华硕电脑SMT外观允收标准

華碩電腦(股)公司SONYLEXUXPROJECTWorkmanshipStandard編號：附件一日期：Mar.26,2001版本：E1-2DIP零件組裝工藝標準--機構零件(Slot,Socket,DIM,Heatsink)傾斜--------------1-28DIPcomponentAssemblyworkmanshipcriteria--Tiltofconstructivecomponent(slot,socket,Dim,Heatsink)DIP零件組裝工藝標準--機構零件(JumperPins,BoxHeader)浮件-----------------1-29DIPcomponentAssemblyworkmanshipcriteria--Floatingofconstructivecomponent(JumperPins,Boxheader)DIP零件組裝工藝標準--機構零件(JumperPins,BoxHeader)傾斜-----------------1-30DIPcomponentAssemblyworkmanshipcriteria--Tiltofconstructivecomponent(JumperPins,Boxheader)DIP零件組裝工藝標準--機構零件(CPUSocket)浮件與傾斜-----------------------1-31DIPcomponentAssemblyworkmanshipcriteria--Tiltandfloatingofconstructivecomponent(CPUSocket)DIP零件組裝工藝標準－機構零件(USB,D-SUB,PS/2,K/B&generalcon.Jack)浮件與傾斜--1-32DIPcomponentAssemblyworkmanshipcriteria--Tiltandfloatingofconstructivecomponent(USB,D-sub,PS/2,K/B&generalconnectorJack)DIP零件組裝工藝標準--機構零件(PowerConnector)浮件與傾斜------------------1-33DIPcomponentAssemblyworkmanshipcriteria--Tiltandfloatingofconstructivecomponent(PowerConnector)DIP零件組裝工藝標準--機構零件(JumperPins,BoxHeader)組裝外觀(1)----------1-34DIPcomponentAssemblyworkmanshipcriteria--Workmanship(1)ofconstructivecomponent(JumperPin,Boxheader)DIP零件組裝工藝標準--機構零件(JumperPins,BoxHeader)組裝外觀(2)----------1-35DIPcomponentAssemblyworkmanshipcriteria--Workmanship(2)ofconstructivecomponent(JumperPins,Boxheader)DIP零件組裝工藝標準--機構零件(BIOS&Socket)組裝外觀(3）-----------------1-36DIPcomponentAssemblyworkmanshipcriteria--Workmanship(3)ofconstructivecomponent(BIOS&Socket)DIP零件組裝工藝標準--組裝零件腳折腳、未入孔(1)---------------------------1-37DIPcomponentAssemblyworkmanshipcriteria--Leadbendandno-insidethehole(1)ofassembleyDIP零件組裝工藝標準--零件腳折腳、未入孔、未出孔(2)-----------------------1-38DIPcomponentAssemblyworkmanshipcriteria--Leadbendno-insideno-through(2)oftheholeDIP零件組裝工藝標準--板彎、板翹、板扭(平面度)----------------------------1-39DIPcomponentAssemblyworkmanshipcriteria--boardwrapageDIP零件組裝工藝標準--零件腳與線路間距-------------------------------------1-40DIPcomponentAssemblyworkmanshipcriteria--thespacebetweenleadtotraceDIP零件組裝工藝標準--零件破損(1)-----------------------------------------1-41DIPcomponentAssemblyworkmanshipcriteria--componentbroken(1)DIP零件組裝工藝標準--零件破損(2)-----------------------------------------1-42DIPcomponentAssemblyworkmanshipcriteria--componentbroken(2)DIP零件組裝工藝標準--零件破損(3)-----------------------------------------1-43DIPcomponentAssemblyworkmanshipcriteria--componentbroken(3)DIP零件組裝工藝標準--機構零件(USB)偏移率----------------------------------1-44DIPcomponentAssemblyworkmanshipcriteria--Shiftedrateofconstructivecomponent(USBconnector)DIP零件組裝工藝標準--機構零件(DCJack)對準度------------------------------1-45DIPcomponentAssemblyworkmanshipcriteria--Shiftedrateofconstructivecomponent(DC_Inconnector)DIP焊錫性工藝標準--零件面孔填錫與切面焊錫性標準(1)-----------------------1-46DIPsolderingworkmanship--thesolderfilletinthePTHbycross-section(1)DIP焊錫性工藝標準--零件面孔填錫與切面焊錫性標準(2)-----------------------1-47DIPsolderingworkmanship--thesolderfilletinthePTHbycross-section(2)DIP焊錫性工藝標準--焊錫面焊錫性標準(1)-----------------------------------1-48DIPsolderingworkmanship--solderingstandardonsolderside(1)DIP焊錫性工藝標準--焊錫面焊錫性標準(2)-----------------------------------1-49DIPsolderingworkmanship--solderingstandardonsolderside(2)DIP焊錫性工藝標準--焊錫面焊錫性標準(3)-----------------------------------1-50DIPsolderingworkmanship--solderingstandardonsolderside(3)DIP焊錫性工藝標準--DIP插件孔焊錫性檢驗圖示--------------------------------1-51DIPsolderingworkmanship--FigureofPTHsolderfilletevaluationDIP焊錫性工藝標準--焊錫性問題(錫橋、短路、錫裂)--------------------------1-52DIPsolderingworkmanship--solderingissue(Bridge,short,crack)DIP焊錫性工藝標準--焊錫性問題(空焊、錫珠、錫渣、錫尖)--------------------1-53DIPsolderingworkmanship--solderingissue(missingsolder,solderball,solderdross,solderpeak)金手指工藝標準--沾錫、沾漆、沾膠、刮傷翹起--------------------------------1-54Goldfingerworkmanship華碩電腦(股)公司SONYLEXUXPROJECTWorkmanshipStandard編號：附件一日期：Mar.26,2001版本：E1-3PCBA半成品握持方法:PCBAWIPproducthandling理想狀況（TargetCondition）：配帶乾淨手套與配合良好靜電防護措施。HandlingwithcleanglovesandfullESDprotection允收狀況（AcceptCondition）：配帶良好靜電防護措施，握持PCB板邊或板角執行檢驗。HandlingwithcleanhandsbyboardedgesusingfullESDprotection拒收狀況（RejectCondition）：未有任何靜電防護措施，並直接接觸及導體、金手指與錫點表面(MA)。Handlingwithbarehandstouchingconductors,solderconnectionsandgoldfinger,NoESDprotectionimplemented華碩電腦(股)公司SONYLEXUXPROJECTWorkmanshipStandard編號：附件一日期：Mar.26,2001版本：E1-4理想狀況(TargetCondition)拒收狀況(RejectCondition)SMT零件組裝工藝標準--晶片狀(Chip)零件之對準度(組件X方向)SMDAssemblyworkmanshipcriteria--Chipcomponentalignment(XAxis)1.晶片狀零件恰能座落在焊墊的中央且未發生偏出，所有各金屬封頭都能完全與焊墊接觸。1.Componentiscenteredonbothsidesoftheland.Allthesolderterminationsshallcompletelytouchpad.1.零件橫向超出焊墊以外，但尚未大於其零件寬度的50%。(X≦1/2W)1.Thecomponentshiftedoffthepadandshiftlengthshallless1/2chipwidth1.零件已橫向超出焊墊，大於零件寬度的50%(MI)。(X1/2W)1.Thecomponentshiftedoffthepadandshiftlengthover1/2chipwith允收狀況(AcceptCondition)X≦1/2WX≦1/2WX1/2WX1/2W註:此標準適用於三面或五面之晶片狀零件Thisstandardonlybeusedfor3or5faceterminationschipcomponentww330華碩電腦(股)公司SONYLEXUXPROJECTWorkmanshipStandard編號：附件一日期：Mar.26,2001版本：E1-5理想狀況(TargetCondition)拒收狀況(RejectCondition)1.晶片狀零件恰能座落在焊墊的中央且未發生偏出，所有各金屬封頭都能完全與焊墊接