SMT知识

IndustryStudyof2Dversus3DSolderPasteInspectionAgilentManufacturingTestPortfolioOurfocus:loweringthecostofPCBmanufacturing.Wecoverthewholeprocess.Accelerateyoursuccessthroughserviceandsupport.Goalistofinddefectsasearlyaspossible,reducemanufacturingcosts,andincreaseprofits.CommonTools,IntegratedAcrossYourProductionLine!AQT(AgilentQualityTool)andART(AgilentRepairTool),andCAMCAD(CadTranslation)SP50SP505DXSeries50005DXSeries5000SJ50SeriesIISJ50SeriesIISJ50SeriesIIXLSJ50SeriesIIXLSJ50SeriesIIValueSJ50SeriesIIValue3070Series33070Series3Today’sAgendaPasteDefectsandRelationto2Dand3DIndustryStudiesandRecommendationsExamplesConclusions1234PasteProblemsandSolutionsAdjustprinterPolymerbladesscoopoutpasteSqueegeespeedtoofastVolumeLowHeightLowInspectstencilAdjustprinterWarpedstencilSeparationcontrolspeedtoofastSqueegeespeedtoofastLargeHeightVariationAdjustprinterSqueegeespeedtoofastPastetemperaturetohighPastehasabsorbedmoistureSlumpCleanstencilandboardInspectstencilContaminationatboard/stencilinterfaceWarpedstencilVolumeHighHeightHighAdjustprinterCleanstencilandboardInspectstencilPooraperaturegasketingduetoexcessivesqueegeepressureDebrisonboarDamagedaperatureLargeAreaCleanstencilAddfreshpasteAdjustprinterDriedpasteonstencilaperaturePastevolumeonprintertoolowSqueegeespeedtoofastSmallAreaCleanstencilPoorhandlingPasteonbackonstencilSnap-offheighttoohighSmearCollect3DdataInspectstencilExcesspasteDamagedaperaturesBridgeAdjustscreenprinterMeasurestencilandboardsMis-alignedstencilBadstencilorboardsPastetoPadOffsetActionPossibleCauseSPIMeasurementPastetoPadOffset/MisalignedPrintAdjustscreenprinterMeasurestencilandboardsMis-alignedstencilBadstencilorboardsPastetoPadOffsetActionPossibleCauseSPIMeasurement2DOffsetdefectPotentialareadefect3DPotentialvolumedefectPotentialheightdefectBridgeCollect3DdataInspectstencilExcesspasteDamagedaperaturesBridgeActionPossibleCauseSPIMeasurement2DOffsetgoodPotentialareadefectifbridgeareaislarge3DVolumedefectPotentialheightdefectSmearCleanstencilPoorhandlingPasteonbackonstencilSnap-offheighttoohighSmearActionPossibleCauseSPIMeasurement2DOffsetgoodPotentialareadefectifsmearareaislarge3DPotentialvolumedefectHeightdefectSmallArea/LargeArea2DOffsetgoodAreadefect3DVolumedefectPotentialheightdefectAdjustprinterCleanstencilandboardInspectstencilPooraperaturegasketingduetoexcessivesqueegeepressureDebrisonboarDamagedaperatureLargeAreaCleanstencilAddfreshpasteAdjustprinterDriedpasteonstencilaperaturePastevolumeonprintertoolowSqueegeespeedtoofastSmallAreaActionPossibleCauseSPIMeasurementVolumeHighorLow/HeightHighorLowAdjustprinterPolymerbladesscoopoutpasteSqueegeespeedtoofastVolumeLowHeightLowCleanstencilandboardInspectstencilContaminationatboard/stencilinterfaceWarpedstencilVolumeHighHeightHighActionPossibleCauseSPIMeasurement2DOffsetgoodAreagood3DVolumedefectHeightdefectSlump/LargeHeightVariationInspectstencilAdjustprinterWarpedstencilSeparationcontrolspeedtoofastSqueegeespeedtoofastLargeHeightVariationAdjustprinterSqueegeespeedtoofastPastetemperaturetohighPastehasabsorbedmoistureSlumpActionPossibleCauseSPIMeasurement2DOffsetgoodPotentialareadefect3DVolumedefectHeightdefectDogEarToday’sAgenda1PasteDefectsandRelationto2Dand3DIndustryStudiesandRecommendationsExamplesConclusions234IndustryStudiesandRecommendationsOtherIBMHewlett-Packard3COM(pendingstudy)MalibuTechnologies(pendingstudy)ConsultantsEditorials(SMTInFocus,SMTMagazine)PasteVendorsAIMIndiumKokiAlphametals(Cookson)StencilVendorAMTXPrinterVendorsSpeedline(Cookson)DEKPrintingMachinesLtdDeviceVendorAmkorIndicatesprocessissuesfoundwith2Dor3DmeasurementsIndicatesprocessissuesfoundwith3DmeasurementsAIMStudiesandRecommendationsWhyDoesItHappenAnexcessofsolderpasteMis-registrationSolderBeadinginSMT:CausesandCuresPaperObjective:RecommendprocessestousewithAIMsolderpasteHowCanItBePreventedReducetheamountofsolderpastedepositedduringtheprint.ApertureSize/Shape--thelocationofthepasteonthepadalsoisimportantStencilThickness--reducingthethicknessofone’sstencil(s)Snap-off--resultsinanincreasedpastevolumedepositedonanassemblyOn-contactPrinting--moreuniformpastedeposition,amoreconsistentpasteheight,andgasketingbetweenthestencilandthePCBConclusionSolderbeadingmaybesubstantiallyreducedoreliminatedbyreducingthevolumeofsolderpastedepositedonthePCB.Inaddition,thelocationofthesolderpasteonthepadisofcriticalimportance.AIMStudiesandRecommendationsTheQuickPocketReferenceforSolderAssemblyPocketGuideObjective:Helptheproductionlineengineerassesshis/herassemblyproblemsPrintingDefectAnalysis•Bridgingisrelatedtothesolderpastequantity….toomuchpastehasbeenprinted•Pastecanbeshear-thinnedtothepointthatitlosesbodytothepointofslumping,whichcouldleadtobridgingReflowDefectAnalysisThequantityofpastedepositcanaffecttombstoning:ingeneral,thethickerthepastedeposit,themoretombstonesOtherfactorsthatcanrelatetotombstoningarecomponentand/orpastemisregistration.AIMStudiesandRecommendationsSMTTroubleshootingPresentationObjective:ProvideprocesssolutionsfortypicalSMTdefectsSolderBeadingPossibleCauses--toomu