SMT生产能力评估审计worksheet

SMTMANUFACTURINGCAPABILITYASSESSMENTSCOREBOOKCategory1:DesignforManufacturabilityCriteria1.1ConceptandPracticeElementsDesignersorresponsiblestaffcanexplaintheconceptofDFMManagementandhowcompanydeploythem.Designguidelinesareavailable,crossreferencetoproductionlinecapability,processrequirementsandQualitystandards.GreenRedTherearereportsandmeetingsbetweenProcess&DesigndepartmentonDFMYieldforeveryproduct.Evidenceofusingallfindings.Checklistand/orsoftwareareusedforDFMassurance.Systemavailabletoensureimplementation.StrengthsImprovementOpportunitiesRemarksApproachImplementationTotalElementScoreDesignersandProcessEngineercanexplaintheimportanceofDFMwithexamples.Awareness1)2)AwarethattherearevariousDFMrulesintheindustry,eachofthemhastheirspecificconditions.3)4)Thereisain-houseDFMtrainingandcontrolsystem.5)6)7)BothprocessanddesignengrsaretrainedonDFM(withcontrolrecords).8)9)50%50%50%3333DesignandProcessEngineerscandemonstrateunderstandingofdesignrules.10)TheresponsibilitytoensuregoodDFMisclearineveryone'smind.Category1:DesignforManufacturabilityCriteria1.2ProcessknowledgeElements1)DesignersawaretheimportanceofthemknowingSMTprocessandthedesignrulessholdnotbedeterminedwithoutknowingtheinhouseprocess.GreenRedStrengthsImprovementOpportunitiesRemarks-placementalignmentmethodvsSMDs.-feederefficiency.-IRvsHotairreflow.-paste/glueprintingvsdispensing.ApproachImplementationTotalElementScoreAwareness2)Designerscanclearlyexplainthevarioustypesofprocessusedintheirproduction.(types,maincharacteristicsandapplication).3)Therearein-houseProcesstrainingcoursedesignfordesigners.Systemisavailabletoensureimplementation.4)ProcessreleasedocumentsareavailableintheDesigndepartmentandcrosslinktotheirdesignrules.5)SupportingdocumentsforDFMrulesfromtheprocesspointofviewiswellorganizedandmaintained.6)Designersareabletoexplainkeyprocessparameters:7)Designersknowwhatisprocesswindowandhowtheirdesignrulesrelatetotheprocesswindow.8)Designerswhoresponsiblefordesignrelease(orDFMcheck)aretrainedinProcessknowledge(controlandrecords).012390%80%40%Category1:DesignforManufacturabilityCriteria1.3DesignKnow-how(substrateselection)Elements1)Designersawarethattherearemanydifferentsubstratetypesandeachhavedifferentconsiderationinprocessandproductreliability.GreenRedStrengthsImprovementOpportunitiesRemarksApproachImplementationTotalElementScoreAwareness2)Designersbelievethattheyareareencouragedandhavemadeallnecessaryconsiderationstoselecttheirexistingrangeofsubstrates.3)Therearedocumentsspecifiedthetypesofsubstrateandconsideration.Inhouserequirementsaredefined.4)Substrateselectionisoneofthekeydesignflowwithcontrol,toensuresuchconsiderationismadeduringthedesign.Checklistaredesignandprovided.5)Designercannamecommontypesofsubstrates,explainedkeydifferencesandtheimpacttoproductiononthePCBfinishingtypes(HAL,NiAu,OSP).6)DesignersknowhowtodefinePCBwarpagetoensuregoodDFM.7)DesignersknowthesourcesofdimensionalerrorinPCBandtheirtypicalmagnitudes.Welldefinedindesignruleswithprocesscapabilityandqualitystandards.012390%80%40%Category1:DesignforManufacturabilityCriteria1.4DesignKnow-how(SMDselection)Elements1)DesignersawarethatInternationalstds(EIAJ,EIA,JEDECetc.)havesomeGreenRedStrengthsImprovementOpportunitiesRemarksdifferences.AlsomatrixandImperialsystem.ApproachImplementationTotalElementScoreAwarenessDesignersawarethatdifferentSMDshavedifferentimpacttoqualityandrequiredifferentdesignconsideration.2)3)Informationaboutpackagetypesandtheirfailuremechanismareavailable.EverySMDhasgonethroughaDFMverificationprocessduringdesign.4)Designersknowthatpackagetypesalsoaffectproductivity(abletogiveexamples).Informationaboutproductioncapabilityrelatedtopackagetypessuchasnozzletype,alignmentcapabilityandspeedetc.areavailable.5)DesignerabletoexplaineffectofdifferentstandoffheightofSOIC:-highstandoffforglueorcleaningprocess.-lowstandoffforPCBAprofileandbetterthermalconductivity.6)Designersknowtheeffectsofdifferentleadtypes:-GullWing(long/short),-Jlead,-LeadlessSMD,-Ballgrid.7)Designersknowtheconsiderationoflargechipsascomparetosmallchips:-onthermalmismatch,-onboardwarpage,-onorientation.8)012390%80%40%Category1:DesignforManufacturabilityCriteria1.5DesignKnow-how(Thermalmanagement)Elements1)DesignersawarethatThermalmismatchisamajorprobleminSMTandrequireddifferentconsiderationasTHT.GreenRedStrengthsImprovementOpportunitiesRemarksApproachImplementationTotalElementScoreAwareness2)DesignersawarethatThermaldesignaffectsnotonlyproductperformanceandlife,butalsoproductionyield.3)DocumentsforbothproductperformanceandasssemblyconsiderationrelatedtothermalcharacteristicsofSMDareavailable.4)TherearetestrecordsforallcommonSMDpackagesusedintermsofthermalfatiguelife(fromin-house,externalsourcesorsuppliers).5)Designersabletoexplainwhichofthefollowingaremoresuspectivetothermalproblemandwhy:-1206vs0805,-LCCvsPLCC,-QFPvsPLCC.6)DesignerscanexplaindifferentbetweenTHTandSMTintheaspectofthermalconsideration.7)Designersknowsomemethodofeliminatingthermalmismatchproblems:-compliantlayerPCB,-standoffjoints,-leadedSMD