SMT新锡膏评估实例

SolderPasteEvaluationDate2SolderPasteEvaluationSolderPasteTestPlanPhaseItemOwnerDueDateStatusIPreparationSearchthe2ndsource30-MayFinishedGetallsolderpastesample30-MayFinishedGetallsolderpastedocument30-MayFinishedIIProcessVerificationPrintability8-JunFinishedViscositytest8-JunFinishedSlumptest8-JunFinishedThicknessCpkanalysis8-JunFinishedSolderabilityverification8-JunFinishedIIISolderreliabilityTestX-raytest20-JunFinishedCrosssectionverification20-JunFinishedPullandpushtest20-JunFinishedDate3SolderPasteEvaluationSamplesCorrentsolderpasteNC254NC259SA-M105-C-885EF305-21EF105-21LF-200TH-BAIMAIMTONGFANGINVENTECINVENTECHUAQING202020202020AlloySAC305SN100CSAC305SAC305SAC105SAC305ParticlesizeType3Type3Type3Type3Type3Type3Meltingpoint217-218℃227-228℃217-218℃217-218℃217-218℃217-218℃EvaluatingsolderpastePhotoTypeSpecificationsSupplierPCBAquantityDateSolderPasteEvaluationPrintabilityPrintParameters:TestPattern:Stencil:0.12mmthicknessspecialPadpattern:Width3.0mmPrinter:MPM125Length20mmPrintspeed:45mm/secDistance0.5-2.0mmSeparationspeed:2.5m/secPrintabilityViscositySlumpThicknessSolderabilityX-rayCrosssectionPullandpushContentScore:5-perfect,4-good,3-basic,2-poor,1-unallowableDateSolderPasteEvaluationViscosityTestparameters:Equipment:MALCOMPCU205Testtemperature:25℃Revolution:10rpmMixtime:5minPrintabilityViscositySlumpThicknessSolderabilityX-rayCrosssectionPullandpushContentAlltheresultsareoutofspecexceptAIMNC259,buttheviscositycanbeadjustedbasedontheproductrequirement.MeasuringmethodSPECEquipmentTestValueResultNC259Temperature:26℃Time:15minrpm:10225+\-10%pa.sPCU-205211.2pa.sInspecSA-M105-C-885Temperature:26℃Time:15minrpm:10160-220pa.sPCU-205136.9pa.sOutofspecEF305-21Temperature:26℃Time:15minrpm:10175-225pa.sPCU-205145.9pa.sOutofspecEF105-21Temperature:26℃Time:15minrpm:10190-240pa.sPCU-205167.0pa.sOutofspecLF-200TH-BTemperature:26℃Time:15minrpm:10150-200kcpsPCU-205147.3pa.sOutofspecDateSolderPasteEvaluationSlumpPrintParameters:TestPattern:Stencil:0.12mmthicknessspecialPadpattern:Width3.0mmPrinter:MPM125Length20mmPrintspeed:45mm/secDistance0.5-2.0mmTestmethod:Tocheckthesolderpasteshapeprintedonboardafterseveralminutesifexistslumporchipchange.PrintabilityViscositySlumpThicknessSolderabilityX-rayCrosssectionPullandpushContentAllthesolderpastecankeeptheshapeafterseveralminuteswithoutslump.NC259TongFangEF305-21EF105-21HuaQingAfter5minAfter3hrsPreliminaryAnalysisDidfindobviousslumpafter3hrsinroomconditionDidfindobviousslumpafter3hrsinroomconditionDidfindobviousslumpafter3hrsinroomconditionDidfindobviousslumpafter3hrsinroomconditionDidfindobviousslumpafter3hrsinroomconditionResultPASSPASSPASSPASSPASSTypeDateSolderPasteEvaluationThicknessTestmethod:Equipment:2DlaserthicknesstesterPCBNo:13610761XPadpattern:terminalTestquantity:5pointperPCB,continuous5pcspertype.PrintabilityViscositySlumpThicknessSolderabilityX-rayCrosssectionPullandpushContentRelativelyspeaking,EF305,EF105andNC259arenearlysameasNC254,TongFangandHuaQingareworseinthicknessstability.DateSolderPasteEvaluationSolderabilityTestmethod:Equipment:2DlaserthicknesstesterPCBNo:13610761XPadpattern:terminalTestquantity:5pointperPCB,continuous5pcspertype.PrintabilityViscositySlumpThicknessSolderabilityX-rayCrosssectionPullandpushContentDateSolderPasteEvaluationThicknessTestmethod:Equipment:2DlaserthicknesstesterPCBNo:13610761XPadpattern:terminalTestquantity:5pointperPCB,continuous5pcspertype.PrintabilityViscositySlumpThicknessSolderabilityX-rayCrosssectionPullandpushContentComparetheprocesscapacityofthickness,EF305,HuaQingandNC259havemorebetterperformance.NC254NC259HuaQingEF305-21EF105-21TongFangAverageWithin0.3360.3610.3550.3590.3490.365StDevWithin0.0210.0190.0230.0200.0230.023CpWithin1.5901.7501.4501.6701.4500.029CpkWithin0.7000.6800.6500.6800.5100.590Within18075ppm20054ppm25201ppm20182ppm64037ppm39320ppmOverall12671ppm35235ppm25591ppm20629ppm68725ppm41039ppm443412ScorePerformanceItemScoreTypeDateSolderPasteEvaluationSolderabilityTestmethod:checkthesolderjointsafterreflowsoldering.PCBANo:13647427XReflowprofile:basedonthematerialspecbydeferentdifferenttypeofsolderpaste.PrintabilityViscositySlumpThicknessSolderabilityX-rayCrosssectionPullandpushContentNC259HuaQingEF305-21EF105-21TongFangResistorDiodeTerminalRelayBus-barTypeDateSolderPasteEvaluationSolderabilityTestmethod:checkthesolderjointsafterreflowsoldering.PCBANo:13647427XReflowprofile:basedonthematerialspecbydeferentdifferenttypeofsolderpaste.PrintabilityViscositySlumpThicknessSolderabilityX-rayCrosssectionPullandpushContentAfterreflowsoldering,thesolderwillextendtoterminalbodymoreeasilywhenusingHuaqingandEF305thanotherstype.NC259HuaQingEF305-21EF105-21TongFangDefectNANANAEvaluationThesolderjointsaremorebrighterthanSAC305TheSolderextendtoterminalbodyTheSolderextendtoterminalbodyRegularRegularScore41244TypeDateSolderPasteEvaluationProcessVerificationConclusionAfterthefirststepverificationinprocessflow,thescoreofeachsolderpastelistasbelow:PrintabilityViscositySlumpThicknessSolderabilityX-rayC