SMT 湿敏元件烘烤 标准

JOINTINDUSTRYSTANDARDHandling,Packing,ShippingandUseofMoisture/ReflowSensitiveSurfaceMountDevicesIPC/JEDECJ-STD-033B.1IncludesAmendment1January2007SupersedesIPC/JEDECJ-STD-033BOctober2005CopyrightAssociationConnectingElectronicsIndustriesProvidedbyIHSunderlicensewithIPCLicensee=SanminaSCICorpSanJose/5964569001NotforResale,09/26/200707:00:25MDTNoreproductionornetworkingpermittedwithoutlicensefromIHS--`,,,``,,```,`,,`,`,,````,,,``-`-`,,`,,`,`,,`---NoticeJEDECandIPCStandardsandPublicationsaredesignedtoservethepublicinterestthrougheliminatingmisunderstandingsbetweenmanufacturersandpurchasers,facilitatinginterchangeabilityandimprovementofproducts,andassistingthepurchaserinselectingandobtainingwithminimumdelaytheproperproductforhisparticularneed.ExistenceofsuchStandardsandPublicationsshallnotinanyrespectprecludeanymemberornonmemberofJEDECorIPCfrommanufacturingorsellingproductsnotconformingtosuchStandardsandPublications,norshalltheexistenceofsuchStandardsandPublicationsprecludetheirvoluntaryusebythoseotherthanJEDECandIPCmembers,whetherthestandardistobeusedeitherdomesticallyorinternationally.RecommendedStandardsandPublicationsareadoptedbyJEDECandIPCwithoutregardtowhethertheiradoptionmayinvolvepatentsonarticles,materials,orprocesses.Bysuchaction,JEDECandIPCdonotassumeanyliabilitytoanypatentowner,nordotheyassumeanyobligationwhatevertopartiesadoptingtheRecommendedStandardorPublication.Usersarealsowhollyresponsibleforprotectingthemselvesagainstallclaimsofliabilitiesforpatentinfringement.ThematerialinthisjointstandardwasdevelopedbytheJEDECJC-14.1CommitteeonReliabilityTestMethodsforPackagedDevicesandtheIPCPlasticChipCarrierCrackingTaskGroup(B-10a)ForTechnicalInformationContact:JEDECSolidStateTechnologyAssociation2500WilsonBoulevardArlington,VA22201Phone[phone]Fax[phone]IPC3000LakesideDriveSuite309SBannockburn,Illinois60015-1249Tel[phone]Fax[phone]PleaseusetheStandardImprovementFormshownattheendofthisdocument.©Copyright2007.JEDECSolidStateTechnologyAssociation,Arlington,Virginia,andIPC,Bannockburn,Illinois.AllrightsreservedunderbothinternationalandPan-Americancopyrightconventions.Anycopying,scanningorotherreproductionofthesematerialswithoutthepriorwrittenconsentofthecopyrightholderisstrictlyprohibitedandconstitutesinfringementundertheCopyrightLawoftheUnitedStates.CopyrightAssociationConnectingElectronicsIndustriesProvidedbyIHSunderlicensewithIPCLicensee=SanminaSCICorpSanJose/5964569001NotforResale,09/26/200707:00:25MDTNoreproductionornetworkingpermittedwithoutlicensefromIHS--`,,,``,,```,`,,`,`,,````,,,``-`-`,,`,,`,`,,`---IPC/JEDECJ-STD-033B.1IncludesAmendment1Handling,Packing,ShippingandUseofMoisture/ReflowSensitiveSurfaceMountDevicesAjointstandarddevelopedbytheJEDECJC-14.1CommitteeonReliabilityTestMethodsforPackagedDevicesandtheB-10aPlasticChipCarrierCrackingTaskGroupofIPCUsersofthisstandardareencouragedtoparticipateinthedevelopmentoffuturerevisions.Contact:JEDEC2500WilsonBoulevardArlington,VA22201Phone[phone]Fax[phone]IPC3000LakesideDrive,Suite309SBannockburn,Illinois60015-1249Tel[phone]Fax[phone]Supersedes:IPC/JEDECJ-STD-033B-October2005IPC/JEDECJ-STD-033A-July2002IPC/JEDECJ-STD-033-April1999JEDECJEP124IPC-SM-786A-January1995IPC-SM-786-December1990ASSOCIATIONCONNECTINGELECTRONICSINDUSTRIES®CopyrightAssociationConnectingElectronicsIndustriesProvidedbyIHSunderlicensewithIPCLicensee=SanminaSCICorpSanJose/5964569001NotforResale,09/26/200707:00:25MDTNoreproductionornetworkingpermittedwithoutlicensefromIHS--`,,,``,,```,`,,`,`,,````,,,``-`-`,,`,,`,`,,`---ThisPageIntentionallyLeftBlankCopyrightAssociationConnectingElectronicsIndustriesProvidedbyIHSunderlicensewithIPCLicensee=SanminaSCICorpSanJose/5964569001NotforResale,09/26/200707:00:25MDTNoreproductionornetworkingpermittedwithoutlicensefromIHS--`,,,``,,```,`,,`,`,,````,,,``-`-`,,`,,`,`,,`---AcknowledgmentMembersoftheJointIPC/JEDECMoistureClassificationTaskGrouphaveworkedtodevelopthisdocument.Wewouldliketothankthemfortheirdedicationtothiseffort.AnyStandardinvolvingacomplextechnologydrawsmaterialfromavastnumberofsources.WhiletheprincipalmembersoftheJointMoistureClassificationWorkingGroupareshownbelow,itisnotpossibletoincludeallofthosewhoassistedintheevolutionofthisStandard.Toeachofthem,themembersoftheJEDECandIPCextendtheirgratitude.IPCPlasticChipCarrierCrackingTaskGroup,B-10aChairmanStevenMartellSonoscan,Inc.JEDECJC14.1CommitteeChairmanJackMcCullenIntelCorporationJEDECJC14ChairmanNickLycoudesFreescaleSemiconductorJointWorkingGroupMembersJasbirBath,SolectronCorporationJamesMarkBird,AmkorTechnologyInc.MichaelW.Blazier,DelphiDelcoElectronicMauriceBrodeur,AnalogDevicesInc.PeterBrooks,AmkorTechnologyRalphCarbone,HewlettPackardCo.HenryCharest,AllegroMicroSystemsInc.JeffreyC.Colish,NorthropGrummanCorporationAndrewCorriveau,CogiscanJ.GordonDavy,NorthropGrummanCorporationWernerEngelmaier,EngelmaierAssociatesL.C.LeoG.Feinstein,LeoFeinsteinAssociateBarryR.Fernelius,AgilentTechnologiesJohnFink,HoneywellSSECCurtisGrosskopf,IBMCorporationJoelHeeb