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印刷電路板制作流程介紹目錄一、制作流程圖二、前製程治工具製作流程三、多層板制作流程四、干膜制作流程五、多層板疊板及壓合結構流程圖PCBMfg.FLOWCHART一、制作流程圖顧客(CUSTOMER)工程製前(FRONT-ENDDEP.)裁板(LAMINATESHEAR)內層乾膜(INNERLAYERIMAGE)預疊板及疊板(LAY-UP)業務(SALESDEPARTMENT)生產管理(P&MCONTROL)蝕銅(I/LETCHING)鑽孔(PTHDRILLING)壓合(LAMINATION)曝光(EXPOSURE)壓膜(LAMINATION)前處理(PRELIMINARYTREATMENT)顯影(DEVELOPIG)蝕銅(ETCHING)去膜(STRIPPING)黑化處理(BLACKOXIDE)烘烤(BAKING)預疊板及疊板(LAY-UP)壓合(LAMINATION)後處理(POSTTREATMENT)MLB網版製作(STENCIL)圖面(DRAWING)工作底片(WORKINGA/W)製作規範(RUNCARD)程式帶(PROGRAM)鑽孔,成型機(D.N.C.)底片(MASTERA/W)磁片,磁帶(DISK,M/T)藍圖(DRAWING)資料傳送(MODEM,FTP)AOI檢查(AOIINSPECTION)DOUBLESIDE雷射鑽孔(LASERABLATION)BlindedVia通孔電鍍(P.T.H.)液態防焊(LIQUIDS/M)外觀檢查(VISUALINSPECTION)成型(FINALSHAPING)外層乾膜(OUTERLAYERIMAGE)二次銅及錫鉛電鍍(PATTERNPLATING)蝕銅(O/LETCHING)檢查(INSPECTION)噴錫(HOTAIRLEVELING)電測(ELECTRICALTEST)出貨前檢查(OQC)包裝出貨(PACKING&SHIPPING)曝光(EXPOSURE)壓膜(LAMINATION)二次銅電鍍(PATTERNPLATING)錫鉛電鍍(T/LPLATING)去膜(STRIPPING)蝕銅(ETCHING)剝錫鉛(T/LSTRIPPING)塗佈印刷(S/MCOATING)預乾燥(PRE-CURE)曝光(EXPOSURE)顯影(DEVELOPING)後烘烤(POSTCURE)全板電鍍(PANELPLATING)銅面防氧化處理(OSP(EntekCu106A)外層製作(OUTER-LAYER)TENTINGPROCESS鍍金手指(G/FPLATING)鍍化學鎳金(E-lessNi/Au)ForO.S.P.印文字(SCREENLEGEND)除膠渣(DESMER)通孔電鍍(E-LESSCU)前處理(PRELIMINARYTREATMENT)前處理(PRELIMINARYTREATMENT)前處理(PRELIMINARYTREATMENT)全面鍍鎳金(S/GPLATING)顧客CUSTOMER裁板LAMINATESHEAR業務SALESDEP.生產管理P&MCONTROLMASTERA/W底片DISK,M/T磁片磁帶藍圖DRAWING資料傳送MODEM,FTP網版製作STENCILDRAWING圖面RUNCARD製作規範PROGRAM程式帶鑽孔,成型機D.N.C.工程製前FRONT-ENDDEP.工作底片WORKINGA/W二、前製程治工具製作流程3.1外層製作流程3.2外觀及成型製作流程3.3典型多層板製作流程-MLB三、多層板內層製作流程曝光EXPOSURE壓膜LAMINATION前處理PRELIMINARYTREATMENT去膜STRIPPING蝕銅ETCHING顯影DEVELOPING黑化處理BLACKOXIDE烘烤BAKINGLAY-UP預疊板及疊板後處理POSTTREATMENT壓合LAMINATION內層乾膜INNERLAYERIMAGE預疊板及疊板LAY-UP蝕銅I/LETCHING鑽孔DRILLING壓合LAMINATION多層板內層流程INNERLAYERPRODUCTMLBAOI檢查AOIINSPECTION裁板LAMINATESHEARDOUBLESIDE雷射鑽孔LASERABLATIONBlindedVia通孔電鍍P.T.H.鑽孔DRILLING外層乾膜OUTERLAYERIMAGE二次銅及錫鉛電鍍PATTERNPLATING檢查INSPECTION前處理PRELIMINARYTREATMENT二次銅電鍍PATTERNPLATING蝕銅ETCHING全板電鍍PANELPLATING外層製作OUTER-LAYERO/LETCHING蝕銅TENTINGPROCESSDESMER除膠渣E-LESSCU通孔電鍍前處理PRELIMINARYTREATMENT剝錫鉛T/LSTRIPPING去膜STRIPPING壓膜LAMINATION錫鉛電鍍T/LPLATING曝光EXPOSURE3.1外層製作流程液態防焊LIQUIDS/M外觀檢查VISUALINSPECTION成型FINALSHAPING檢查INSPECTION電測ELECTRICALTEST出貨前檢查OQC包裝出貨PACKING&SHIPPING塗佈印刷S/MCOATING前處理PRELIMINARYTREATMENT曝光EXPOSUREDEVELOPING顯影POSTCURE後烘烤預乾燥PRE-CURE噴錫HOTAIRLEVELING銅面防氧化處理OSP(EntekCu106A)HOTAIRLEVELINGG/FPLATING鍍金手指鍍化學鎳金E-lessNi/AuForO.S.P.印文字SCREENLEGEND選擇性鍍鎳鍍金SELECTIVEGOLD全面鍍鎳金GOLDPLATING3.2外觀及成型製作流程2.內層線路製作(壓膜)1.內層THINCORE3.3典型多層板製作流程-MLB3.內層線路製作(曝光)4.內層線路製作(顯影)6.內層線路製作(去膜)5.內層線路製作(蝕刻)7.疊板LAYER2LAYER3LAYER4LAYER5LAYER1LAYER68.壓合10.電鍍11.外層線路壓膜12.外層線路曝光9.鑽孔14.鍍二次銅及錫鉛15.去乾膜16.蝕銅(鹼性蝕刻液)13.外層線路製作(顯影)18.防焊(綠漆)製作19.浸金(噴錫……)製作17.剝錫鉛基板壓膜壓膜後曝光顯影蝕銅去膜四、乾膜製作流程...COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板10-12層疊合壓合機之熱板壓合機之熱板COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板五、多層板疊板及壓合結構COPPERFOILEpoxyGlassPhotoResist2.內層板壓乾膜(光阻劑)1.下料裁板(PanelSize)4.曝光後PhotoResistArtwork(底片)Artwork(底片)光源3.曝光PhotoResist6.酸性蝕刻(Power/Ground或Signal)PhotoResist5.內層板顯影8.黑化(OxideCoating)7.去乾膜(StripResist)Layer1Layer2Layer3Layer4CopperFoilCopperFoilInnerLayerPrepreg(膠片)Prepreg(膠片)9.疊板11.鑽孔(P.T.H.或盲孔Via)(Drill&Deburr)墊木板鋁板10.壓合(Lamination)13.外層壓膜(乾膜Tenting)PhotoResist12.鍍通孔及一次電鍍15.曝光後(patternplating)14.外層曝光(patternplating)17.線路鍍銅及錫鉛16.外層顯影19.蝕銅(鹼性蝕刻)18.去膜21.噴塗(液狀綠漆)20.剝錫鉛23.綠漆顯影光源S/MA/W22.防焊曝光25.噴錫(浸金……)R105WWEI94V-0R105WWEI94V-024.印文字