SMT作业指导

CH-0Slide-1PlacementModuleTraining-IntelConfidential(forinternalusageonly)PlacementModuleCoursedescriptionCoursecodePNG-021935CH-0Slide-2PlacementModuleTraining-IntelConfidential(forinternalusageonly)PlacementModuleCoursedescriptionTargetaudience:CMEorCQEthatwillengagecustomerissuesCH-0Slide-3PlacementModuleTraining-IntelConfidential(forinternalusageonly)PlacementCourseDescriptionCh-0:CourseDescription[5min]Ch1:PlacementModuleOverview[30min]•Describeplacementmodulefunctionalityandfeatures•Definedifferenttypesofplacementequipmentsavailable•DescribetheplacementmainsystemsUnderstandtheplacementmodulefuturekeychallengesCh2:SPECOVERVIEW[15min]•Findtheappropriatespecfortheplacementmodule.•Navigatethroughthespecanduseitasareferencedocument.•EducatehowtounderstandIntelprocessandappliedtheknowledgewhendealingwithcustomers.Ch-3:ProcessControlSystem[20min]•UnderstandwhatisProcessControlSystem•IdentifyprocesscontrolsystemusedbyplacementmoduleownerCH-0Slide-4PlacementModuleTraining-IntelConfidential(forinternalusageonly)PlacementCourseDescriptionCh4:CriticaltoFunctionParameter(CTFP)[20min]IdentifymajorparameterusedfortheplacementmoduleDefinetheimpactofthemajorparameterCh5:ResponseFlowChecklist(RFC)&CommonFailuremodes[15min]•Identifycommonfailuremodesforplacementmodule•DescribehowtosolveplacementissuesCh6:CASESTUDYONSJR[15min]•TohavebasicunderstandingonBGASJRintermsoffailuremodesandpotentialrootcauses.•TodevelopCQEcompetencyinprovidingsomesolutionsorprelimdatacollectiononBGASJRrelatedissues.GlossaryCH-0Slide-5PlacementModuleTraining-IntelConfidential(forinternalusageonly)PlacementModuleChapter1CH-0Slide-6PlacementModuleTraining-IntelConfidential(forinternalusageonly)PlacementCourseDescriptionOBJECTIVES:Uponcompletionofthistopic,theparticipantwillbeabletodothefollowing:•Describeplacementmodulefunctionalityandfeatures•Definedifferenttypesofplacementequipmentsavailable•DescribetheplacementmainsystemsUnderstandtheplacementmodulefuturekeychallengesIntelMalaysiaTechnicalTrainingwebsitehttp://pgswebtrg01/hrtweb/index.aspCH-0Slide-7PlacementModuleTraining-IntelConfidential(forinternalusageonly)Topick&placeSurfaceMountTechnology(SMT)componentsaccuratelyatpredefinedlocationonPrintedCircuitBoard(PCB)surfaceintheautomatedprogrammablesequencesNozzleCH-0Slide-8PlacementModuleTraining-IntelConfidential(forinternalusageonly)2typesofPlacementequipmentsingeneral:ChipShooterForsmallinexpensivecomponentplacementwithhighspeedFinePitchPlacerForfinepitchQFP&BGAcomponentplacementwithmediumtohighspeedNo.ComparisonItemsChipShooterFinePitchPlacer1ComponentSizeSmall=MediumMedium=Large2ComponentTypeDiscreetpassive,SOT,SOICFinepitchQFP,BGA,CSP3PlacementSpeedFastMedium4AccuracyMedium(+/-0.1mm/4mils)High(+/-0.025mm/1mils)CH-0Slide-9PlacementModuleTraining-IntelConfidential(forinternalusageonly)UniversalGSMPhillipsTopazFujiCP7SanyoPanasonicMSFChipShooterFinePitchPlacerPanasonicMSRPanasonicMPAGJukiKE2060UniversalHSPFujiXPFujiQPFujiXPPhillipsAssembleonFCMPhillipsAssembleonACMSiemensHSCH-0Slide-10PlacementModuleTraining-IntelConfidential(forinternalusageonly)TurretHeadPartSupplyNozzleCameraTape&ReelFeederNozzleHeadTrayCH-0Slide-11PlacementModuleTraining-IntelConfidential(forinternalusageonly)CHIPResistorCHIPCapacitorSOICSmallOutlineIntegratedCircuitQFPQuadFlatPackRectangularTSOPTypeIIThinSmallOutlinePackageDRAMSmallOutlineJLeadedCH-0Slide-12PlacementModuleTraining-IntelConfidential(forinternalusageonly)Simple,EasytoUseConsistentSampleHandlingLowCostReliableCompetitiveAdvantageGreaterThroughputIncreasedProductivitySmallFootprintCH-0Slide-13PlacementModuleTraining-IntelConfidential(forinternalusageonly)LocatedafterthesolderpastemoduleinSMTprocessPlaceComponentFinalAssemblyScreenPrintSolderPasteReflowSolderWaveSolderingTestProbeComponentTestPackCH-0Slide-14PlacementModuleTraining-IntelConfidential(forinternalusageonly)Whichonebelowisnotthetypeofcomponentsplacedbyplacementequipment?1:SOIC2:QFP3:THM3:THMCH-0Slide-15PlacementModuleTraining-IntelConfidential(forinternalusageonly)No.SystemPurposeVariables1ConveyorTotransportboardsin&outforpartplacementIn,Main,Out2PartSupplyTofeedpartforpick&placeTape&Reel,Tray,Bulk,Tube3Pick&PlaceTopick&placepartonboardsTurret,OverheadGantry,MassiveParallel4VisionTorecognize&alignpartsBacklight,Frontlight,SideChipShooterPartSupplyFinePitchPlacerCH-0Slide-16PlacementModuleTraining-IntelConfidential(forinternalusageonly)No.ItemsTape&ReelTrayTubeBulk1ComponentTypePassives,SOIC,PLCCLeaded,BGA,CSPPLCC,SOICPassives2ComponentQuantityLarge(10K-15K)Medium(8-150parts/tray)Least(10-20parts/tube)VeryLarge(10-30K)3UsageHVMHVM/DevelopmentDevelopmentHVM4BeatrateHighMediumLowHigh4typesofpartsupplysystemingeneral:Tape&ReelTrayTubeBulkCH-0Slide-17PlacementModuleTraining-IntelConfidential(forinternalusageonly)FeederTable3typesofpick&placesystemsingeneral:(1)TraditionalTurretSystemAseriesofidenticalrotatingheads(2)TraditionalGantry-StylePick&PlaceEmployX&Y-axisbeamstomoveaplacementheadtoaspecifi