PCB-设计规范SMT

PCB设计规范PCBlayoutrule.doc(rev4)1印刷電路板設計規範PrintCircuitBoardLayoutRulePDF文件使用pdfFactoryPro试用版本创建www.fineprint.cnPCB设计规范PCBlayoutrule.doc(rev4)2目錄TableofContentⅠ.前言IntroductionⅡ.PCB機構設計MechanicalDesignforPCB1.折斷邊設計Break-awayDesignRule1.1定位孔ToolingHole1.2光學對位記號FiducialMark1.3郵票孔RoutingTab1.4V-形切槽V-Cut1.5PCB板厚規格PCBthickness2.限制區Limitation/Restriction2.1機構限制區RestrictionforMechanism2.2郵票孔限制Restrictionforroutingtab2.3V-cut限制RestrictionforV-cut2.4PCB外形尺寸限制LimitationforPCBOutlineDimension2.5銅柱製程限制RestrictionforStandoffProcess2.6PCB變形量限制LimitationforPCBWarpage2.7PCB外形缺口限制(含排版)RestrictionforPCBoutlineSlotHole(includingpanelization)2.8TRACE限制RestrictionforTrace2.9VIAHOLE設計RestrictionforViaHole2.10測試點置放的規則及限制RestrictionforTestPoint3.金手指GoldenFinger4.排版PanelizationⅢ.PCB零件設計ComponentDesignforPCB5.零件擺置方向OrientationofComponentPlacement6.光學辨識點FiducialMarkonQFP&BGA6.1金屬基板辨識點外形規格FiducialmarkonmetalPCB6.2PQFP&BGA辨識點外形規格FiducialmarkonPQFP&BGA7.文字面與極性標示LegendandPolarityMark7.1表面黏著元件SurfaceMountComponent(device)7.2鑽孔元件Drillholecomponent7.3標籤黏貼位置在文字面上的標示LegendforLabelPosition7.4標準零件間距SpacebetweenComponents8.迴焊製程規範ReflowProcess8.1PAD表面噴錫厚度ThicknessofHotAirSolderLevel8.2迴焊製程使用PAD尺寸PadDimensionforReflowProcess9.其它OthersPDF文件使用pdfFactoryPro试用版本创建www.fineprint.cnPCB设计规范PCBlayoutrule.doc(rev4)3Ⅰ.前言Introduction1.目的Purpose：基於生產製程需求，及讓電路板佈置設計，有一標準規範可依循，並期望所佈置電路板，在組裝時，能高效率生產，易組裝及測試，並可得到高品質，低成本之目標，而製訂此規範。ThisspecificationprovidesguidancetoHonHaiengineersforthedesignofprintcircuitboardinallHonHaiproducts.ThepurposeofthisspecificationistoensurethatallPCBsdesignedbyHonHaiareabletohavehighyield,humanfriendlyassemblyandtest.Tomeetcustomerrequirements,gettinghighqualityandlowcostisthegoalofthisspecification.2.適用範圍Scope：此規範僅適用於可攜式電腦，電源及通訊產品之電路板設計時使用。Thedesignofnotebook,powerandcommunicationproductmustmeetthisspecification.3.修改Revise：*若對規範內容有建設性之意見，請反應至製程工程單位，製程工程與相關單位討論後，進行後續修改作業。*如有變更零件設計規格時,需更新零件包裝資料庫。*此規範至少每半年更修一次。*Pleaseinformmanufacturingengineerifanydepartmenthasanysuggestionforthisspecification.Manufacturingengineerhastodiscussitwithrelativedepartmentandthencontinuouslyrevisethisspecification.*Pleaseupdatecomponentdatasheetifmakinganychangeonthisspecification.*Thisspecificationhastobereviewedeveryhalfyear.PDF文件使用pdfFactoryPro试用版本创建www.fineprint.cnPCB设计规范PCBlayoutrule.doc(rev4)4Ⅱ.PCB機構設計MechanicalDesignforPCB1.折斷邊設計Break-awayDesignRule1.1定位孔ToolingHole孔徑為4+0.1/-0mm.Holedia=4+0.1/-0mm.非鍍通孔(NPTH);FigureB.NPTH,pleaserefertoFigureB.1.2光學對位記號FiducialMark1.2.1光學對位記號規格,如圖A.Spec.forfiducialmark,seeFigureA.FigureA-:直徑為1mmCupad/表面處理為化金/噴錫/化銀/OSP.Dia.1mmCupad,Surfacetreatment:Immersiongold/Immersionsilver/HASL/OSPFigureA-:直徑為3mmSoldermask/黑化或粗糙面.Dia.3mmSoldermask/Blackedorroughsurface.FigureA-:直徑為4.5mm;線寬為1mmCucircle/銅箔加蓋綠漆.Dia.4.5mm,Width1mmCucircle/Cupadcoveredbysoldermask1.2.2上層(TopSide)光學對位記號置放位置,如圖B(FigureB).Positionoffiducialmarkontopside,seeFigureB.FigureB-:光學對位記號置放位置,請按圖面尺寸擺放.ThepositionoffiducialmarkpleasereferstoFigureB.FigureB-:遮光銅箔.(用來遮蓋下層的光學對位記號)為5mm*5mm銅箔大小加蓋綠漆.Shadowpadisusedtocoverthefiducialmarkonlowerlayer.Thesizeofitis5*5mmpadwithsoldermask.FigureB-:平衡銅點.(DummyPad:用來平衡電鍍的區域)其規格由各家板廠自行製訂,但距離V-Cut邊必須1mm開始鋪設,且每條板邊皆須鋪設,鋪設的層數與設計使用層數搭配(如四層板則鋪設四層,二層板則鋪設二層,依此類推)除特殊狀況另由layout工程師提供,否則皆以此規格製作.BalancedCupadisusedtobalancetheelectricalplatingareaandthespecificationisdecidedbyPCBsupplier.ThebalancedCupadhastobearrangedon1mmfromtheV-cutedgeandeverydummyboardhastohaveit.ThelayersofbalancedCupaddependsonhowmanylayersonthisdesign,Forexample,thebalancedCupadisfourlayersifitis4layersPCB.PleasefollowthisspecificationtomakebalancedCupadexceptforlayoutengineerillustratesspecificdesigninadvanceFigureB-:板邊規格一般以10mm設計,若為特殊狀況則以工程圖面製作.Normally,Widthofdummyboardis10mm.Pleasefollowengneeringdrawingifitisspecialcase.1.2.3下層(BottomSide)光學對位記號置放位置,如圖C(FigureC).Positionoffiducialmarkontopside,seeFigureC.規格同上層;光學對位記號及遮光銅箔置放的位置按圖面尺寸擺放.Thespecificationisthesameasitontopside.FiducialmarkandshadowpadarearrangedaccordingtoFigureC.PDF文件使用pdfFactoryPro试用版本创建www.fineprint.cnPCB设计规范PCBlayoutrule.doc(rev4)5另於下層需特別注意,光學對位記號距離平衡銅點至少需2.5mm,如Fig.C.PleasenoticethedistancebetweenfiducialmarkandbalancedCupadhastobeatleast2.5mm,seeFigureC.1.2.4折斷邊之角落導角以半徑4mm原則設計。Theradiusofcorneronbreak-awayis4mm.1.2.5今後各排版圖之折斷邊則以此規格規範(除特殊設計另行規定標示於排版圖上),故於排版圖上不再標示此規格中之尺寸.Thebreak-awaymustmeetthisspecificationanditisunnecessarytobemarkedonpaneldrawing.PDF文件使用pdfFactoryPro试用版本创建www.fineprint.cnPCB设计规范PCBlayoutrule.doc(rev4)6PDF文件使用pdfFactoryPro试用版本创建www.fineprint.cnPCB设计规范PCBlayoutrule.doc(rev4)7PDF文件使用pdfFactoryPro试用版本创建www.fineprint.cnPCB设计规范PCBlayoutrule.doc(rev4)81.3郵票孔設計RoutingTabs五個貫穿孔的郵票孔，其規格如圖所示Fivethroughholesonroutingtab,thespecificationisasbelow：1.4V-形切槽設計V-CutDesign其規格及在PCB上的應用，如圖所示:SpecificationandapplicationonPCBareillustratedonbelow:V-CUTSpecificationFR-4FR-4FR-4T=3.0mm~1.0mmT=0.8mmT=0.6mmt=0.4+/-0.1t=0.3+/-0.1t=0.3+/-0.1CEM-1/FR1/FR2CEM-1/FR1/FR2CEM-1/FR1/FR2CEM-1/FR1/FR2T=1.6mmT=1.2mmT=1.0mmT=0.8mmt=0.7+/-0.1t=0.6+/-0.1t=0.4+/-0.1t=0.4+/-0.1CEM-3CEM-3CEM-3CEM-3T=1.6mmT=1.2mmT=1.0mmT=0