第二章 电子封装的基本工艺 PDF

:(die-attachpad)1.Au-SiAuAu370H2(N2)Au-Si370Au:Si=69:31AuSiCTE2.Pb/SnAuorNiAu,Pd-Ag,orCuPb-Sn3.75-80%--1501hI/O1.WireBonding,WB2.(TapeAutomatedBonding,TAB)3.(FlipChipBonding,FCB)1/4-1/3WBTAB,FCBWBI/OAlorAuAu,Al,Si-Al10um-100um1.5-3mm:0.75mm200(0.05N/)“”100-1500.05N/0.1N/Al,40µm0.07-0.09N/Au,25µm(lift-off)(fatiguebreak)Au-Al(200)AuAl2(Au2AlAuAlAu4AlAu5Al2()KirkendalVoidX2=DtX:D:t:TABI/O296TABFQFP1.TAB1mm2.TABWB3.I/O4.TABRCLWB5.TABIC6.TABCu7.TABWB3-108.1.Cu(PI)(PET)(BCB)2.TABAu,Ni,Pb/SnAlCu3.AuCu/AuAu/SnPb/SnLSILSISi3N4SiO2••TAB•1.TAB2.TABTAB()I/OI/O(1)Cu(50-70um)(2)(CuAl)(PA)(3)Cu18-35um20-25um70um3.TABaAuNi/AuCu/AuAuNi/AuCu/AuPb/SnT,P,tT=450-500OC,P=0.5N/t=0.5-1sb(BTAB)CuTAB(1)(2)CuTABBTABTABTAB200—30050—80um0.3mm2000800—1000FCB•••I/O•SMT•••1.1960IBMFCBC4(ControlledCollapsedChipConnection)Pb/Sn••Pb/Sn•Pb/Sn/PQFP10X10mm:7X7mm1mm=7X7/12X12=34%COB10X10mm:7X7mm,1.5mm=7X7/10X10=49%FCB:(75%)2.1——CrTiNi(A)PtWPdMoCuNi(A--A)AuCuNiPb/SnIn2(1):AuNi/AuAu/SnCuCu/Pb-SnInPb/SnC4(2):3.1/•IC•I/O••IC•I/O•••••••••••ICAuAuICAlH2N2FCBSiPCBAg/Pd,Au,Cu)Au,Ni,CuCuPCB/------10um/—/PCB/1AuNi/AuCuCu/Pb-Sn2•/SiPCB•C4PCBC4•Pb/Sn“”•SMTPCB•/SiPCB•C4PCBC4•Pb/Sn“”•SMTPCBPb/SnC4“”“”COG——ACAACAACAICACAXYACA(UV)/ACA50um/ACAACA10%Ag,Ni,Au,Ni••••1—•••PCB•••••2—70-75C“L”—1—•••PCB•••••2—70-75C“L”—•transfermolding•(injectmolding)•(premolding)90-95C170-175C••••••+•••1.•IC•IC•2.Sn/Pb=63/37,mp183C————————————