PCBA-PE分析

1FACapabilityEnhancementProjectOffice2005/10/72ContentsPurposeTeamMemberMilestoneOverallFAFlowFailureHappenM/BVerificationComponentVerificationbyFAEEOSVerificationComponentVerificationbyVendorAppendixESD&EOS的差別ICT/ATETestPrincipleNoticeItemSolderingDefect&PCBIPCSolderingStandard3Purpose掌握解決問題的黃金時間.減少作業上費用的損失和工時的浪費.4TeamMemberLeader:HankChenExt:2845TeamMember:C.YTangExt:1002AndyYehExt:1051JaymeLaiExt:1930SamLiewExt:12585Task9/19SeptemberOctoberNovemberDecember9/20~10/111.TeamUp2.TrainingMaterialpreparation3.TrainingForWIHTrainingForWZS/WKSTrainingForWPH4.SOP&WIReview5.Golive6.Implementationreview/AuditMilestone10/12~10/1611/4~11/1211/12~12/1112/11~12/3110/18~10/2810/29~11/4ClosedIn-Progress6OverallFAFlowCriticalIssue?NoProcessImprovementComponentProcessAResult?ComponentOrProcess?EOSIssue?EOS/ESDIssue?ReportAuthenticFailureHappenM/BVerificationGothroughNormalProcess(CIP)EOSVerificationReviewLessonLearnEOS/ESDTeamImproveProcessImprovementNoNoNoYesYesYesEOSAESDProcessComponentComponentVerificationByFAEComponentVerificationByVendorEnd7FailureHappenMeetCriteria?YesNoLineShutdownM/BVerificationBurnIssueTopIssueMeetCriteria?YesNoGothroughNormalProcess(CIP)MeetCriteria?YesNoBurnIssue•Abnormalbadsmell.•Abnormalsmoke.•ComponentHighTemperature•BurstSound.TOPIssue•Samefailuremodemorethan3pcs.•FPYRTOP3Issue.LineShutdown•PDFPYRlowerthanQCsettingcriteria.•ContinuousfailuremodeintheProduction.•LineShutdowncriteriabaseoneachsidedefinitionofeachmodel.startEnd8M/BVerificationProcessImprovementVisualIssue?ATEResult?MeasurementResult?M/BVisualInspectionRetestATEMeasurementPE/RDAnalysisPassNoFailPassFailYesstartEndCheckComponentOrProcessIssue9WorkmanshipIssue?YesNoTakeAction&ImprovementCheckWorkmanshipCheckProcessProcessIssue?YesNoWorkmanshipIssue•檢查M/B上的零件是否損件或M/B是否損傷.•檢查DIP零件是否缺件,極性反.•檢查DIP零件是否錯件,錯位.•檢查Jumper或JumperWire的是否正確依照SOP.ProcessIssue•檢查M/B上的零件和soldering是否有open或short.•檢查SMT零件是否缺件,極性反,偏移…etc.•檢查SMT零件是否錯件,錯位.•檢查M/B上是否有Fluxpollution而造成測試不良.startEndM/BVerification–M/BVisualInspection10Result?FailPassAnalysisbyFAEOpen/ShortTestingDynamicalTestingResult?FailPassOpen/ShortTesting•ATEcanmeasureUUTresistanceorICclampingdiodebystimuluscurrentandvoltageinopen/shortandresistortestsectionthroughtestpointofM/B.•可以檢查到MissingComponent/Solder,Component/Pinhighup,ComponentShifted,Tombstone,Soldershort/open…etc.DynamicTesting•Dynamictestingincludevoltagemeasurement,digitaltestingandcrystaloscillator.•M/B(System)waspoweronduringdynamictest.•可以測到Voltagefail,ComponentfunctionfailandFrequencyfail的不良品.startEndM/BVerification–RetestATERemark:*重測結果fail,有可能零件已經不良或遭受破壞,必須檢查流程,追蹤原因.*重測結果Pass,表示可能ATEtestcoverage不足,必須回饋ATE改善.11MeasurementResult?PassFailPE/RDAnalysisCheckSignalAnalysisbyFAEMulti-Meter•測量M/B上電阻的歐姆值.•測量M/B上線路的diodereading.•測量M/B上的電壓值.Oscilloscope•可以用來觀察波形,測量電壓,週期及頻率.•在動作快及頻率高的電子電路中,可以瞭解其動作情形及反應的波形,並判斷電路是否良好,及判斷其故障的部位.M/BVerification–MeasurementstartEndCheckSignalbyusingthetools:•Multi-Meter•Oscilloscope12PassFailTakeAction&ImprovementComponentSwapRe-solderOpen/Short/DiodeReadingCheckVisualInspectionInspectionResult?MeasurementResult?Re-solderResult?Result?ATEStagePassPassPassFailFailFailComponentVerificationbyFAEstartEndComponentIssueVisualInspection•ChecktheinspectionofrelatedcomponentbeforeremovefromtheM/B.(禁止破壞現場,避免隨意拆零件後,破壞了真正的rootcause)Checksoldering(open,short),wrongparts,inverted,shifted…etc.•Usemagnifyingglass,microscope,X-Rayasvisualtoolstochecktheinspection.Open/Short/DiodeReadingCheck•Usemulti-metertomeasurethediodereading,ohmsreadingforComponentfail,openandshort.Re-solder•Re-solderthecomponentorreheattheBGAbeforeremovefromtheM/B.ComponentSwap•Remountthecomponentforverification.•UseSortingBoardtoverificationifavailable.13EOSVerificationEOSIssue?EOSIssue?EOSIssue?Multi-MeterMeasurementSendtoSQMEOSTeamImproveFlyingProbeTesterNoNoYesYesYesSpecialATEFixtureNostartEnd14EOSVerificationFlowICTATEAC/DCCheckFAEVendorRepairSQMsendDefectcomponentNGproductSendtoFAEEOSDamage?NoYesInternalProcessreviewTakeactionAC/DCCheckFailure-AnalysisWIHteamNeedWIHTeam2ndhandsupportFeedbacktheresultESD(Electro-staticDischarge)靜電放電EOS(Electricaloverstress)電氣過載一般EOS發生的原因為過大的電壓或電流常見的狀況如下：設計不良的工作程序及測試程式更動或修理產品時未關閉電源開關機未按照程序起動Chip的電源前加測試信號測試條件大於規格值線路板設計不良使powersupply的突波或雜訊傳導到元件造成破壞IC內部引發Latch-Up等等。15EOSVerification–Multi-Meter利用三用電表的二極體檔()測量VCC對Ground的值是否異常,包括open,short.依據Datasheet找出IC的PinAssignment,用三用電表來量測零件本體之二極體值,再與功能不良IC的二極體量測值作比較.發現測量值有異常時,儘速與相關單位分析異常原因(EOS…)SpecialATEFixtureUseMulti-MetermeasureFlyingProbeTesterImVccGndDUTInternallogicABVmVs16EOSVerification–FlyingProbeInformationfilePrepare(Fixture)Createtestprogram(OKcomponent)Learnresistance&diodevalue依照零件尺寸製作FlyingProbe零件夾邊治具.取一片好的零件當樣品製作FlyingProbe測試程式,量測NG待測物進而判斷零件NG位置點.(測試內容包含Open,Short,ICDiode對VCC量測)發現測量值有異常時,儘速與相關單位分析異常原因(EOS…)ComponentTestSpecialATEFixtureUseMulti-MetermeasureFlyingProbeTester17EOSVerification–SpecialATEFixtureATEFixtureprepareDatasheetprepare&researchCreatetestprogramTestprogramdebug&Test依照零件尺寸製作ATE零件測試治具.依據Datasheet製作轉換ATE測試程式.(測試內容包含Open,Short,ICDi