SMT-01_Introduction_CD

©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaSemiconductorManufacturingTechnologyMichaelQuirk&JulianSerda©October2001byPrenticeHallChapter1IntroductiontotheSemiconductorIndustry©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaObjectivesAfterstudyingthematerialinthischapter,youwillbeableto:1.Describethecurrenteconomicstateandthetechnicalrootsofthesemiconductorindustry.2.Explainwhatisanintegratedcircuit(IC)andlistthefivecircuitintegrationeras.3.Describeawafer,includinghowitislayeredanddescribetheessentialaspectsofthefivestagesofwaferfabrication.4.Stateanddiscussthethreemajortrendsassociatedwithimprovementinwaferfabrication.5.Explainwhatisacriticaldimension(CD)andhowMoore’slawpredictsfuturewaferfabricationimprovement.6.Describethedifferenterasofelectronicssincetheinventionofthetransistoruptomodernwaferfabrication.7.Discussdifferentcareerpathsinthesemiconductorindustry.©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaMicroprocessorChipsPhotocourtesyofAdvancedMicroDevicesPhotocourtesyofIntelCorporationPhoto1.1©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaDevelopmentofanIndustry•IndustryRoots–VacuumTubes–RadioCommunications–MechanicalTabulators–Inventors–Disadvantages•TheSolidState–SolidStatePhysics–TheFirstTransistor–Benefits©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaVacuumTubesPhoto1.2©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaTheSemiconductorIndustryPRODUCTAPPLICATIONSINFRASTRUCTUREConsumers:•Computers•Automotive•Aerospace•Medical•otherindustriesCustomerServiceOriginalEquipmentManufacturersPrintedCircuitBoardIndustryIndustryStandards(SIA,SEMI,NIST,etc.)ProductionToolsUtilitiesMaterials&ChemicalsMetrologyToolsAnalyticalLaboratoriesTechnicalWorkforceColleges&UniversitiesChipManufacturerFigure1.1©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaTheFirstTransistorfromBellLabsPhotocourtesyofLucentTechnologiesBellLabsInnovationsPhoto1.3©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaTheFirstPlanarTransistorFigure1.2©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaCircuitIntegration•IntegratedCircuits(IC)–Microchips,chips–Inventors–BenefitsofICs•IntegrationEras–FromSSItoULSI–1960-2000©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaJackKilby’sFirstIntegratedCircuitPhotocourtesyofTexasInstruments,Inc.Photo1.4©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaTopViewofWaferwithChipsAsingleintegratedcircuit,alsoknownasadie,chip,andmicrochipFigure1.3©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaCircuitIntegrationSemiconductorIndustryTimePeriodNumberofComponentsperChipNointegration(discretecomponents)Priorto19601Smallscaleintegration(SSI)Early1960s2to50Mediumscaleintegration(MSI)1960stoEarly1970s50to5,000Largescaleintegration(LSI)Early1970stoLate1970s5,000to100,000Verylargescaleintegration(VLSI)Late1970stoLate1980s100,000to1,000,000Ultralargescaleintegration(ULSI)1990stopresent1,000,000CircuitIntegrationofSemiconductorsTable1.1©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaULSIChipPhotocourtesyofIntelCorporation,PentiumIIIPhoto1.5©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaICFabrication•Silicon–Wafer–WaferSizes–DevicesandLayers•WaferFab•StagesofICFabrication–Waferpreparation–Waferfabrication–Wafertest/sort–Assemblyandpackaging–Finaltest©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaEvolutionofWaferSize20001992198719811975196550mm100mm125mm150mm200mm300mmFigure1.4©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaDevicesandLayersfromaSiliconChipSiliconsubstratedrainSiliconsubstrateTopprotectivelayerMetallayerInsulationlayersRecessedconductivelayerConductivelayerFigure1.5©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaStagesofICFabricationWaferPreparationincludescrystalgrowing,rounding,slicingandpolishing.WaferFabricationincludescleaning,layering,patterning,etchinganddoping.AssemblyandPackaging:Thewaferiscutalongscribelinestoseparateeachdie.Metalconnectionsaremadeandthechipisencapsulated.Test/Sortincludesprobing,testingandsortingofeachdieonthewafer.FinalTestensuresICpasseselectricalandenvironmentaltesting.Defectivedie1.2.3.ScribelineAsingledieAssemblyPackaging4.5.WafersslicedfromingotSinglecrystalsiliconFigure1.6©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaPreparationofSiliconWafers1.CrystalGrowth2.SingleCrystalIngot3.CrystalTrimmingandDiameterGrind4.FlatGrinding5.WaferSlicing6.EdgeRounding7.Lapping8.WaferEtching9.Polishong10.WaferInspectionSlurryPolishingtablePolishingheadPolysiliconSeedcry