LPS22HB-HW-guideline

December2015DocID027655Rev21/26:hardwareguidelinesforsystemintegrationIntroductionThepurposeofthisapplicationnoteistointroduceguidelinesforthehardwareintegrationofSTMicroelectronics'sLPS22HBandLPS25HBpressuresensorsinthefinalcustomer'sapplication.ContentsAN46722/26DocID027655Rev2Contents1Systemintegration..........................................................................52Mechanicaldesignrules.................................................................72.1Sensorplacement.............................................................................72.1.1Expositiontotheenvironment............................................................72.1.2Heatpropagation................................................................................82.1.3Mechanicalstress.............................................................................122.2Sensorembodimentandhousing....................................................132.3Sensorprotection............................................................................153Referencedesign:integrationandhousingonapersonaldevice......................................................................................................164UsecaseandconfigurationexamplefortheLPS22HB..............184.1Maindevicesettings........................................................................205UsecaseandconfigurationexamplefortheLPS25HB..............225.1Maindevicesettings........................................................................226Revisionhistory............................................................................25AN4672ListoftablesDocID027655Rev23/26ListoftablesTable1:ODRconfiguration......................................................................................................................18Table2:FIFOmodeselection..................................................................................................................21Table3:ODRconfiguration......................................................................................................................22Table4:Temperatureresolutionconfiguration.........................................................................................23Table5:FIFOcoefficientfilter...................................................................................................................23Table6:FIFOMEANMODEconfigurationsfordifferentapplicationscenarios.......................................24Table7:Documentrevisionhistory..........................................................................................................25ListoffiguresAN46724/26DocID027655Rev2ListoffiguresFigure1:Pressuresensorsystemintegration............................................................................................5Figure2:Pressuresensorintegrationandembodimentreference............................................................8Figure3:Pressuresensorintegrationandembodimentwithventchannel................................................8Figure4:Heatingisolationimplementedforprotectingthesensor............................................................9Figure5:Topviewofthesensorhousing:ontheleftacorrectdesignwiththeheatisolation,ontherightawrongdesign..........................................................................................................................................10Figure6:SensorwithacorrectsensorplacementonthePCBtogettheappropriateisolationfromheatsources.....................................................................................................................................................10Figure7:SensorwithabadwiringonthePCB........................................................................................11Figure8:SensorwiringwithwrongplacementonthePCB.....................................................................11Figure9:Badconfigurationformechanicalstress(a)..............................................................................12Figure10:Badconfigurationformechanicalstress(b)............................................................................12Figure11:Goodconfigurationforavoidingmechanicalstressandreducingthedeadvolume(a).........12Figure12:Goodconfigurationforavoidingmechanicalstressandreducingthedeadvolume(b).........13Figure13:Exampleofgoodsensorembodimentandhousing................................................................14Figure14:Exampleofgoodsensorembodimentandhousingwithairflowchannel...............................14Figure15:Exampleofabadsensorembodimentandhousing...............................................................15Figure16:Integrationofthedigitalpressuresensordeviceinasensorchamberwithtwoventapertures..................................................................................................................................................................16Figure17:Deviceintegrationreferenceinaportabledevice...................