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X,,,(,361005):,21.,,.,MEMS.:;;;;:TN305.7:A:167226030(2004)0220117207DevelopmentandApplicationofMicro2Electro2MechanicalSystemLINZhong2hua,HUGuo2qing,LIUWen2yan,ZHANGHui2jie(DepartmentofMechanicalandElectricalEngineering,XiamenUniversity,Xiamen361005,China)Abstract:Micro2Electro2MechanicalSystem(MEMS)developesonthebasisofmicroelectronics.Itisascien2tificresearchesfrontierofmulti2disciplinesandahightechnologyinthe21stcentury.Thispaperpresentsthebackground,characteristicsandbasicresearch.TheprincipaltechniquesofMEMSsuchasmaterial,designandsimulation,micromachining,packagingandtestingarereviewed,Typicmicroapparatus,applicationprospectandthestate2of2artofMEMSarealsodiscussedinthispaper.Furthermore,somepointsofviewofdevelopingonMEMSinthefutureareputforward.Keywords:micro2electro2mechanicalsystem;basicresearch;micromachining;microsensor;state2ofartandprospect1MEMS,2070[1],.2080,Middelhoek[2],.1987IEEEMicro2robotsandTele2operatorssmallma2chines,largeopportunities,(microelectro2mechanicalsystem,MEMS),[3].,,.,.,1989(Twente)MicroMechanics.1990,MST(microsystem2technolo2gy).,.951.LIGA.,,,Micro2Machine,1988X:2004203203.:(1975),,.2220046NanotechnologyandPrecisionEngineeringVol.2No.2Jun.2004©1994-2007ChinaAcademicJournalElectronicPublishingHouse.Allrightsreserved.[4].MEMS.,,(/).,.,..,,,.1MEMS[5].1MEMSMEMS[68].(1)MEMS,,,,,.6.45cm2(1in2)3232(OXC),,,.MEMS,,,.MEMS,(),().MEMS,[9],f=NMEMS.MEMS,,,,MEMS.(2)MEMS(IC),MEMS,MEMS,;2%,,MEMS.(3)MEMS,,,..(4)MEMS,/,/,.(5)MEMS,.,.2MEMS2.1[10,11].,,,.,(),,,,.L1mm,1m,81122©1994-2007ChinaAcademicJournalElectronicPublishingHouse.Allrightsreserved.(L3)10-9,(L2)10-6,1000,,.,,,,,.,,,,,,..2.2MEMS[5,10,12,20,24,33],,MEMS,MEMS,MEMS.2.2.1MEMSCADCAD,,.CAD,MEMS:MEMS,;,;MEMS.MEMSCAD,MEMSMEMSCAD.:TannerTOOLSVLSI;,ANSYS;MEMS.MEMSCAD/,.MEMSCAD/CFDResearchCorporation,Coventor(MicrocosmTechnologies),IntegratedSystemsEngineering.,MEMSCAD.2.2.2MEMSMEMS.(1)MEMS,.:SOI();GaAs;SiC;InP.MEMS,Microparts.(2),,.MEMS,.PZTMEMS,,,.MEMS.2.2.3MEMS(1)MEMS,,.().,,..,,KOH:(111)()=1,(100)=300400,(110)=600,600,.,(DRIE)10.(2)MEMS.,,.SiO2,,SiO2,.MEMS,.MEMSMEMS.(3)91120046:©1994-2007ChinaAcademicJournalElectronicPublishingHouse.Allrightsreserved.(4)MEMS(foundry)MEMSMEMS,,MEMSMEMS,MEMSfoundry.MEMSfoundry:BFGoodrichAdvancedMicroMachineCMP.MEMSfoundryMEMS,MEMS,,.(DARPA)MEMS,MEMS2Exchange.,MEMS,MEMSMEMS2Exchange.2.2.4MEMS,MEMS.MEMS,,,,;MEMS,;,.MEMS,MEMS,MEMS,MEMS70%.MEMSMEMS.MEMS,,MEMS[21][22].CincinnatiMEMS[23].2.2.5MEMSMEMS.MEMSMEMS,.MEMS,,.3MEMSMEMS[2428],MEMS,,.,MEMS.3.1MEMS.1962,MEMS,MEMS,MEMS.pH.,.3.2.,..,.MEMS2000,DellmannL(ElasticForceMotor),1Nnm,10W.EFM,.ZnO,20kHz,4V,.,,.3.3,,.MEMS02122©1994-2007ChinaAcademicJournalElectronicPublishingHouse.Allrightsreserved.(MOEMS).2000,Guo2DungJSuDARPA,(2D),(10m)(SOI),.3.4,.,,.10..,..3.515cm,120g,,.16km,3060km/h2030min.,.MIT(),3050km/h,1h,.3.6,1W10W.MIT1996.MEMS,(),/.,1cm1020W0.050.1N,100W.MIT,56..15mm12mm25mm.,15N,10100.TRW(CIT).,10410610cm,3mm5mm.4MEMS[2935],MEMS.4.1MEMS21MEMS,,MEMS.,MEMS;;uTAS(MicroTotalAnalysisSystem),EurimusEuropractice.;,,MCNCSANDIA;BOSCH.MEMS.,(DMD),.,1995,15.2002380,1.,MEMS,MEMS.MEMS30,.(1),100/,,1000;1100/;,1.MEMS,61.(2),MEMS,,12120046:©1994-2007ChinaAcademicJournalElectronicPublishingHouse.Allrightsreserved.()16..5.2MEMS,MEMS,,;,.5.3,SCREAMLIGAMAMOS(MOSFET),.5.4(),,,,,.5.5MEMSMEMS,20%90%,.MEMSIC,MEMS,,,MEMS.5.6MEMS,,,N2S.MEMS;,22122©1994-2007ChinaAcademicJournalElectronicPublishingHouse.Allrightsreserved.:[1]TerrySC,HermanJH,AngelJB.Agaschromatographairanalyzerfabricatedonasiliconwafer[J].IEEETransElectronDevices,1979,ED2261880.[2]MiddelhoekS,AudetSA,SiliconSensors[M].NewYork:AcademicPress,1989.[3]FluitmanJ.Microsystemstechnology:objectives[M].Sen2sorsandActuators,1996,A56:151166.[4]HiranoT.Japaneseactivitiesinmicromachining[J].MSTNews,1995,14:1417.[5],,.MEMS[J].,2002(1):2227.[6][Z].[7],,.[J].,2001(1):48.[8],,.(MEMS)[J].,2002,21(8):15.[9],.[J].,1998,18(1).[10],,,.[J].,2003,17(1):107110.[11],,,.MEMS[M].:,2002.[12],,,.MEMS[J].,2002,30(11):18.[13][]MenzW,MohrJ,PaulO.[M].,.:.2003.[14][]StephenA,Campbell.[M].,,.:,2003.[15]MarcMadou.FundamentalsofMicroFabrication[M].CRCPress,1997.[16]JackWJudy.Microelectromechanicalsystems(MEMS)fabrication,designandapplications[J].JofSmartMate2rialsandStructures,2001(10):11151134.[17].IC&MEMS[J].,2003(3):1216.[18],.[J].,2001,26(8):15.[19].[J].,2003,14(2):159164.[20]TongQY,[seleG.Semiconductorwaferbonding[J].AWiley2IntersciencePublication,1999.[21],,,.MEMS[J].,2003,28(6):710.[22],.MEMS[J].,2003,22(5):5860.[23]BoustedtK,PerssonK,StrannebyD.Flipchipasanen2ablerforMEMSpackaging[A].In:2002ElectronicCom2ponentsandTechn