SMT_制程一课

SMTManufactureprocessWritebyMOEBG/SMTManufactureEngineer–YxlanTEL:3417SDcardsocketSOPBGAQFNConnecterCrystalDSC-MainboardMaincomponent--BGAchipsetDSC-FPCboardOpticalcomponent--CCDSMTIntroduction•AutomaticSMTline:71lines•Location:Cbuild-Floor2~42Dbuild-Floor3,42Ebuild-Floor2,3,4•Linechange：30mins•ProductionEfficiency：99.5%•Throughrate:88%•DefectPPM:50PPM•Lostrate:0.4%•PCBAaverageoutput:400K/monthControlbyKPISMTprocessPCBAFlowChartPCBPartsPrinterMountReflowSMT•S.M.T:SurfaceMountTechnology•WhatisSMT:GoodPrint,andMountGood!!DIPSONYSIP-950SONYSIP-300SONYSVP-2000TypeStencilsize(mm)PrintdirectionWipePCBsize(mm)PCBThickness(mm)Printprecision(μm)SVP-2000650*550*30Y-dir.Automatic(Wet,Dry&Vacuum)(W)50*(D)50~(W)250*(D)3300.3~1.6±25SIP-950650*550*30X-dir.Automatic(Wet,Dry&Vacuum)(W)50*(D)70~(W)460*(D)3600.3~2.5±12SIP-300650*550*30Y-dir.Automatic(Wet,Dry&Vacuum)(W)50*(D)50~(W)460*(D)5100.4~3.0±20SMTEquipment–Printer(SONY)Solderpastevendor(Lead-freetype)PhotoSuppliersSenjuSenjuTypeM705-GRN360-K2-VL23-BLT5-T7FPowderalloySn96.5/Ag3.0/Cu0.5Sn42/Ag1.0/Bi57Meltpoint217℃138~204℃Powdersize25-36µm25-36µmFluxcontent10.5-12.5%10.0%Viscosity(pa.s)200200Stencildesignrule尺　寸型　材螺丝孔颜　色特殊要求650X550mm30X40mm无无无3、印刷格式刻制方式要求个数非印刷面半刻至少2个1、BGA2、IC、QFP及连接器3、CHIP料1、0.5pitchBGA的开孔直径为0.3mm。2、0.65pitchBGA的开孔直径为0.35mm。3、0.8pitchBGA的开孔直径为0.45mm。4、1.0pitchBGA的开孔直径为0.55mm。5、1.27pitchBGA的开孔直径为0.65mm。1、0.4Pitch的宽度开0.185mm，长度向外加长0.1mm，开成椭圆形。2、0.5Pitch的宽度开0.235mm，长度向外加长0.1mm，开成方形倒圆角。3、0.65Pitch的宽度开0.33mm，长度向外加长0.1mm。4、Pitch〉0.65的IC，长度均向外加长0.1mm，宽度按Pitch的50%－55%取值。1、0201类的Chip料，内距保持在0.23mm，焊盘外三边加大10%，不开防锡珠，四角倒R＝0.05mm的圆角。2、0402类的Chip料，内距保持在0.45mm，焊盘外三边加大10%，不开防锡珠，四角倒R＝0.08mm的圆角。3、0603类的Chip料，内距保持在0.75mm，焊盘外三边加大10%，再开1/3内凹的防锡珠，如图：4、0805及以上的Chip料，内距保持不变，焊盘外三边加大10%，再开1/3内凹的防锡珠。5、二极管类的元件，内距保持不变，焊盘外三边加大10%，不开防锡珠。PCB长对长居中放置一、常规规范1、网框2、Mark点印锡网开口规范　（　□有铅　　■无铅　　□裸铜　）附图二、开口规范长650mma=______b=______PCBba宽550mm直径Y1/3X1/3YXTypePrecision(mm)Speed(sec)ComponentsizeComponentheight(mm)MinPitch(mm)AnglePCBsize(mm)PCBheight(mm)E-1000/11000.060.17Chip0402-□12m㎡1~60.30--360º50*50-460*3600.5-2.6F-1300.060.139Chip0201-□12m㎡1~60.30--360º50*50-460*3600.5-2.6SMT-Mounter(SONY)SMT實裝設備中高速機(SONY)SMT實裝設備汎用機(SONY)TypePrecision(mm)Speed(sec)ComponentsizeComponentheight(mm)MinPitch(mm)AnglePCBsize(mm)PCBheight(mm)E-2000/21000.04Moved:0.6Fixed:1.4Chip2012-□32m㎡250.30--360º50*50-460*3600.5-2.6F-2090.04Moved:0.49Fixed:1.4Chip2012-□32m㎡250.30--360º50*50-460*3600.5-2.6SMT-Mounter(SONY)Mounterfunction•X-YDATA•CAM350editGerberfile•CombinationX-YDataandGerberfilebyCPSNozzleTypenumberAF06021(E&F)AF06042(E&F)AF10071(E&F)AF12082(E&F)AF25200(E&F)Outsidesize0.6mm0.6mm1.0mm1.4mm2.5mmInsidesize0.2mm0.4mm0.7mm1.0mm2.0mmComponent01005,0201RLCchip0402RLCchip0603RLCchip0805RLCchip1208RLCchipTypenumberArticle：Lead-FreeN2ReflowType：NIS-311TR/NIS-2082C/N30-122-RLFCharacteristic：1.TheconsistencyofN2islow-reduce，UsingN2byPSAtocontroloutputandcost2.PPMcontrolsystemtocontroltheconsistencyofO2in500PPM3.UniformheatconvectionmakeBGAandCSPheatcompletely.4.Moreheatingzonecouldofferbettertemperatureprofile(8zonesand12zones)SMT-Reflow(ETC)Method-Reflowprofile(example:Leadfree)25~150℃150~217℃Over217℃Over230℃below217℃Rampup:6℃/sec(max)Rampdown:6℃/sec(max)25℃150℃217℃230℃Pre-heatSoakingReflowCoolingPeaktemp=235~255℃TempTimeSMTprofile–Pre-heatzone•Thisheatingzonecausetheuniform-temperatureinallpartofPCBA,thatcanreducePCBwarped,andavoidsolder-pasteheatingdisproportionallytocausesplashdowntogetanotherfailure•Pre-heatzonetemperaturesetting:(generallysetting,actuallyconstantfollowvendor’sdataspecification)Lead-free–25(roomtemp)~150℃:SMTprofile–Soakingzone•Solder-pasteincludesolderalloyandFlux.•Commonly,FluxcontentincludeRosin,Activation,Solvent,andRchologicaladdition.•Flux-heatingcancausethecontentofFluxdeoxidizesoldertoraisethesolderingofthejoint.•Soakingzonetemperaturesetting:(generallysetting,actuallyconstantfollowvendor’sdataspecificationLead-free–150℃~220℃:SMTprofile–Reflowzone•IntheReflowzone,solder-jointcomesintobeingInterface-alloy,thatbecausemostofmetalbecomesbeingmelting.•Peaktemperatureisinthiszone,thatisthehighesttemperatureintheprofile.•Generally,inthiszone(230℃topeaktemp)meanssolderalloyisinthemeltingstatesanddifferentmetalsarebecominginterface-alloy.•Sometimes,wecanraisetheofthiszonetoreducevoidoccurratio.•Reflowzonetemperaturesetting:(generallysetting,actuallyconstantfollowvendor’sdataspecification)Lead-free–Over220℃Peaktemp:235~255℃•InIPC610-D,solder-jointmusttobebright,shineandsmooth.•Wheninterface-alloycoagulated,therampdownratio(coolingrate)ismorefast,thatcausealloyatomicbondbecomesmoretightly,thatcausesoldersurfaceismoreshineandsmooth.•Coolingzonetemperaturesetting:(generallysetting,actuallyconstantfollowvendor’sdataspecification)Lead-free–Rampdownratio:≦6℃/secSMTprofile–CoolingzoneProfilelimitSolder-PasteMpt:217~220℃Reflowpeaktemp:235~255℃Reflowzone(over220℃):60~90secTemperatureprofileboard•Sixmeasurepoint(foractualPCBstates)•Temppoint:criticalpartsExp:BGA,IC,SDConnector•Connectthethermalcoupletomeasureprofil