培训教材——电镀

2007924ViaFillingElectrolessplatingcopper沉氧Cu2+氧沉Cu2++2HCHO+4OH¯Cu+2HCOO¯+2H2O+H2PTHDesmearPTHPTH“”R-O-R‘:KMnO4,,4MnO4-C4OH-4MnO42-CO22H2O4MnO4-+40H-=4MnO42-+O2(g)+2H2OMnO42-MnO42-+2H2O+2e-=MnO2(s)+40H-阳极:MnO42--e-MnO4-极:H2O+e-OH-+1/2H2100%,118.9g*3600*/AH_______________________=4.436g/AH96500*RHEM60%4.436g/Ah*60%=2.66g/AH()()MnO2“”3MnO42-+4H+=2MnO4-+MnO2(s)+2H2O2MnO4-+5C2O42-+16H+=2Mn2++10CO2(g)+8H2O5C2O42-+MnO2+4H+=Mn2++2CO2+2H2O:/:,PdPd2++2Sn2+(PdSn2)6+(PdSn2)6+Pd+Sn4++Sn2+Pd+nSn2++3nCl-Pd(SnCl3)nn-:PdSn4+,Pd,:,,,PdSn(OH)4.HBF4SnCl2Sn(OH)4Sn(OH)Cl2SnCl2+2HBF4Sn(BF4)2+2HClSn(OH)4+4HBF4Sn(BF4)4+4H2OSn(OH)Cl+2HBF4Sn(BF4)2+HCl+H2O:.:CuSO4+2HCHO+4NaOHCu+NaSO4+2HCOONa+2H2O+H21.:HCHO+OH-H3COO-H3COO-+OH-HCOO-+H2O+H-H-H0+e-(Pd)2.:Pd+2e-+Cu2+Pd-CuPd-Cu+2e-+Cu2+Pd-Cu+Cu3.:Cu0+2e-+Cu2+Cu0+Cu0镀+-ne-ne-CuCu2++2e-Cu2++2e-Cu()······极极Cu+++2e-CuoEO=+0.34v-------(1)Cu+++e-Cu+EO=+0.15v-------(2)Cu++e-CuoEO=+0.52v2H++2e-H2EO=0v阳极氧CuoCu+++2e-EO=-0.34V2H2O(1)4H++O2+4e-EO=-1.23VEO(c)/(b)„„„bbbbbbbcbcbccccbcccbcccbcccbcccbcbcbb•(SurfaceDistribution)•CoefficientofVariance(CoV)=%100×µσ2ni1ii)X(1n1µ−−=σ∑==∑==µn1iiXn1100%2)Average(1,4,5,6,7)Average(3,TP×=100%J)F,E,Average(A,I)H,G,D,C,Average(B,TP×=100%2)Average(1,4,5,6,7)Average(3,TP×=ThrowingPowerDefinition100%2)Average(1,4,5,6,7)Average(3,TP×=100%J)F,E,Average(A,I)H,G,D,C,Average(B,TP×=4mil5mil6mil4mil5mil6mil7mil5mil镀层结连续良连续镀层裂粒(ViaFilling)Fillupratio=B/Ax100%target=100%Dimple/Dent=A-Btarget=0micronViaShapeBarrel400Taper40075micronvia100micronvia125micronvia65micronRCCSubstrate趋势