搜索
I摘要所谓蓝牙技术，实际上是一种短距离无线电技术，利用“蓝牙”技术，能够有效地简化掌上电脑、笔记本电脑和移动电话手机等移动通信终端设备之间的通信，也能够成功地简化以上这些设备与因特网Internet之间的通信。本文选择蓝牙技术为研究对象。首先对蓝牙通信技术协议规范进行了深入地研究，并着重论述了规范的各个协议层，包括基带层、射频、链路管理层、逻辑链路控制与适配层、服务发现协议以及串口仿真协议。其次，根据蓝牙耳机的开发特点，介绍了本课题采用的蓝牙单芯片软件开发平台Bluelab和硬件开发平台。在此基础之上，分析蓝牙技术在移动电话中的应用，根据蓝牙Headset的原理，实现了Headset和语音网关之间从协议栈底层到上层蓝牙链路的建链过程（ACL、L2CAP、RFCOMM链路），并设计出Headset高层应用的系统流程，最终实现软件编程和调试。同时，基于英国CSR公司（CambridgeSiliconRadio）的蓝牙芯片Bluecore2-External，完成了蓝牙耳机的硬件系统设计，并给出具体解决的方案。综上所述，本文阐述了蓝牙技术的一个应用模型——无线蓝牙耳机，并在此基础上，较全面地论述了蓝牙通信技术的协议规范及其应用开发的方法及步骤，掌握了蓝牙无线接入技术，为将来进一步深入研究蓝牙技术、开发蓝牙产品奠定了坚实的基础。关键词蓝牙；协议规范；硬件开发平台；Bluecore2-External；蓝牙耳机IIAbstractTheso-calledBluetoothtechnology,isactuallyashort-rangeradiotechnology,theuseofBluetoothtechnology,whichcaneffectivelysimplifythepalm-sizedPCs,notebookcomputersandmobilephonesandothermobilephonesforcommunicationbetweenterminalequipment,butalsotosimplifythesuccessoftheaboveequipmentandInternetcommunicationsbetweentheInternet.ThethesisstressedonBluetoothtechnologyfortheresearchobject.Firstofall,IdeeplyresearchedtheprotocolspecificationofBluetoothtechnology,includingRF,BB,LMP,L2CAP,andRFCOMM.Then,accordingtothecharacteristicofBluetoothHeadset,IpresentedembeddedBluetoothsoftwaredevelopmentplatform(Bluelab)andhardwaredevelopmentplatform.BasedontheapplicationofBluetoothtechnologyinthemobiletelephone,IanalyzedtheprincipleofBluetoothHeadset,includingtheestablishmentoflinkfrombottomstackuptohigherlayers(ACL,L2CAP,RFCOMM)andapplicationmovement,andworkedouttheprocessofsystemandapplicationsoftwarerealization.Inaddition,IdesignedhardwaremodelofBluetoothWirelessHeadsetandsolutionusingCSR’sBluecore2-ExternalmoduleandatoolsetofBluelab.Inconclusion,thethesisdiscussesBluetoothSpecificationandBluetoothdevelopmentonthebasisofBluetoothHeadset,makesuslearnthecoretechnologyofBluetooth,andsetsupafirmlybaseforfuturecomplicatedresearchanddevelopmentinBluetooth.KeywordsBluetooth；ProtocolSpecification；Hardwaredevelopmentplatform；Bluecore2-External；Bluetoothheadset目录摘要·································································································IAbstract····························································································II第1章绪论··················································································11.1蓝牙技术的发展现状和趋势·······················································11.1.1各种电话系统··································································11.1.2无线电缆········································································21.1.3无线公文包·····································································21.1.4各类数字电子设备····························································21.1.5电子商务········································································21.1.6将来的应用·····································································31.2蓝牙技术与其他相关技术的比较分析···········································31.3本文主要研究工作····································································5第2章蓝牙协议规范的介绍································································62.1蓝牙的协议体系结构·································································62.2基带层规范············································································82.2.1物理信道与物理链路·························································82.2.2分组组成········································································92.2.3分组类型·······································································102.2.4蓝牙的纠错技术······························································122.3链路管理器协议（LMP）·························································132.3.1通用规则·······································································142.3.2设备功能·······································································142.3.3链路控制器管理······························································142.4逻辑链路控制和适配协议（L2CAP）··········································172.5服务发现协议（SDP）·····························································182.5.1客户机与服务器的交互方式···············································182.5.2服务记录信息交换···························································192.5.3服务属性·······································································202.5.4服务搜索·······································································202.5.5通用独特标识符······························································202.5.6服务搜索样本（SDPPattern）············································212.5.7服务浏览·······································································212.6电缆替代协议RFCOMM··························································22第3章蓝牙系统的硬件设计·······························································243.1Bluecore02-external芯片介绍······················································243.2开发平台的硬件资源·······························································253.2.1硬件开发平台的介绍························································253.2.2硬件开发平台的整体架构··················································263.2.3硬件开发平台的接口·····································