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PCIExpress®MiniCardElectromechanicalSpecificationRevision1.2October26,2007PCIEXPRESSMINICARDELECTROMECHANICALSPECIFICATION,REV1.22RevisionRevisionHistoryDate1.0Initialrelease.6/2/20031.1IncorporatedapprovedErrataandECNs.3/28/20031.2IncorporatedapprovedECNs.10/26/2007PCI-SIGdisclaimsallwarrantiesandliabilityfortheuseofthisdocumentandtheinformationcontainedhereinandassumesnoresponsibilityforanyerrorsthatmayappearinthisdocument,nordoesthePCI-SIGmakeacommitmenttoupdatetheinformationcontainedherein.ContactthePCI-SIGofficetoobtainthelatestrevisionofthespecification.MembershipServices@pcisig.comPhone:503-619-0569Fax:503-644-6708TechnicalSupporttechsupp@pcisig.comDISCLAIMERThisPCIExpressMiniCardElectromechanicalSpecificationisprovidedasiswithnowarrantieswhatsoever,includinganywarrantyofmerchantability,noninfringement,fitnessforanyparticularpurpose,oranywarrantyotherwisearisingoutofanyproposal,specification,orsample.PCI-SIGdisclaimsallliabilityforinfringementofproprietaryrights,relatingtouseofinformationinthisspecification.Nolicense,expressorimplied,byestoppelorotherwise,toanyintellectualpropertyrightsisgrantedherein.PCI,PCIExpress,PCIe,andPCI-SIGaretrademarksorregisteredtrademarksofPCI-SIG.Allotherproductnamesaretrademarks,registeredtrademarks,orservicemarksoftheirrespectiveowners.Copyright©2003,2005,2007PCI-SIGPCIEXPRESSMINICARDELECTROMECHANICALSPECIFICATION,REV1.23Contents1.INTRODUCTION...................................................................................................................71.1.OVERVIEW...................................................................................................................71.2.SPECIFICATIONREFERENCES........................................................................................91.3.TARGETEDAPPLICATIONS...........................................................................................91.4.FEATURESANDBENEFITS..........................................................................................102.MECHANICALSPECIFICATION......................................................................................112.1.OVERVIEW.................................................................................................................112.2.CARDSPECIFICATIONS...............................................................................................112.2.1.CardFormFactor.....................................................................................................122.2.2.CardandSocketTypes..............................................................................................132.2.3.CardPCBDetails.....................................................................................................142.3.SYSTEMCONNECTORSPECIFICATIONS.......................................................................212.3.1.SystemConnector......................................................................................................212.3.2.SystemConnectorParametricSpecifications...........................................................212.4.I/OCONNECTORAREA..............................................................................................232.5.RECOMMENDEDSOCKETCONFIGURATIONS...............................................................232.5.1.Single-UseFull-MiniandHalf-MiniSockets...........................................................232.5.2.Dual-UseSockets......................................................................................................262.5.3.DualHead-to-HeadSockets.....................................................................................292.5.4.Side-by-SideSocketSpacing.....................................................................................322.6.THERMALGUIDELINES...............................................................................................322.6.1.ThermalDesignDefinitions......................................................................................322.6.2.ThermalGuidelinesforPCIExpressMiniCardAdd-inCardDesigners................332.6.2.1.ImplementationConsiderations........................................................................342.6.3.ThermalGuidelinesforIntegratingWirelessWideAreaNetworkMiniCardAdd-inCards.........................................................................................................................353.ELECTRICALSPECIFICATIONS......................................................................................393.1.OVERVIEW.................................................................................................................393.2.SYSTEMINTERFACESIGNALS.....................................................................................393.2.1.PowerSourcesandGrounds....................................................................................413.2.2.PCIExpressInterface...............................................................................................413.2.3.USBI