SEMI-F047-000-0706-en电压暂升暂降标准

SEMI®SEMIF47-0706SPECIFICATIONFORSEMICONDUCTORPROCESSINGEQUIPMENTVOLTAGESAGIMMUNITYThisstandardwastechnicallyapprovedbytheglobalFacilitiesCommittee.ThiseditionwasapprovedforpublicationbytheglobalAuditsandReviewsSubcommitteeonMay16,2006.Itwasavailableat:Thisdocumentwascompletelyrewrittenin2006.ThisdocumentreplacesSEMIF47-0200andSEMIF42-0600.1Purpose1.1Semiconductorfactoriesrequirehighlevelsofpowerqualityduetothesensitivityofequipmentandprocesscontrols.Semiconductorprocessingequipmentisespeciallyvulnerabletovoltagesags.Thisspecificationdefinesthevoltagesagimmunityrequiredforsemiconductorprocessing,metrology,andautomatedtestequipment.Thisspecificationstrikesabalancebetweenvoltagesagimmunityandincreasedequipmentcost.NOTE1:Therequirementsandrecommendationsinthisinternationalspecificationweredevelopedtosatisfysemiconductorindustryneeds.Whiledifferingfromothergenericrequirements,thisindustry-specificsetofrequirementsandrecommendationsisnotinconflictwithknowngenericequipmentregulationsfromotherregionsorgenericequipmentspecificationsfromotherorganizations.NOTE2:Tominimizedesigneffortandtesting,thisrevisionalignsSEMIF47testmethodswithapplicableIECstandards,whileretainingthepreviousSEMIF47testlevels.Italsoincorporatesknowledgegainedinthefirstfiveyearsofexperiencewiththisspecification.2Scope2.1Thisspecificationsetsminimumvoltagesagimmunityrequirementsforequipmentusedinthesemiconductorindustry.Immunityisspecifiedintermsofvoltagesagdepth(inpercentofnominalvoltageremainingduringthesag)andvoltagesagduration(incyclesorseconds).Thisspecificationalsosetsprocurementrequirements,testmethods,pass/failcriteria,andtestreportrequirements.2.2Theprimaryfocusofthisspecificationissemiconductorprocessingequipmentincludingbutnotlimitedtothefollowingtypes:Etchequipment(Dry&Wet)Filmdepositionequipment(CVD&PVD)ThermalequipmentSurfaceprepandcleanequipmentPhotolithographyequipment(Scanner,Stepper&Tracks)IonImplantequipmentMetrologyequipmentAutomatedtestequipmentChemicalMechanicalPolishing/Planarizationequipment2.2.1Thesecondaryfocusofthisspecificationissubsystemsandcomponentsthatareusedintheconstructionofsemiconductorprocessingequipment,includingbutnotlimitedto:PowersuppliesRadiofrequencygeneratorsandmatchingnetworksUltrasonicgeneratorsComputersandcommunicationsystemsRobotsandfactoryinterfacesACContactorcoilsandACrelaycoilsChillersandcryopumps1SEMIF47-0706©SEMI1999,2006LicensedbySEMItoGuangJieQiDownloaded:2011-09-21Single-userlicenseonly,copyingandnetworkingprohibited.SEMI®PumpsandblowersAdjustablespeeddrives2.3Thisspecificationappliestosemiconductorprocessingequipmenttoincludetheequipmentmainframeandallsubsystemswhoseelectricalpowerisdirectlyaffectedbytheoperationoftheequipment’sEMO(emergencyoff)system.2.4GrandfatherClause—Equipment,subsystems,andcomponentsthatweretestedorcertifiedunderthepreviousversionofthisspecification,priortothepublicationdateofthisspecification,donotrequirere-testingorre-certificationuntilhardwareorsoftwaredesignchangesthatcouldaffectvoltagesagimmunityareimplemented.NOTICE:Thisstandarddoesnotpurporttoaddresssafetyissues,ifany,associatedwithitsuse.Itistheresponsibilityoftheusersofthisstandardtoestablishappropriatesafetyandhealthpracticesanddeterminetheapplicabilityofregulatoryorotherlimitationspriortouse.3Limitations3.1Notincludedinthissetofrequirementsandrecommendationsareover-voltageconditions(voltageswells),highfrequencyimpulseevents,andotherpowerdisturbances.Ifnecessary,theInformationTechnologyIndustryCouncil(ITIC)curvecontainedinIEEE1100andSEMIE51canbeusedtospecifyadditionalrequirementsoutsidethescopeofthisspecification.3.2Thisspecificationdoesnotaddresswaferqualityvariationsthatmaybecausedbyvoltagesags.Itisrecommendedthatequipmentmanufacturersconsidertheeffectsofvoltagesagsontheirequipmentprocesses.Ifvoltagesagsthatareshallowerand/orshorterthanthoseinTable1canresultinknownwaferqualityproblems,itisrecommended(butnotrequired)thatapowerqualitysensorcoupledtoanotificationschemebeincludedintheequipmentdesign.3.3Thisspecificationaddressesvoltagesagimmunityofsemiconductorprocessingequipment.Voltagesagimmunityoffactorysystems,andelectricutilityvoltagesagperformance,arecoveredinotherrelatedstandards.3.4Thisisaperformancespecification.Itdoesnotaddressdesignissuesrelatedtosafety,whicharecoveredelsewhereinSEMIStandards(seeSEMIS2).3.5Safety-relatedsystemsmayrequirevoltagesagimmunityforconditionsuptoandincludingfullpowerfailure.Further,ifhazardscouldresultfromvoltagesagsdeeperand/orlongerthanthoseconsideredinthisspecification,provisionshouldbemadetonegateoreliminatesuchhazards.3.6Conflictsbetweenthisspecificationandsafetyrequirements(suchasSEMIS2)thatcannotbeotherwiseresolvedshallbedecidedinfavorofsafetyrequirements.3.7Thisspecificationdoesnotpre-emptoroverrideinternational,national,andlocalcodesthatmayapplyindifferentfacilitylocations.Suchcodes,regulations,andlawsshouldbeconsultedtoensurethatequi