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HDI印刷電路板流程介紹0HDIManufacturingProcessFlowHDI印刷電路板流程介紹1Pre-engineeringPatternimagingEtchingLaminatingDrillingCuplatingHolepluggingPatternimagingLaminationLaserAblationMechanicaldrillingPatternimagingCuplatingSolderMaskSurfaceFinishedRoutingVisualinspectionElectrictestShippingHDI印刷電路板流程介紹2Pre-engineeringPatternimagingEtchingLaminatingDrillingHDI印刷電路板流程介紹3DesmearCuplatingHolepluggingCuplatingBeltSandingHDI印刷電路板流程介紹4LaminationLaserAblationMechanicaldrillingCuplatingPatternimagingHDI印刷電路板流程介紹5SolderMaskGoldplatingRoutingElectricaltestPatternimagingHDI印刷電路板流程介紹6HolecounterShippingVisualinspectionHDI印刷電路板流程介紹81.內層基板(THINCORE)LaminateCopperFoil裁板(PanelSize)COPPERFOILEpoxyGlassHDI印刷電路板流程介紹9PhotoResist2.內層線路製作(壓膜)(DryFilmResistCoat)EtchPhotoresist(D/F)HDI印刷電路板流程介紹10PhotoResist3.內層線路製作(曝光)(Expose)A/WArtwork(底片)Artwork(底片)AfterExposeBeforeExposeHDI印刷電路板流程介紹114.內層線路製作(顯影)(Develop)PhotoResistHDI印刷電路板流程介紹125.內層線路製作(蝕刻)(Etch)PhotoResistHDI印刷電路板流程介紹136.內層線路製作(去膜)(StripResist)HDI印刷電路板流程介紹147.黑氧化(OxideCoating)HDI印刷電路板流程介紹158.疊板(Lay-up)LAYER2LAYER3LAYER4LAYER5LAYER1LAYER6Layer1Layer2Layer3Layer4CopperFoilCopperFoilInnerLayerPrepreg(膠片)Prepreg(膠片)HDI印刷電路板流程介紹169.壓合(Lamination)HDI印刷電路板流程介紹17典型之多層板疊板及壓合結構...COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板10-12層疊合壓合機之熱板壓合機之熱板COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板HDI印刷電路板流程介紹18墊木板鋁板10.鑽孔(Drilling)HDI印刷電路板流程介紹1911.電鍍Desmear&CopperDepositionHDI印刷電路板流程介紹2012.塞孔(HolePlugging)13.去溢膠(BeltSanding)HDI印刷電路板流程介紹2114.減銅(CopperReduction)→Option15.去溢膠(BeltSanding)→OptionHDI印刷電路板流程介紹2216.外層壓膜DryFilmLamination(Outerlayer)PhotoResistHDI印刷電路板流程介紹2317.外層曝光ExposeUV光源HDI印刷電路板流程介紹2418.AfterExposedHDI印刷電路板流程介紹2519.外層顯影DevelopHDI印刷電路板流程介紹2620.蝕刻EtchHDI印刷電路板流程介紹2720.去乾膜StripResistHDI印刷電路板流程介紹2821.壓合(Build-upLayerLamination)RCC(ResinCoatedCopperfoil)HDI印刷電路板流程介紹2921.護形層製作(壓膜)(ConformalMask)DryFilm(乾膜)DryFilm(乾膜)HDI印刷電路板流程介紹30Artwork(底片)Artwork(底片)22.護形層製作(曝光)(ConformalMask)BeforeExposureAfterExposureHDI印刷電路板流程介紹3123.護形層製作(顯像)(ConformalMask)HDI印刷電路板流程介紹3224.護形層製作(蝕銅)(ConformalMask)HDI印刷電路板流程介紹3325.護形層製作(去膜)(ConformalMask)HDI印刷電路板流程介紹3426.雷射鑽孔(LaserAblation)及機械鑽孔HDI印刷電路板流程介紹35MechanicalDrill(P.T.H.)LaserMicrovia(BlindVia)27.機械鑽孔(MechanicalDrill)HDI印刷電路板流程介紹3628.電鍍(Desmear&CopperDeposition)HDI印刷電路板流程介紹3729.外層線路製作(Patternimaging)壓膜(D/FLamination)HDI印刷電路板流程介紹38曝光(Exposure)顯像(D/FDeveloping)HDI印刷電路板流程介紹39蝕銅(Etching)去膜(D/FStripping)HDI印刷電路板流程介紹4030.防焊(綠漆)製作(SolderMask)HDI印刷電路板流程介紹41WWEI94V-0R10531.S/M顯像(S/MDeveloping)32.印文字(LegendPrinting)HDI印刷電路板流程介紹4233.浸金(噴錫……)製作(ElectrolessNi/Au,HAL……)WWEI94V-0R105HDI印刷電路板流程介紹43WWEI94V-0R105DedicateoruniversalTesterFlyingProbeTester34.成型(Profile)35.測試(ElectricalTesting)HDI印刷電路板流程介紹44WWEI94V-0R105WWEI94V-0R10536.終檢(FinalInspection)37.O.S.P.(entekplusCu_106A….)→OptionHDI印刷電路板流程介紹45LASERBLIND&BURIEDVIALAY-UPA=THROUGHVIAHOLE(導通孔)B=BURIEDVIAHOLE(埋孔)C=OneLevelLaserBlindVia(雷射盲孔)LASERBLIND&BURIEDVIALAY-UPBURIEDVIAANDLASERBLINDVIAOPTION(雷射盲埋孔之選擇)DCCD=TwoLevelLaserVia(雷射盲孔)CDCB-STAGEFR-4CoreRCCFR-4CoreB-STAGERCCABBAHDI印刷電路板流程介紹46BURIEDVIALAY-UPA=THROUGHVIAHOLE(導通孔)B=BURIEDVIAHOLE(埋孔)C=BLINDVIAHOLE(盲孔)D=BLINDHOLEMLBVIA(多層盲孔)BLINDVIALAY-UPBLINDVIASEQUENTIALLAY-UPABBARESINB-STAGEBLINDANDBURIEDVIAOPTION(盲埋孔之選擇)DACCE=VIAINPAD(VIP)(導通孔在pad裡面)EHDI印刷電路板流程介紹47ConventionalPCBFR-4Build-upLayerBuild-upLayerPhoto-viaPhoto-ImageableDielectric(PID)FR-4ConventionalPTHConventionalPTHHDI印刷電路板流程介紹48ConventionalPCBBlindViaPCBPTH3millineSVHIVHChip-on-SVHFR-4ConventionalPTHConventionalPTH