sd卡,mmc卡_mcu说明资料

SDCardAssociationSDMemoryCardSpecificationsPHYSICALLAYERSPECIFICATIONPart1April152001SDGroupMatsushitaElectricIndustrialCo.,Ltd.(MEI)SanDiskCorporationToshibaCorporationVersion1.01CONFIDENTIALSimplifiedVersionof:SDCardAssociationDONOTCOPY(c)2000(c)2001bySDGroup(MEI,SanDisk,Toshiba)2SimplifiedVersionDate:April2001SD-MemoryCardSpecifications/Part1.PhysicalLayerSpecification;Version1.01RevisionHistoryDateVersionChangescomparedtopreviousissueMarch22th,20001.0BaseversionApril15th,20011.01DetaileddescriptionoftherevisionhistoryisgiveninthefullversionofSpecVer1.01.Copyright(C)2000(C)2001bySDGroup(MEI,SanDisk,Toshiba)-Confidentiality:Thisdocumentisasimplifiedversionoftheoriginal.ThisversionisnotrequiredtobetreatedasconfidentialandReproductioninwholeorinpartisprohibitedwithoutpriorwrittenpermissionofSDGroup.-Exemption:-PublisherandCopyrightHolder:Nonewillbeliableforanydamagefromuseofthisdocument.Conditionsforpublication:SDGroup(MEI,SanDisk,Toshiba).NonDisclosureAgreementwithneithertheSDGroupnortheSDAisrequired.SDCardAssociationDONOTCOPY(c)2000(c)2001bySDGroup(MEI,SanDisk,Toshiba)3SimplifiedVersionDate:April2001SD-MemoryCardSpecifications/Part1.PhysicalLayerSpecification;Version1.011Generaldescription-42Systemfeatures-63SDMemoryCardSystemConcept-73.1BusTopology-73.1.1SDbus-83.1.2SPIbus-193.2BusProtocol-103.2.1SDbus-103.2.2SPIBus-133.3SDMemoryCard-PinsandRegisters-153.4CompatibilitytoMultiMediaCard-174SDMemoryCardFunctionalDescription-205CardRegisters-206SDMemoryCardHardwareInterface-207SPIMode-208SDMemoryCardmechanicalspecification-218.1Cardpackage-218.1.1Externalsignalcontacts(ESC)-218.1.2Designandformat-228.1.3Reliabilityanddurability-228.1.4ElectricalStaticDischarge(ESD)Requirements-238.1.5Qualityassurance-238.2Mechanicalformfactor-248.3System:cardandconnector-278.3.1Cardhotinsertion-278.3.2Inverseinsertion-278.3.3CardOrientation-288.4Thin(1.4mm)SDMemoryCard(Preliminary)-289Appendix-3110Abbreviationsandterms-32SDCardAssociationDONOTCOPY(c)2000(c)2001bySDGroup(MEI,SanDisk,Toshiba)4SimplifiedVersionDate:April2001SD-MemoryCardSpecifications/Part1.PhysicalLayerSpecification;Version1.01Generaldescription1GeneraldescriptionSDMemoryCard(SecureDigitalMemoryCard)isamemorycardthatisspecificallydesignedtomeetthesecurity,capacity,performanceandenvironmentrequirementsinherentinnewlyemergingaudioandvideoconsumerelectronicdevices.TheSDMemoryCardwillincludeacopyrightprotec-tionmechanismthatcomplieswiththesecurityoftheSDMIstandardandwillbefasterandcapableforhigherMemorycapacity.TheSDMemoryCardsecuritysystemusesmutualauthenticationandanewcipheralgorithmtoprotectfromillegalusageofthecardcontent.Anonesecuredaccesstotheuser‘sowncontentisalsoavailable.Thephysicalformfactor,pinassignmentanddatatransferprotocolareforwardcompatiblewiththeMultiMediaCardwithsomeadditions.TheSDMemoryCardcommunicationisbasedonanadvanced9-pininterface(Clock,Command,4xDataand3xPowerlines)designedtooperateinatmaximumoperatingfrequencyof25MHzofandlowvoltagerange.Thecommunicationprotocolisdefinedasapartofthisspecification.TheSDMemoryCardhostinterfacesupportsregularMultiMediaCardoperationaswell.Inotherwords,MultiMediaCardforwardcompatibilitywaskept.ActuallythemaindifferencebetweenSDMemoryCardandMultiMediaCardistheinitializationprocess.TheSDMemoryCardSpecificationsweredividedtoseveraldocuments.TheSDMemoryCarddocumentationstructureisgiveninFigure1.Figure1:SDMemoryCardDocumentationStructure•SDMemoryCardAudioSpecification:Thisspecificationalongwithotherapplicationspecificationsdescribethespecificationofcertainapplication(inthiscase-AudioApplication)andtherequirementstoimplementit.•SDMemoryCardFileSystemSpecification:DescribesthespecificationofthefileformatstructureofthedatasavedintheSDMemoryCard(inprotectedandun-protectedareas).•SDMemoryCardSecuritySpecification:Describesthecopyrightprotectionmechanismandtheapplicationspecificcommandsthatsupportit.•SDMemoryCardPhysicalLayerSpecification(thisdocument):DescribesthephysicalinterfaceandthecommandprotocolusedbytheSDMemoryCard.ThepurposeoftheSDMemoryCardPhysicalLayerspecificationisthedefinitionoftheSDMemoryCard,itsenvironmentandhandling.Thedocumentissplitupintoseveralportions.Chapter3givesageneraloverviewofthesystemAudioSpecificationotherApplicationDocumentsFileSystemSpecificationSDMemoryCardPhysicalLayerSpec.(ThisDocument)SDMemorySecurityCardSpec.SDCardAssociationDONOTCOPY(c)2000(c)2001bySDGroup(MEI,SanDisk,Toshiba)5SimplifiedVersionDate:April2001SD-MemoryCardSpecifications/Part1.PhysicalLayerSpecification;Version1.01Generaldescriptionconcepts.ThecommonSDMemoryCardcharacteristicsaredescribedinChapter4.Asthisdescriptiondefinesanoverallsetofcardproperties,werecommendtousetheproductdocumenta-tioninparallel.ThecardregistersaredescribedinChapter5.Chapter6definestheelectricalparametersoftheSDMemoryCard’shardwareinterface.Chapter8describesthephysicalandmechanicalpropertiesoftheSDMemoryCardsandthemini-malrecommendationstothecardslotsorcartridges.Asusedinthisdocument,“shall”or“will”denotesamandatoryprovisionofthestandard.“Should”den