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上海交通大学硕士学位论文晶圆针测技术之异常问题分析与研究姓名：罗士凯申请学位级别：硕士专业：软件工程指导教师：汪辉;胡毓麟20071022摘要IC测试主要分为晶圆针测以及成品测试，其主要功能为检测出IC在制造过程中所发生的瑕疵并找出其中根本原因，以确保产品良率正常及提供测试资料作为IC设计及IC制造分析之用。晶圆针测是针对整个芯片上的完整晶粒，以探针的方式扎在每颗晶粒上的焊垫进行检测，用来筛选芯片上晶粒之良品与不良品，另外在内存晶圆测试时，可针对可修护之晶粒予以雷射修补，以提高芯片的良率；然而，如何减少测试时间与降低测试时所发生的误宰，则是晶圆针测中的瓶颈。在测试生产线上，昂贵的测试机台为主要的生产设备，机台折旧为主要的营运成本，也就是说机台闲置一个小时就有一个小时的折旧损失，因此，机台的产能利用率就关系到一个测试厂的营运状况。机台若能不断地正常生产,这也代表着机台以及产能利用率的提升;因此,要是在生产过程当中有不正常的异常状况发生时，如何能有效地分析问题并即时找到相对应的预防措施是非常重要的。在晶圆探针测试当中，常会由于测试环境或是针测机台参数的改变，使得针痕不正常偏移并打出开窗区，造成测试时的误宰,因而造成公司的损失，本文将就晶圆针测中，由于不正常针痕偏移问题探讨进行分析与研究。关键词：晶圆针测,误宰,针痕偏移ABSTRACTICtestingcanbesortedbyWaferprobingandFinialtesting,theirmainfunctionistoinspectthedefectiveIC,whichisinwaferfabrication,andthenfindouttherootcauseamongthedefectiveIC.TheycanmakesuretheproductyieldiscorrectandprovidethetestingdataforICdesigningandmanufacturinganalyzing.Waferprobingcandistinguishthegooddieandbaddiebycontactingthealuminumpadonthewaferforeachdie.Forthememoryproducts,LaserRepaircanrepairtherepairablediceinaddition.Itcanimprovetheyieldforthewaferprobing.However,howtoreducethetestingtimeandoverkillthatisthebottleneckinwafertestingprocess.Onthetestingproductionline,thecostlytestersaretheprimaryproductionequipments.Theequipmentdepreciationisthemajorworkingcost.Forinstance,iftheequipmentisidledforonehour,itwouldcostcompanyonehourdepreciationloss.So,theutilizationratiooftheequipmentisthemajorconcerningforthetestingfactory.Thatismeansifyoucouldkeeptheequipmentproductionnormallyandcontinually,thatisstandfortheutilizationoftheequipmentisveryefficiency.Therefore,itisveryimportantifyoucouldanalyzetheproblemefficiently;findthepreventionandsolutionmethodstimelywhenanyabnormalisoccurredduringtheproduction.Duringthewafertestingprocess,duetothetestingenvironmentorproberparameterischangedthatcouldcauseprobemarkshiftingabnormallyandevenprobemarkoutofthealuminumpad.Thatwillcauseoverkillanddiminishthecompany’sprofit.Soathere,Iwillsharemyknowledgeandresearchresultsonprobemarkabnormallyduringthewafertestingprocess.KEYWORDS:Waferprobing,Overkill,andProbemarkshifting图片目录图1.1IC制造流程图·································································································1图1.2论文研究架构·································································································3图2.1IC分类图········································································································5图2.2墨水点···········································································································11图2.3晶圆测试流程······························································································12图3.1晶圆测试设备组合架构··············································································15图3.2AC规格参数图·····························································································17图3.3精密量测模块图··························································································17图3.4DC规格参数图····························································································18图3.5PinElectronics的电路图··············································································18图3.6TSKUF200A8吋晶圆针测机·····································································20图3.7针测机上货操作流程图··············································································21图3.8悬臂梁式探针卡··························································································25图4.1异常针痕图··································································································27图4.2鱼骨图(A)····································································································27图4.3实验方式示意图··························································································29图4.4针压高度对时间的变化曲线图··································································30图4.5修改前及修改后的针痕比较图··································································31图4.6焊垫上铜裸露现象图··················································································33图4.7鱼骨图(B)·····································································································34图4.8承载台2段式上升图解··············································································35图4.9承载台2段式上升实验结果······································································36图4.10TSKUF170针测机上针痕实验结果图····················································37图4.11TELP8承载台在Z轴速度调整后实验结果图·······································38图4.12异常针痕示意图························································································40图4.13鱼骨图(C)···································································································41图4.14探针卡DUT分布图··················································································44图4.15探针卡出针方向示意图············································································44图4.16测试TouchdownMap图···········································································46图4.17A、B、C实验位置示意图··········································