil&LaminateSummarization&Comment30PrintedCircuitInformationCopperFoil&Laminate31PrintedCircuitInformationSummarization&CommentCopperFoil&LaminateSummarization&Comment32PrintedCircuitInformationCopperFoil&Laminate33PrintedCircuitInformationSummarization&CommentCopperFoil&LaminateSummarization&Comment34PrintedCircuitInformationCopperFoil&LaminatePCIPCI