SMT-05_Chemicals_CD

©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaSemiconductorManufacturingTechnologyMichaelQuirk&JulianSerda©October2001byPrenticeHallChapter5ChemicalsinSemiconductorFabrication©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaObjectivesAfterstudyingthematerialinthischapter,youwillbeableto:1.Identifyanddiscussthefourstatesofmatter.2.Describetheimportantchemicalpropertiesrelevanttosemiconductormanufacturing.3.Statehowthedifferentprocesschemicalsarecategorizedandusedinawaferfab.4.Explainhowanacid,baseandsolventareusedinchipmanufacturing.5.Statewhetheragasisabulkorspecialtygasandhoweachtypeofgasisdeliveredandusedinwaferfabrication.©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaPhysicalStatesofMatter+V-VSolidLiquidGasPlasmaFigure5.1©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaPropertiesofMaterialsTemperaturePressureandVacuumCondensationVaporPressureSublimationandDepositionDensitySurfaceTensionThermalExpansionStress©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaPropertiesofMaterialsTemperaturePressureandVacuumCondensationVaporPressureSublimationandDepositionDensitySurfaceTensionThermalExpansionStress©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaTemperatureScalesBoilingpointofwaterFreezingpointofwaterAbsolutezeroRoomtemperatureCelsiusoCKelvinKFahrenheitoF-459-27300273212100373322529877Figure5.2©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaPropertiesofMaterialsTemperaturePressureandVacuumCondensationVaporPressureSublimationandDepositionDensitySurfaceTensionThermalExpansionStress©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaLowtemperatureLowpressure00102040503070800HightemperatureHighpressureVolumeincrease010204050307080MoveablepistonPressureAgainstaContainerWallFigure5.3©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaGaugePressure(psig)VersusAbsolutePressure(psia)150-5-10-15510psia0510202530AtmosphereAtmosphereVacuumpsiGaugePressureAbsolutePressureVacuumpsi15psigFigure5.4©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaStandardAtmosphericPressureatSeaLeveland23CPsig(gauge)0psiPsia(absolute)14.7psiAtmosphere14.7psiInchesofmercury29.92inchesMillimetersofmercury760mmTorr760torrMtorr760,000mtorrBar1.013barMillibar1013mbarPascal101,325pascalUnitsofPressureatSeaLeveland23°CTable5.1©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaPropertiesofMaterialsTemperaturePressureandVacuumCondensationVaporPressureSublimationandDepositionDensitySurfaceTensionThermalExpansionStress©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerda29.92in.(760mm)Airpressure(14.7psi,760torr)SealedglasstubeMercuryBarometeratAtmosphericPressureFigure5.5©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaPropertiesofMaterialsTemperaturePressureandVacuumCondensationVaporPressureSublimationandDepositionDensitySurfaceTensionThermalExpansionStress©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaPropertiesofMaterialsTemperaturePressureandVacuumCondensationVaporPressureSublimationandDepositionDensitySurfaceTensionThermalExpansionStress©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaVaporPressureFigure5.6©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaPropertiesofMaterialsTemperaturePressureandVacuumCondensationVaporPressureSublimationandDepositionDensitySurfaceTensionThermalExpansionStress©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaSublimationDryice(CO2)Figure5.7©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaDepositionWindowWatercrystalsdepositedonexternalwindowpaneFrostbuild-upinfreezingweatherWatervaporFigure5.8©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaPropertiesofMaterialsTemperaturePressureandVacuumCondensationVaporPressureSublimationandDepositionDensitySurfaceTensionThermalExpansionStress©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaDensityofObjectsWoodCorkMetalFigure5.9©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaDensitiesofSomeCommonSubstancesSubstancePhysicalStateDensity(g/cm3)HydrogenGas0.000089OxygenGas0.0014WaterLiquid1.0TableSaltSolid2.16SiliconSolid2.33AluminumSolid2.70GoldSolid19.3Table5.2©2001byPrenticeHallSemiconductorManufacturingTechnologybyMichaelQuirkandJulianSerdaPropertiesofMaterialsTemperaturePressureandVacuumCondensationVaporPressureSublimationandDepositionDensitySurfaceTensionThermalExpansionStress©2001byPrenticeHallSem