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SMT专业术语我这里有一些关于SMT的专业术语，和大家分享。AI:Auto-Insertion自動插件AQL:acceptablequalitylevel允收水準ATE:automatictestequipment自動測試ATM:atmosphere氣壓BGA:ballgridarray球形矩陣CCD:chargecoupleddevice監視連接元件(攝影機)CLCC:Ceramicleadlesschipcarrier陶瓷引腳載具COB:chip-on-board晶片直接貼附在電路板上cps:centipoises(黏度單位)百分之一CSB:chipscaleballgridarray晶片尺寸BGACSP:chipscalepackage晶片尺寸構裝CTE:coefficientofthermalexpansion熱膨脹系數DIP:dualin-linepackage雙內線包裝(泛指手插元件)FPT:finepitchtechnology微間距技術FR-4:flame-retardantsubstrate玻璃纖維膠片(用來製作PCB材質)IC:integratecircuit積體電路IR:infra-red紅外線Kpa:kilopascals(壓力單位)LCC:leadlesschipcarrier引腳式晶片承載器MCM:multi-chipmodule多層晶片模組MELF:metalelectrodeface二極體MQFP:metalizedQFP金屬四方扁平封裝NEPCON:NationalElectronicPackageandProductionConference國際電子包裝及生產會議PBGAlasticballgridarray塑膠球形矩陣PCBrintedcircuitboard印刷電路板PFColymerflipchipPLCClasticleadlesschipcarrier塑膠式有引腳晶片承載器Polyurethane聚亞胺酯(刮刀材質)ppmartspermillion指每百萬PAD(點)有多少個不良PAD(點)psiounds/inch2磅/英吋2PWBrintedwiringboard電路板QFP:quadflatpackage四邊平坦封裝SIP:singlein-linepackageSIR:surfaceinsulationresistance絕緣阻抗SMC:SurfaceMountComponent表面黏著元件SMD:SurfaceMountDevice表面黏著元件SMEMA:SurfaceMountEquipmentManufacturersAssociation表面黏著設備製造協會SMT:surfacemounttechnology表面黏著技術SOIC:smalloutlineintegratedcircuitSOJ:smallout-linej-leadedpackageSOP:smallout-linepackage小外型封裝SOT:smalloutlinetransistor電晶體SPC:statisticalprocesscontrol統計過程控制SSOP:shrinksmalloutlinepackage收縮型小外形封裝TAB:tapeautomaticedbonding帶狀自動結合TCE:thermalcoefficientofexpansion膨脹(因熱)係數Tg:glasstransitiontemperature玻璃轉換溫度THD:Throughholedevice須穿過洞之元件(貫穿孔)TQFP:tapequadflatpackage帶狀四方平坦封裝UV:ultraviolet紫外線uBGA:microBGA微小球型矩陣cBGA:ceramicBGA陶瓷球型矩陣PTH:PlatedThruHole導通孔IAInformationAppliance資訊家電產品MESH網目OXIDE氧化物FLUX助焊劑LGA(LandGridArry)封裝技術LGA封裝不需植球，適合輕薄短小產品應用。TCP(TapeCarrierPackage)ACFAnisotropicConductiveFilm異方性導電膠膜製程Soldermask防焊漆SolderingIron烙鐵Solderballs錫球SolderSplash錫渣SolderSkips漏焊Throughhole貫穿孔Touchup補焊Briding穚接(短路)SolderWires焊錫線SolderBars錫棒GreenStrength未固化強度(紅膠)TransterPressure轉印壓力(印刷)ScreenPrinting刮刀式印刷SolderPowder錫顆粒Wettengability潤濕能力Viscosity黏度Solderability焊錫性Applicability使用性Flipchip覆晶DepanelingMachine組裝電路板切割機SolderRecoverySystem錫料回收再使用系統WireWelder主機板補線機X-RayMulti-layerInspectionSystemX-Ray孔偏檢查機BGAOpen/ShortX-RayInspectionMachineBGAX-Ray檢測機PrepregCopperFoilSheeterP.P.銅箔裁切機FlexCircuitConnections軟性排線焊接機LCDReworkStation液晶顯示器修護機BatteryElectroWelder電池電極焊接機PCMCIACardWelderPCMCIA卡連接器焊接LaserDiode半導體雷射IonLasers離子雷射Nd:YAGLaser石榴石雷射DPSSLasers半導體激發固態雷射UltrafastLaserSystem超快雷射系統MLCCEquipment積層元件生產設備GreenTapeCaster,Coater薄帶成型機ISOStaticLaminator積層元件均壓機GreenTapeCutter元件切割機ChipTerminator積層元件端銀機MLCCTester積層電容測試機ComponentsVisionInspectionSystem晶片元件外觀檢查機高壓恆溫恆濕壽命測試機HighVoltageBurn-InLifeTester電容漏電流壽命測試機CapacitorLifeTestwithLeakageCurrent晶片打帶包裝機TapingMachine元件表面黏著設備SurfaceMountingEquipment電阻銀電極沾附機SilverElectrodeCoatingMachineTFT-LCD(薄膜電晶體液晶顯示器)筆記型用STN-LCD(中小尺寸超扭轉向液晶顯示器行動電話用PDA(個人數位助理器)CMP(化學機械研磨)製程研磨液(Slurry)，CompactFlashMemoryCard(簡稱CF記憶卡)MP3、PDA、數位相機DataplayDisk(微光碟)。交換式電源供應器(SPS)專業電子製造服務(EMS)，PCB高密度連結板（HDIboard，指線寬／線距小於4／4mil）微小孔板（Micro-viaboard），孔俓5-6mil以下水溝效應（PuddleEffect）：早期大面積鬆寬線路之蝕刻銀貫孔(STH)銅貫孔(CTH)組裝電路板切割機DepanelingMachineNONCFC＝無氟氯碳化合物。Supportpin＝支撐柱F.M.＝光學點ENTEK裸銅板上塗一層化學藥劑使PCB的pad比較不會生鏽QFD：品質機能展開PMT：產品成熟度測試ORT：持續性壽命測試FMEA：失效模式與效應分析TFT-LCD(薄膜電晶體液晶顯示器)(Liquid-CrystalDisplaysAddressedbyThin-FilmTransistors)導線架（LeadFrame）：單體導線架（DiscreteLeadFrame）及積體線路導線架（ICLeadFrame）二種ISP的全名是InternetServiceProvider，指的是網際網路服務提供ADSL即為非對稱數位用戶迴路數據機SOP:StandardOperationProcedure（標準操作手冊）DOE:DesignOfExperiment（實驗計劃法）打線接合（WireBonding）捲帶式自動接合（TapeAutomatedBonding,TAB）覆晶接合（FlipChip）品質規範:JIS日本工業標準ISO國際認證M.S.D.S國際物質安全資料FLUXSIR加溼絕緣阻抗值1.RMA(ReturnMaterialAuthorization)維修作業意指產品售出後經由客戶反應發生問題的不良品維修及分析。Automaticopticalinspection(AOI自動光學檢查)