SMT-目检

三伍电子系统(北京)有限公司VisualInspection1ObjectivesAttheendoftraining,thetraineesshallbeableto：目标经过培训后学员须能够：•DefineVisualInspectionoperation.定义目检岗位。•ExplaintheimportanceofVisualInspectioninthewholeassembly.解释目检在整个生产过程中的重要性。•Enumerateallcriteriainvolvinginperformingtheoperationsoastounderstandthecharacteristicofanacceptableunit.列举出本岗位所涉及的标准并掌握合格产品的特征。•Performtheoperationwithconformancetoprocessrequirements.根据工艺要求正确完成岗位操作。VisualInspection目检三伍电子系统(北京)有限公司VisualInspection2OperationRequirement岗位要求-Onlyqualifiedoperatorsareallowedtotheoperation.只有通过考核的操作员才允许上岗工作。-Theappropriateworkinstructionshouldbedisplayduringtheset-up.岗位在设置时须配有正确的作业指导书。Operatorarerequiredtofilloutthefollowingforms：操作员需填写下列表格：-ProductionTraveler生产随行单-FirstPassedYieldReport一次通过率报告ApplicableDocuments使用的相关文件：-QAI0001-BJQualityAssuranceInstructionQAI0001-BJ质量保证标准-WorkInstruction作业指导书三伍电子系统(北京)有限公司VisualInspection3Note:MaximumlotsubmissiontoQAisthree.Acorrectiveactionreport(CAR)isgiventolotsexceedingmaximumsubmission.QAshallperformre-buy-offonlyonthosewithaccomplishedCAR.注：每批QA验收最多三次，如果验收三次仍不能通过，则应对批提交纠正措施报告，报告完成后，QA对该批再重新验收。QABUYOFF质量验收包装PACKING轻不良MINOR重不良MAJOR产品再筛分一个以上相似的轻不良品产品再筛分轻不良品包装PACKING接收ACCEPT拒收REJECT合格ACCEPTLOT批据收REJECTLOT1MINORREJECTMORETHAN1MINORREJECTOFSIMILARDEFECTPRODUCTIONRESCREENPRODUCTIONRESCREEN三伍电子系统(北京)有限公司VisualInspection4•SolderFillet:Anormallyconcavesurfaceofsolderattheterminalendsofthechipcomponentwhichconnectsittothemetalpadsurface.焊缝：焊锡在焊盘和元件焊接中形成的凹形表面。•PlatedThru-hole:Aholeinwhichelectricalconnectionismadebetweenexternalandinternalconductivepatterns,orboth,bytheplatingofmetalonthewallofthehole.金属过孔：通过孔壁的金属镀层形成内部与外部之间的导电通路。•Flux:Achemicallyactivecompoundwhich,whenheated,removesminorsurfaceoxidationofthebasemetalandpromotestheformationofanintermetalliclayerbetweensolderandbasemetal.助焊剂：一种加热后能除去金属表面的氧化物并能增强焊锡和金属之间化合的化合物。•Pad:Theportionofprintedcircuitorwiringusedformakingelectricalconnectionstotheconductivepatternorcomponent.焊盘：印刷电路板上用于焊接元器件或集成电路的部分。•SolderMask:amaterialusedtoprotectthedesiredportionoftheconductivepatternortraceandcontactfingersfrombeingcoatedwithsolder.阻焊膜：用于防止电路板上的电路沾染焊锡的一层保护膜。三伍电子系统(北京)有限公司VisualInspection5•ChipComponent片状元器件MetallicCap金属帽Non-Metallization非金属部分MetallicLeg金属引脚ComponentBody元件体Non-polarizedResistor/Capacitor无极性的电阻器/电容器PolarizedTransistor/Diode有极性的三极管/二极管•PCB印刷电路板Pad焊盘Trace引线PlatedThru-hole金属过孔ContactFingers金手指三伍电子系统(北京)有限公司VisualInspection6•ComponentDefect元件缺陷-Cracked:Nocrackedisallowed.or.碎裂：任何碎裂都是不允许的。-Chipouts:Anynicksorchip-outthatexposestheelectrodeisallowed元件破损：任何缺口或破损造成电极裸露是不允许的。-WrongComponent:RejectanyunitwithcomponentnotaccordingtoBOM元件错误：任何部件上有与BOM不符的元器件为不良品。-MissingChip:Thereshallbenomissingchip/component.丢元器件：元件丢失是不允许的。三伍电子系统(北京)有限公司VisualInspection7•ComponentPlacement元件贴装-Preferred:Componentiscenteredonbothsidesofland.最佳：元件贴在两个焊盘的中心。-MaximumSideOverhang:Sideoverhangshallnotexceed0.5(50%)timeslandwidth(WL)orcomponentwidth(Wc)or60milswhicheverisless.最大侧移量：侧悬不得超出焊盘宽度(WL)或元器件宽度(Wc)的一半或60mils(选其中最小值)。-MaximumEndOverhang:Bottomfaceofcomponentmustoverlaplandbutmustnotoverhangoutermostendofland.尾部最大侧悬量：元件的底端必须覆盖焊盘但不允许超出焊盘的最外端。-MinimumMisalignment:Sideoverhangexceeds1/2landorcomponentwidth(whicheverisless)isreject.最大的焊接偏移量：偏位不得超出焊盘或元件宽度的一半或60mils(选其中最小值)。三伍电子系统(北京)有限公司VisualInspection8•SolderCoverageforChipComponent片状元件焊锡覆盖-Preferred:Solderflowcoversentireendofcapandlanddoesnotoverhangeitherone.Noevidenceofde-wettingatlandorendcapmetallization.最佳：焊锡要覆盖整个金属帽和焊盘并没有侧伸。焊盘金属帽无明显非浸润现象。-MinimumAcceptable:Endjointwidth(Wj)equals0.5(50%)oflandorcomponentwidth(Wc)whicheverisless.Minimumfilletheight(Hf)is1/4height(H)ofcomponentor20milswhicheverisless.最小许可范围：焊接面的宽度不小于焊盘或元器件宽度的50%，以二者中最小宽度为标准。焊缝的最小高度为元器件高度的1/4或20mils，以二者中最小宽度为标准。-ExcessiveSolder:Rejectifthesolderfilletencasesthenon-metallizedportionofcomponent.焊锡过多：如果焊锡流到元件的非金属部分为不合格品。三伍电子系统(北京)有限公司VisualInspection9•ComponentPlacement元件贴装-Preferred:Componentiscenteredonbothsidesofland.最佳：元件贴在两个焊盘的中心。-MaximumSideOverhang:Sideoverhangshallnotbemorethan50%leadwidth.whiletheleads(sideB)pointofcontactareontheedgeofthelands.最大侧移量：最大侧移量应小于管脚宽度的50%。管脚和焊盘的焊接区域不超过焊盘的边缘。三伍电子系统(北京)有限公司VisualInspection10•SolderCoverage焊锡覆盖-Preferred:Sidejointlengthexceedstwotimesleadwidth.Jointwidthequalsleadwidth.Heelfillerextendsaboveheelmidpoint.Jointthicknesslessthan30mils.最佳：焊点长度大于管脚宽度的2倍，焊点宽度等于管脚的宽度。管脚根部的焊锡要超过管脚的中点。-MinimumHeelFilletHeight:MinimumheelfilletheightshallnotbelessthanG+1/2T.管脚焊缝的最小高度：管脚焊缝的最小高度应不小于G+1/2T.-MinimumEndJointWidth:MinimumendjointwidthshallnotbelessthanW-A.管脚的最小连接宽度：管脚的最小连接宽度应不小于W-A。-MinimumSideJointLength:Minimumsidejointwidthshallnotbelessthan1.5width.管脚的最小侧面连接长度：管脚的最小侧面连接长度应不小于1.5倍的管脚宽度。-MaximumSolderCoverage:Solderfilletshallnottouchpackagebody.最大的焊锡覆盖：焊锡不能接触到元件的封装体本身。三伍电子系统(北京)有限公司VisualInspection11•Wetting:Solderissmooth,brightandfeatheredtoathinedge.Outlineofthelead(termination)isclearlyvisibleinthesolder.浸润：焊锡光滑、明亮且边缘流畅，管脚的轮廓在焊锡中清晰可见。•Non-wetting/Dewetting:Solderfilletwetslessthan50%ofleadorlandwidthisreject.未浸润：焊锡的浸润面积小于焊盘或管脚宽度的50%为不良品。•ColdConne