覆铜板生产过程与工艺原理-PCB基材覆铜板生产过程与工艺

kidddds00
9 ℃
2016-09-03

整理文档很辛苦，赏杯茶钱您下走！

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PCB|||||||||||||SMT|FPC||PCBPCBwww.pcbres.com2008-01-11PCB:();();();:()A(resInvarnish):(geltime)(volatilecontent):pH-()()()120~180°C(B)()(prepregPP(preimpregnatedbondingsheet)WebPCBPCBPCBCAM35050Genesis80ProtelP60PCBIPC8050()(resincontent,RC%)(resinflow,RF%)(volatilecontent,VC%)(geltime,GT)(solubleresincontent)()(impregnation)(drying)())()):();()()AB()AB75%~95%(GPC)FR-4-(2-52-11):()6%~7%(Mw/Mn)()()(cutting)(layup)(lamination)()()()()BC()HTML::(0)·PCB··PCB··PCB·PCB··PCB·(AOI)·PCB©2007|:020-89811835|QQ:28963805|: