SMT元器件知识

元器件知识SMT元器件参照GVC品质检验规范制作人：陈生1.各接腳都能座落在各焊墊的中央，而未發生偏滑。1.Alltheleadsfootprintiscenteredonthelands理想状况TargetConditionWSX≦1/2WS≧5mil1.各接腳已發生偏滑，所偏出焊墊以外的接腳，尚未超過接腳本身寬度的1/2W。(X≦1/2W)2.偏移接腳之邊緣與焊墊外緣之垂直距離≧5mil(0.13mm)。(S≧5mil)1.Thelengthoftheleadfootprintshiftedofftheland(X)shallless1/2widthoflead2.Theclearance(S)betweenleadshiftedoffandlandshallover5mil允收状况1AcceptCondition拒收状况1RejectConditionX1/2WS＜5mil1.各接腳已發生偏滑，所偏出焊墊以外的接腳，已超過接腳本身寬度的1/2W(MI)。(X＞1/2W)2.偏移接腳之邊緣與焊墊外緣之垂直距離＜5mil(0.13mm)(MI)。(S＜5mil)3.Whicheverisrejected.1.各接腳已發生偏滑，所偏出焊墊以外的接腳，尚未超過焊墊側端外緣。1.Theleadhadshiftedandfootprintnotovertheendofland允收状况2AcceptCondition拒收状况2RejectCondition已超過焊墊側端外緣1.各接腳側端外緣，已超過焊墊側端外緣(MI)。1.Theleadhadshiftedandfootprinthadovertheendofland(MI)理想状况TargetConditionTX1.各接腳都能座落在各焊墊的中央，而未發生偏滑。1.Alltheleadsfootprintiscenteredonthelands允收状况3AcceptConditionTX≧T1.各接腳已發生偏滑，腳跟剩餘焊墊的寬度，最少保有一個接腳厚度(X≧T)。1.Theleadhadshiftedthelengthfromleadheeltoendofland(X)shallbeoverthethicknessofland(T)TX＜T1.各接腳己發生偏滑，腳跟剩餘焊墊的寬度，已小於接腳厚度(XT)(MI)。拒收状况3RejectConditionSW1.各接腳都能座落在焊墊的中央，未發生偏滑。1.Alltheleadsfootprintiscenteredonthelands理想状况TargetCondition1.各接腳已發生偏滑，所偏出焊墊以外的接腳，尚未超過接腳本身寬度的1/2W。(X≦1/2W)2.偏移接腳之邊緣與焊墊外緣之垂直距離≧5mil(0.13mm)以上。(S≧5mil)Theleadhadshiftedofftheland1.Thelengthofleadshiftedofftheland(X)shallless1/2widthoflead(W)2.Theclearancedistancebetweenshiftedleadandlandedgeshallover5milX≦1/2WS≧5mil允收状况4AcceptCondition拒收状况4RejectConditionS5milX1/2W1.各接腳已發生偏滑，所偏出焊墊以外的接腳，已超過接腳本身寬度的1/2W(MI)。(X＞1/2W)2.偏移接腳之邊緣與焊墊外緣之垂直距離＜5mil(0.13mm)以下(MI)。(S＜5mil)3.Whicheverisrejected.理想状况TargetCondition1.引線腳的側面,腳跟吃錫良好2.引線腳與板子焊墊間呈現凹面焊錫帶。3.引線腳的輪廓清楚可見。1.sidefaceandfootprinthavegoodsolderfillet2.concavefilletbetweenlandandlead3.theshape(profile)ofleadbeclearlyvisible允收状况5AcceptConditionLX=2/3Lh≧1/2TT1.引線腳的底邊與板子焊墊間的銲錫帶至少涵蓋引線腳長的2/3L以上。2.腳跟(Heel)焊錫帶涵蓋高度h大於零件腳1/2厚度。(h≧1/2T)。3.腳跟(Heel)沾錫角需90度。1.Widthofsolderfilletbetweenleadandland(X)shallover2/3leadfootprint(L)2.Minimumsolderfilletflowsupendmorethan1/2thicknessofleadonheel3.Wettingangle＜90∘onheel拒收状况5RejectConditionLX2/3Lh1/2TT1.引線腳的底邊與板子焊墊間的銲錫帶不足涵蓋引線腳長的2/3L。2.腳跟(Heel)焊錫帶涵蓋高度h小於零件腳1/2厚度(h1/2T)。3.腳跟(Heel)沾錫角≧90度。(MI)4.Whicheverisrejected.理想状况TargetCondition1.引線腳的側面,腳跟吃錫良好。2.引線腳與板子焊墊間呈現凹面焊錫帶。3.引線腳的輪廓清楚可見。1.sidefaceandfootprinthavegoodsolderfillet2.concavefilletbetweenlandandlead3.theshape(profile)ofleadbeclearlyvisible允收状况6AcceptCondition1.引線腳與板子焊墊間的焊錫連接很好且呈一凹面焊錫帶。2.引線腳的側端與焊墊間呈現稍凸的焊錫帶。3.引線腳的輪廓可見。1.Goodsolderflowupandconcavefilletbetweenlandandlead2.Concavesolderfilletbetweensidefaceofleadandland3.Theshape(profile)oflead(footprint)beclearlyvisible拒收状况6RejectCondition1.焊錫帶延伸過引線腳的頂部(MI)。2.引線腳的輪廓模糊不清(MI)。3.Whicheverisrejected.1.solderflowcovertheend(TIP)oflead2.Theshape(profile)ofleadnotbevisibleclearly3.Whicheverisrejected理想状况TargetConditionATB1.凹面焊錫帶存在於引線的四側2.焊錫帶延伸到引線彎曲處兩側的頂部(A,B)。3.引線的輪廓清楚可見。4.所有的錫點表面皆吃錫良好。1.Solderconcavefilletonthe4faceoflead2.solderflowuptotheanglehighpointA,B3.Leadshape(profile)canbeclearlyvisible4.Goodsolderingjointateverysoldercontacth≧1/2T允收状况7AcceptCondition1.焊錫帶存在於引線的三側2.焊錫帶涵蓋引線彎曲處兩側的50%以上(h≧1/2T)。1.Solderconcavefilletonthe3faceoflead2.Heightofsolderflow-upontheleadangle(h)shallover1/2angleheight(T)拒收状况7RejectConditionh1/2T1.焊錫帶存在於引線的三側以下(MI)。2.焊錫帶涵蓋引線彎曲處兩側的50%以下(h1/2T)(MI)。3.Whicheverisrejected.1.Solderconcavefilletisless3face2.Heightofsolderflow-upontheleadangle(h)under1/2angleheight(T)3.Whicheverisrejected理想状况TargetConditionABDC1.腳跟的焊錫帶延伸到引線上彎曲處底部(B)與下彎曲處頂部(C)間的中心點。註：Ａ：引線上彎頂部Ｂ：引線上彎底部Ｃ：引線下彎頂部Ｄ：引線下彎底部1.SolderflowuptothecenterbetweenB,Cpointontheheeloflead允收状况8AcceptCondition1.腳跟的焊錫帶已延伸到引線上彎曲處的底部(B)。1.solderflowuptoBpointontheheel拒收状况8RejectCondition1.腳跟的焊錫帶延伸到引線上彎曲處的底部(B)，延伸過高，且沾錫角超過90度，才拒收(MI)。1.Solderflowupover(cross)Bpointandthewettingangleover90degree沾錫角超過90度理想状况TargetConditionAB1.凹面焊錫帶存在於引線的四側2.焊錫帶延伸到引線彎曲處兩側的頂部(A,B)。3.引線的輪廓清楚可見。4.所有的錫點表面皆吃錫良好。1.Solderconcavefilletonthe4faceoflead2.solderflowuptotheanglehighpointA,B3.Leadshape(profile)canbeclearlyvisible4.Goodsolderingjointateverysoldercontact允收状况9AcceptCondition1.凹面焊錫帶延伸到引線彎曲處的上方,但在組件本體的下方。2.引線頂部的輪廓清楚可見。1.Solderflowuptotopofleadangleandnottouchthebody2.Shape(profile)ofleadanglecanbevisibleclearly拒收状况9RejectCondition1.焊錫帶接觸到組件本體(MI)。2.引線頂部的輪廓不清楚(MI)。3.錫突出焊墊邊(MI)。4.Whicheverisrejected.1.Solderhadtouchedthebody2.Shape(profile)ofleadanglecannotbevisibleclearly3.Excesssolderonthesideofsolderland理想状况TargetConditionT1.焊錫帶是凹面並且從晶片端電極底部延伸到頂部的2/3T以上。2.錫皆良好地附著於所有可焊接面。1.Solderflowupfromland(bottomofcomponentsolderterminationtothe2/3Heightofcomponent(T)2.Goodsolderfilletontheallsolderableterminations(face)允收状况10AcceptConditionh≧1/4TX≧1/4T1.焊錫帶延伸到晶片端電極高度的25%以上。(h≧1/4T)2.焊錫帶從晶片外端向外延伸到焊墊的距離為晶片高度的25%以上。(X≧1/4H)1.1/4componentheightbefilletbysolderatleast2.Solderflowspreadonthelandshall1/4widthofcomponentheightatleast,(Countfromtipofcomponent)拒收状况10RejectConditionh1/4TX1/4T1.焊錫帶延伸到晶片端電極高度的25%以下(MI)。(h＜1/4T)2.焊錫帶從晶片外端向外延伸到焊墊端的距離為晶片高度的25%以下(MI)。(X＜1/4T)3.Whicheverisrejected.理想状况TargetCondition1.焊錫帶是凹面並且從晶片端電極底部延伸到頂部的2/3T以上。2.錫皆良好地附著於所有可焊接面。1.Solderflowupfromland(bottomofcomponents