LNK562-564中文资料

表1.输出功率表注释:1.输出功率可能会受特定的应用参数，包括磁芯尺寸及无箝位应用的限制（请参考主要应用手册）。2.最小的持续输出功率是在典型的无风冷密闭适配器中、环境温度为50°C的条件下测量得到的。3.最小的实际持续输出功率是在敞开式设计及足够的散热，环境温度为50°C的条件下测量得到的。4.封装：P:DIP-8B，G:SMD-8B，D：SO-8C。关于无铅封装形式，请参考订购信息。November2008LNK563P/G/DLNK562P/G/DLNK564P/G/D版本H11/082LNK562-564PI-4547-011107FBDSBPSSSPPackage(DIP-8B)GPackage(SMD-8B)8571423DSFBSSBPDPackage(SO-8C)857142S6LNK562-5643版本H11/0860002068kHz64kHzVDRAINPI-3660-0813035004003002001000版本H11/084LNK562-564DSFBBPJ3-1RTN6V,0.33AJ3-2LJ-1J-2ND11N4937RF1*8.2Ω2.5WC110µF400VC20.1µF50VL13300µHD4UF4002D31N4005C5220µF25VC3330nF50VC4*100pF250VAC*OptionalcomponentsR32kΩVR1*1N5240B10VR23kΩR137.4kΩT1EE16217645D21N400590-265VACLinkSwitch-LPPI-4106-010208U1LNK564PNLNK562-5645版本H11/08版本H11/086LNK562-564+-+-LinkSwitch-LPLNK562-5647版本H11/08+HVDCINPUT-+InputFilterCapacitor-DCOUTPI-4582-021407Maximizehatchedcopperareas()foroptimumheatsinkingTOPVIEWTransformerLinkSwitch-LPDFBBPSSSSCBPY1-CapacitorOutputFilterCapacitor图7.使用D封装的LinkSwitch-LP的推荐电路板布局（假设为高压直流输入）版本H11/088LNK562-564D封装：(θJA)............................100°C/W(3);80°C/W(4)(θJC)(2)....................................................30°C/W4.在靠近塑料封装体表面的引脚8（源极）测量。LNK562-5649版本H11/08版本H11/0810LNK562-564LNK562-56411版本H11/08图8.常规测试电路图11.峰值负脉冲漏极点图10.输出导通图9.占空比测量版本H11/0812LNK562-564图12.击穿电压与温度的特性曲线图13.频率与温度的特性曲线图14.限流点与温度的特性曲线图15.反射引脚与温度的特性曲线图16.旁路引脚启动波形图17.输出特性LNK562-56413版本H11/08器件订购信息LinkSwitch产品系列LP系列号封装信息G塑封表面贴DIPP塑封直插式DIPD塑封SO-8封装无铅封装N纯镀锡封装(符合RoHS)G满足RoHS及无卤素的法规(仅限P和D封装)带装&卷轴装及其它包装形式Blank标准配置TL带装&卷轴装，至少1000个，仅适用于G封装。D封装有2500个。不适用于P封装。LNK562DN-TL图18.C0SS与漏极电压的特性曲线版本H11/0814LNK562-564LNK562-56415版本H11/08PI-4526-040207D07CSO-8C3.90(0.154)BSCNotes:1.JEDECreference:MS-012.2.Packageoutlineexclusiveofmoldflashandmetalburr.3.Packageoutlineinclusiveofplatingthickness.4.DatumsAandBtobedeterminedatdatumplaneH.5.Controllingdimensionsareinmillimeters.Inchdimensionsareshowninparenthesis.Anglesindegrees.0.20(0.008)C2X145826.00(0.236)BSCD4A4.90(0.193)BSC20.10(0.004)C2XD0.10(0.004)C2XA-B1.27(0.050)BSC7X0.31-0.51(0.012-0.020)0.25(0.010)MCA-BD0.25(0.010)0.10(0.004)(0.049-0.065)1.25-1.651.75(0.069)1.35(0.053)0.10(0.004)C7XCHo1.27(0.050)0.40(0.016)GAUGEPLANE0-81.04(0.041)REF0.25(0.010)BSCSEATINGPLANE0.25(0.010)0.17(0.007)DETAILADETAILACSEATINGPLANEPin1IDB4+++4.90(0.193)1.27(0.050)0.60(0.024)2.00(0.079)ReferenceSolderPadDimensions+版本注释日期E1)最终发布的数据手册10/05F1)PI-3924已做修改10/05G1)增加SO-8封装信息2/07H1)器件订购部分新增无卤素产品信息11/08版本H11/0816LNK562-564了解最新信息，请访问我们的网站：(includingtransformerconstructionandcircuitsexternaltotheproducts)maybecoveredbyoneormoreU.S.andforeignpatents,orpotentiallybypendingU.S.andforeignpatentapplicationsassignedtoPowerIntegrations.AcompletelistofPowerIntegrationspatentsmaybefoundat:1.ALifesupportdeviceorsystemisonewhich,(i)isintendedforsurgicalimplantintothebody,or(ii)supportsorsustainslife,and(iii)whosefailuretoperform,whenproperlyusedinaccordancewithinstructionsforuse,canbereasonablyexpectedtoresultinsignificantinjuryordeathtotheuser.2.Acriticalcomponentisanycomponentofalifesupportdeviceorsystemwhosefailuretoperformcanbereasonablyexpectedtocausethefailureofthelifesupportdeviceorsystem,ortoaffectitssafetyoreffectiveness.ThePIlogo,TOPSwitch,TinySwitch,LinkSwitch,DPA-Switch,PeakSwitch,EcoSmart,Clampless,E-Shield,Filterfuse,StakFET,PIExpertandPIFACTSaretrademarksofPowerIntegrations,Inc.Othertrademarksarepropertyoftheirrespectivecompanies.©2008,PowerIntegrations,Inc.全球销售支持网络全球总部5245HellyerAvenueSanJose,CA95138,USA.Main:[phone]CustomerService:Phone:[phone]Fax:[phone]e-mail:[e-mail]中国（上海）Room1601/1610,Tower1KerryEverbrightCityNo.218TianmuRoadWestShanghai,P.R.C.200070Phone:[phone]Fax:[phone]e-mail:[e-mail]中国（深圳）RmA,B&C4thFloor,BlockC,ElectronicsScienceandTechnologyBldg.,2070ShennanZhongRd,Shenzhen,Guangdong,China,518031Phone:[phone]Fax:[phone]e-mail:[e-mail]德国Rueckertstrasse3D-80336,MunichGermanyPhone:[phone]Fax:[phone]e-mail:[e-mail]印度#1,14thMainRoadVasanthanagarBangalore-560052IndiaPhone:[phone]Fax:[phone]e-mail:[e-mail]意大利ViaDeAmicis220091BressoMIItalyPhone:[phone]Fax:[phone]e-mail:euro