SMT培训教材--zal52635044

:luckfang1SMTTrainingMaterial:luckfang2内容简介WHAT’SSMT???常用术语电子元件知识工艺流程介绍焊锡膏基础知识助焊剂介质(Fluxmedium)金属颗粒印刷回流温度曲线故障分析使用注意事项:luckfang3WHAT’SS.M.T???What’sS.M.T.????SurfaceMountingTechnologyS.M.DevicesS.M.AssemblyS.M.Machine:luckfang4电子元件知识片式电阻-ChipResistor片式电容-ChipCapacitorSOT.:SmallOutlineTransistorSOD.:SmalloutlineDiode钽电容-Solidtantalumcapacitorschips圆柱体二级管-MELF排阻-ChipArrayResistor铝电容-AluminiumelectrolyticSMDcapacitors电感-chipsInductors电源TR-PowerTransistor:luckfang5电子元件知识微调器SOP.:SmallOutlinepackageQFP.:QuadFlatPackageTQFP.:ThinSmallOutlinePackagePLCC.:PlasticleadedChipCarrierTSOP.:ThinSmallOutlinePackageCSP.:ChipScalePackageBGA.:BallGridArrayCONNECTOR:luckfang6Chipoutlinedescription-元件尺寸SizeL*W(inch)SizeL*W(mm)02010.02*0.0105030.5*0.2504020.04*0.0210051.0*0.506030.06*0.0316081.5*0.7608050.08*0.0520122.0*1.2512060.12*0.0632163.2*1.612100.12*0.132253.2*2.5:luckfang7SMDComponentsShape-元件外形Chip0603SolidtantalumcapacitorschipsAluminiumelectrolyticSMDcapacitorsSOT23SOT143SOT223SOIC’sSOJIC’sPLCCIC’sQFPIC’sBGAIC’s:luckfang8Humiditycontrollevel-湿度控制等级(LEVELdefinedbyIPC/JEDECJ-STD-020)LevelTemp./HumidityExposuretime1=30degree/85%Unlimited2=30degree/60%1Year2a=30degree/60%4Weeks3=30degree/60%1Week4=30degree/60%72Hrs.(3d.)5=30degree/60%48Hrs.5a=30degree/60%24Hrs.6Devicesrequiredbakingbeforeuse,oncebaked,mustbereflowedwithin6Hrs.:luckfang9SMTprocessflowchart-工艺流程:luckfang10SMT常用术语PCB-PrintCircuitBoard印刷电路板ESD-ElectrostaticSensitiveDevices静电放电PPM-DefectsperMillion每百万的坏点SPC-StatisticProcessControl-过程统计分析Iron-电烙铁HotAirReflowingNoozle-热风嘴TinExtractor-吸锡器SolderingWick-吸锡带Post-SolderingInspection-焊后检验VisualInspection-目视检验:luckfang11SMT常用术语AOI-AutomatedOpticalInspection自动光学检查AXI,AutomatedX-rayInspection-自动X射线检查SolderingJointQuality-焊点质量SolderingJointDefect-焊点缺陷SolderWrong-错焊SolderSkips-漏焊PseudoSoldering-虚焊ColdSoldering-冷焊SolderBridge-桥焊Opensoldering-脱焊:luckfang12SMT常用术语Solder-Off-焊点剥离SolderNonwetting-不湿润焊点SolderingBalls-锡珠Icicle/SolderProjection-拉尖Void-孔洞SolderWicking-焊料爬越OverheatedSolderConnection-过热焊点:luckfang13SMT常用术语InsufficientSolderConnection-不饱和焊点ExcessSolderConnection-过量焊点FluxResidue-助焊剂剩余SolderCrazeing(Tearing)-焊料裂纹Fillet-Lifting,Lift-Off-焊角翘离Loader-上板机Unloader-下板机Dispenser-滴涂器,点胶机:luckfang14SMT常用术语VacuumPick&PlaceTool-真空吸笔PlaceMachine,Pick&PlaceMachine,ChipMounter,ChipShooter-贴片机WaveSolderingSystems-波峰焊机ReflowSolderingSystems,ReflowOven-再流焊炉Self-Alignment-自定位Skewing-位移:luckfang15SMT常用术语TombStone-立碑Flying-掉片ICT,InCircuitTesting-在线测试FT,FunctionalTesting-功能测试ReworkStation-返工工作台CleaningSystems-清洗机:luckfang16焊锡基本知识助焊剂介质(Fluxmedium)金属颗粒:luckfang17合金:合金是两种或两种以上的金属形成的化合物,焊锡膏技术中所含的金属成份通常为:锡(Sn),铅(Pb),银(Ag),铜(Cu):luckfang18软焊接无金属熔融结合金属键化合物(intermetalliclayer)Cu3SnTin/lead63/37alloyCu3SnandCu6Sn5IntermetallicFluxlayer:luckfang19普通的焊盘材料铜及其合金电镀铜,黄铜,青铜有机镀膜焊盘(OSP)镍及其合金铁镍钴合金银和金:luckfang20CU焊盘Goldovernicklepads阻焊膜典型多层FR4PCBSnorAgpads:luckfang21PCBrawmaterial-PCB原材料MaterialBrandreferencePCBtechnologyUtilizationThickness(mm)PhenolicpaperlaminateFR1,FR2*Standard(Singleordoublesided)TVchassisSimplemodules1.6±0.141.5±0.141.2±0.1PolyesterglasslaminateCEM3'TStandard(Singleordoublesided)Tuners1.2±0.11.0±0.1Epoxypaper/glasslaminateCEM1StandardSingleordoublesidedSPTHHighendTVchassisModules1.6±0.141.5±0.14EpoxyglasslaminateFR4DSPTHMultilayers(4to6)TunerHighendmodules&TVchassis,chassisfordigitalproductsChassis&modulesfordigitalproducts1.0±10%1.5±10%1.6±10%1.6±10%:luckfang22基材金属键化合物CuCu6Sn5AgAg3SnAuAuSn4NiNi3Sn4焊接::luckfang23焊点的截面图(Sn63/Pb37锡膏与铜):luckfang24锡膏是将锡粉颗粒与介质(Fluxmedium)充分混合所形成的一种膏状物质,这种膏状物质具有可印刷或点滴的能力.什么是锡膏??:luckfang25锡膏主要成分锡粉颗粒金属(合金)助焊剂介质(FluxMedium)活性剂松香,树脂粘度调整剂溶剂:luckfang26合金选择指南PCBA常用锡膏合金合金代号熔点备注Sn/PbSn63183*通用型Sn/Pb/AgSn62179*通用型含银锡膏Sn/Pb/Ag63S4179-183防立碑特色锡膏Sn/AgSn96221*无铅,LeadFreeSn/Ag/Cu99C227*无铅,LeadFreeSn/Ag/Cu96S