1_MT6253 SMT应用简介(2)

InternalUseCopyright©MediaTekInc.Allrightsreserved.MT6253(aQFN)SMT&ApplicationIntroduction2010/01Preparedby:ZhongXinApprovedby:RioChiangE-mail:[e-mail]内容MT6253介绍WhatisaQFNaQFN’sAdvantagevsTFBGA&QFN客户量产问题集解决方法：PCB设计解决方法：钢网设计MT6253(aQFN)TaskForceTeamAppendix1InternalUseMT6253介绍Mediatek将于2009年Q4推出首款GSM/GPRS单芯片方案MT6253MT6253集成了数字基频(DBB)，模拟基频(ABB)，电源管理(PM)，射频收发器(RF)。支持手机相机，高速USB，及D类音频功放MT6253=MT6225+MT6318+MT6139MT6253采用了新一代封装技术(aQFN)MT6253N0930-BFALDSPK54-04-1G2-52MT6253正印2InternalUseWhatisaQFNaQFNmeansAdvancedQFNFeaturesLowCost,Profile,andLightweightExcellentThermal/ElectricalPerformanceExcellentAnti-drop-&-twistcapabilityHighI/Ocountupto400Leadless&multi-rowpackageFree-formI/OdesignPower/GroundringFineleadpitch0.4mmGNDaQFNQFNTFBGA0.6-0.850.85-11-1.2PKGheight(mm)3BT-RESINPAD(Cu)SolderBall(SAC305)SolderMaskIMClayer,Au/Ni/SAC305aQFNTFBGAInternalUseaQFN’sAdvantagesvsTFBGA&QFNPackageStructureaQFN(MT6253)TFBGA(MT6225MT6318)QFN(MT6139)CostMediumHighLowThermalExcellentMediumExcellentElectricalExcellent(Lead-frame)Medium(Substrate)ExcellentAnti-drop-&-twistExcellentMediumExcellentPKGprofileLowHighMediumWirebond-abilityGoodGoodMedium0.4mmPitchYesYesYesSMTabilityMedium(Fewexperience)Good(Solderball)Good(Single-row)ReworkMethod1.Pre-solder(Fresh)2.GoodSOP&GoodYieldRe-ball(Mature)SolderIron(Mature)4+InternalUse客户量产问题集5客户名称SMTYield5M1E原因分析改善措施改善效果SMTDebugTimeA96.0%(1920/2000)MaterialPCB制作问题：Pad偏位短期：优化钢网消耗库存长期：改善PCB制作96%--99%(9K）2天B93.6%(2808/3000)Method钢网问题：开口偏下限微调钢网开口93.6%--99.1%(30K)2天CPrj1：66.7%(8/12)Prj2：75.0%(12/16)PCB设计问题：RF铺铜1.下批PCB表面不铺铜，2.SA将规则添加到DMS中70%--100%(90Pcs)5天DPCB1100%(12/12)PCB250%(6/12)PCB制作能力：无阻焊桥要求使用PCB1的厂商50%--100%(12Pcs)1天E60%(12/20)PCB制作精度：Pad偏大SA将PCB规则添加到DMS中60%--100%(15pcs)2天F95%(19/20)多口FlashTool不稳定短期：多次反复下载长期：SA更新DLSW解决下载不稳定问题NA(SWIssue)1.PCB制作精度：Pad偏小2.多口FlashTool不稳定1.SA将PCB规则添加到DMS中2.短期：多次反复下载85%--99.1%(336Pcs)1天解决下载不稳定问题NA(SWIssue)H25%(2/8)25%--99.4%(168pcs)1天纪律问题：厂商未SMTTrail即生产1.PM要求厂商必做SMTTrail2.SA要求客户FollowMTKSOPGPrj1:82.5%(66/80)Prj2:85%(34/40)Prj3:95.8%(46/48)MethodMan截至3/12，18客户已经MP,共生产802K.平均良率99.3%InternalUse▪PCBLayoutsuggestionforE-padarea:–推荐与IC接地焊盘相同尺寸(即封装库1：1的面积比例)制作E-Pad.▪PCBLayoutsuggestionforSignalPad：–推荐制作直径为0.27mm的圆形焊盘(按封装库1:1制作)，精度控制在+/-0.02mm–禁止在PCB表层使用铺铜设计.–为保证接地性能，RFGND间建议做成网格状走线或将GNDPad连通到内层的GND平面.表层走线线宽尽量控制在0.2mm以内。–Pad与Pad之间留有阻焊桥.解决方法:PCB设计√XE-Pad表层不铺铜表层铺铜6InternalUse▪StencilOpeningsuggestionforE-padarea:–推荐钢网开口面积为PCBE-Pad面积的30%～40%.–推荐钢网开口边缘距离PCB焊盘边缘0.2mm以上.–建议将钢网开口区域分割成为边长小于2mm的大小相等方块.▪StencilOpeningsuggestionforSignalPad：–推荐采用0.1mm厚的钢网.–推荐SignalPad开口边长（直径）在0.27mm~0.28mm之间.–建议将其外形制作成方形倒角或圆形.解决方法：钢网设计E-PadMT6253ThicknessOpeningE-Pad0.1mm30%-40%AreaSignalPad0.1mm0.27~0.28方形或圆形7InternalUseMT6253(aQFN)TaskForceTeam:PCBDesign/StencilGuideaQFNReliabilityIntroductionaQFNSMT试产体验计划8(pageA-1&2)(pageA-3&6)(pageA-7)InternalUseCopyright©MediaTekInc.Allrightsreserved.Copyright©MediaTekInc.Allrightsreserved.AppendixInternalUsePCBPadDesignGuidelineforaQFNLandTerminalLandLandCopperSolderThicknessOpening0.8mm0.4mmSquareSqure0.43mm0.53mm0.12mm0.48mm0.8mm0.4mmCircleCircle0.43mm0.53mm0.12mm0.48mm0.65mm0.35mmSquareSqure0.375mm0.475mm0.12mm0.4mm0.65mm0.35mmCircleCircle0.375mm0.475mm0.12mm0.4mm0.5mm0.3mmSquareSqure0.325mm0.425mm0.1mm0.38mm0.5mm0.3mmCircleCircle0.325mm0.425mm0.1mm0.38mm0.5mm0.25mmSquareSqure0.275mm0.375mm0.1mm0.33mm0.5mm0.25mmCircleCircle0.275mm0.375mm0.1mm0.33mm0.475mm0.27mmCircleCircle0.27mm0.3mm0.1mm0.27mm0.4mm0.2mmSquareSqure0.225mm0.3mm0.1mm0.225mm0.4mm0.2mmCircleCircle0.225mm0.3mm0.1mm0.225mmaQFNPackagePCBPadDesignStencilA-1InternalUseStencilApertureDesignruleMT6253PKGPCBLandPadDesignStencilLandPitchTerminalsizeLandShapeLandShapeCopperPadSolderMaskThicknessTerminalOpening0.4750.27CircleCircle0.27(note1)0.30(note2)0.10.23~0.27GNDOpeningThermalpadSquareOpeningMatrixGap7X70.5(note3)8X80.25~0.33GNDUnit:mmNote:1.Pad尺寸与PCB板厂制作能力决定，此为推荐值，钢网开口尺寸与此值强相关2.由PCB板厂制作能力决定，此为推荐值3.请在方框周边倒R=0.075mm的圆角A-2InternalUseMoistureSensibilityLevelTestA-3InternalUseBoardLevel-DropTest-1A-4InternalUseBoardLevel-DropTest-2A-5InternalUsePackageWrapage-TwistA-6InternalUse客户体验计划DummyICPODProposal&Flow:1.客户成立TFT小组,MSZSA与CS工程师将协同运作2.MTK提供1KDummyIC与100片DaisyPCB,并请客户安排两次SMT体验试产.3.每次试产前,MSZ工程师会与TFTstudy与制定相关参数后生产,如有必要两次试产中间,会邀请台湾封装厂与相关技术人员至工厂作技术指导与De-bug..MT6253DaisyChainDaisyPCBA-7