J-STD-033C操作.包装.出货及湿敏表面安装设备的使用

JOINTINDUSTRYSTANDARDHandling,Packing,ShippingandUseofMoisture/ReflowSensitiveSurfaceMountDevicesIPC/JEDECJ-STD-033CFebruary2012SupersedesIPC/JEDECJ-STD-033BIncludesAmemdment1October2005NoticeJEDECandIPCStandardsandPublicationsaredesignedtoservethepublicinterestthrougheliminatingmisunderstandingsbetweenmanufacturersandpurchasers,facilitatinginterchangeabilityandimprovementofproducts,andassistingthepurchaserinselectingandobtainingwithminimumdelaytheproperproductforhisparticularneed.ExistenceofsuchStandardsandPublicationsshallnotinanyrespectprecludeanymemberornonmemberofJEDECorIPCfrommanufacturingorsellingproductsnotconformingtosuchStandardsandPublications,norshalltheexistenceofsuchStandardsandPublicationsprecludetheirvoluntaryusebythoseotherthanJEDECandIPCmembers,whetherthestandardistobeusedeitherdomesticallyorinternationally.RecommendedStandardsandPublicationsareadoptedbyJEDECandIPCwithoutregardtowhethertheiradoptionmayinvolvepatentsonarticles,materials,orprocesses.Bysuchaction,JEDECandIPCdonotassumeanyliabilitytoanypatentowner,nordotheyassumeanyobligationwhatevertopartiesadoptingtheRecommendedStandardorPublication.Usersarealsowhollyresponsibleforprotectingthemselvesagainstallclaimsofliabilitiesforpatentinfringement.ThematerialinthisjointstandardwasdevelopedbytheJEDECJC-14.1CommitteeonReliabilityTestMethodsforPackagedDevicesandtheIPCPlasticChipCarrierCrackingTaskGroup(B-10a)ForTechnicalInformationContact:JEDECSolidStateTechnologyAssociation3103North10thStreet,Suite240-SArlington,VA22201-2107Tel[phone]Fax[phone]IPC3000LakesideDrive,Suite309SBannockburn,Illinois60015-1249Tel[phone]Fax[phone]PleaseusetheStandardImprovementFormshownattheendofthisdocument.©Copyright2012.JEDECSolidStateTechnologyAssociation,Arlington,Virginia,andIPC,Bannockburn,Illinois,USA.AllrightsreservedunderbothinternationalandPan-Americancopyrightconventions.Anycopying,scanningorotherreproductionofthesematerialswithoutthepriorwrittenconsentofthecopyrightholderisstrictlyprohibitedandconstitutesinfringementundertheCopyrightLawoftheUnitedStates.IPC/JEDECJ-STD-033CHandling,Packing,ShippingandUseofMoisture/ReflowSensitiveSurfaceMountDevicesAjointstandarddevelopedbytheJEDECJC-14.1CommitteeonReliabilityTestMethodsforPackagedDevicesandtheB-10aPlasticChipCarrierCrackingTaskGroupofIPCUsersofthisstandardareencouragedtoparticipateinthedevelopmentoffuturerevisions.Contact:JEDECSolidStateTechnologyAssociation3103North10thStreet,Suite240-SArlington,VA22201-2107Tel[phone]Fax[phone]IPC3000LakesideDrive,Suite309SBannockburn,Illinois60015-1249Tel[phone]Fax[phone]Supersedes:IPC/JEDECJ-STD-033B.1includesAmendment1-January2007IPC/JEDECJ-STD-033B-October2005IPC/JEDECJ-STD-033A-July2002IPC/JEDECJ-STD-033-April1999JEDECJEP124IPC-SM-786A-January1995IPC-SM-786-December1990®ThisPageIntentionallyLeftBlankAcknowledgmentMembersoftheJointIPC/JEDECMoistureClassificationTaskGrouphaveworkedtodevelopthisdocument.Wewouldliketothankthemfortheirdedicationtothiseffort.Anystandardinvolvingacomplextechnologydrawsmaterialfromavastnumberofsources.WhiletheprincipalmembersoftheJointMoistureClassificationWorkingGroupareshownbelow,itisnotpossibletoincludeallofthosewhoassistedintheevolutionofthisStandard.Toeachofthem,themembersoftheJEDECandIPCextendtheirgratitude.IPCPlasticChipCarrierCrackingTaskGroup,B-10aChairmanStevenMartellSonoscan,Inc.JEDECJC14.1CommitteeChairmanJackMcCullenIntelCorporationJEDECJC14ChairmanNickLycoudesFreescaleSemiconductorJointWorkingGroupMembersDougDerry,AccuAssemblyRanjitGannamani,AdvancedMicroDevicesJosephSmetana,Alcatel-LucentRussellNowland,Alcatel-LucentBradleySmith,AllegroMicroSystemsInc.MauriceBrodeur,AnalogDevicesInc.BillStrachan,ASTA-PortsmouthUniversityLyleBurhenn,BAESystemsPlatformSolutionsMaryBellon,BoeingResearch&DevelopmentTimChaudhry,BroadcomCorporationGlennKoscal,CarsemKevinWeston,CelesticaJasbirBath,ChristopherAssociatesInc.FrancoisMonette,CogiscanInc.ErichGoertler,ContinentalAutomotiveGmbHMichaelBlazier,DelphiElectronicsandSafetyMichaelPepples,DelphiElectronicsandSafetyStuartLonggood,DelphiElectronicsandSafetyDavidGaydos,DLGTechnicalEngineeringJoanneShipe,DSMEngineeringPlasticsRalphJustus,EIA-ElectronicIndustriesAllianceGlennDearing,EndicottInterconnectTechnologiesIncDongkaiShangguan,FlextronicsInternationalNicholasLycoudes,FreescaleSemiconductorDeepakPai,GeneralDynamicsInfo.Sys.,IncGergelyCsohany,Harman/BeckerAutomotiveSystemsKft.SrinivasChada,HenkelCorporationKeithNewman,Hewlett-PackardCompanyJennieHwang,H-TechnologiesGroupCharlesReynolds,IBMCorporationMarioInterrante,IBMCorporationPaulKrystek,IBMCorporationCurtisGrosskopf,IBMCorporationJamesMaguire,IntelCorporationJackMcCullen,IntelCorporationMarkKwoka,IntersilCorporationKerryOren,ITTQuyenChu,JabilCircuit,Inc.MartyRodriguez,JabilCircuit,Inc.(HQ)GirishWable,JabilCircuit,Inc.(HQ)JulieCarlson,JEDECKenMcGhee,JEDECAkikazuShibata,JPCA-JapanElectronicsPackagingandCircuitsAssociationLelandWoodall,KeihinCarolinaSystemTechnologyLeoFeinstein,LeoFeinsteinAssociatesJamesMarkBird,