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JEDECSTANDARDFlipChipTensilePullJESD22-B109JUNE2002JEDECSOLIDSTATETECHNOLOGYASSOCIATIONNOTICEJEDECstandardsandpublicationscontainmaterialthathasbeenprepared,reviewed,andapprovedthroughtheJEDECBoardofDirectorslevelandsubsequentlyreviewedandapprovedbytheJEDEClegalcounsel.JEDECstandardsandpublicationsaredesignedtoservethepublicinterestthrougheliminatingmisunderstandingsbetweenmanufacturersandpurchasers,facilitatinginterchangeabilityandimprovementofproducts,andassistingthepurchaserinselectingandobtainingwithminimumdelaytheproperproductforusebythoseotherthanJEDECmembers,whetherthestandardistobeusedeitherdomesticallyorinternationally.JEDECstandardsandpublicationsareadoptedwithoutregardtowhetherornottheiradoptionmayinvolvepatentsorarticles,materials,orprocesses.BysuchactionJEDECdoesnotassumeanyliabilitytoanypatentowner,nordoesitassumeanyobligationwhatevertopartiesadoptingtheJEDECstandardsorpublications.TheinformationincludedinJEDECstandardsandpublicationsrepresentsasoundapproachtoproductspecificationandapplication,principallyfromthesolidstatedevicemanufacturerviewpoint.WithintheJEDECorganizationthereareprocedureswherebyanJEDECstandardorpublicationmaybefurtherprocessedandultimatelybecomeanANSI/EIAstandard.Noclaimstobeinconformancewiththisstandardmaybemadeunlessallrequirementsstatedinthestandardaremet.Inquiries,comments,andsuggestionsrelativetothecontentofthisJEDECstandardorpublicationshouldbeaddressedtoJEDECattheaddressbelow,orcall(703)907-7559or©JEDECSolidStateTechnologyAssociation20022500WilsonBoulevardArlington,VA22201-3834Thisdocumentmaybedownloadedfreeofcharge;howeverJEDECretainsthecopyrightonthismaterial.Bydownloadingthisfiletheindividualagreesnottochargefororreselltheresultingmaterial.PRICE:PleaserefertothecurrentCatalogofJEDECEngineeringStandardsandPublicationsorcallGlobalEngineeringDocuments,USAandCanada1-800-854-7179,International(303)397-7956PrintedintheU.S.A.AllrightsreservedPLEASE!DON’TVIOLATETHELAW!ThisdocumentiscopyrightedbyJEDECandmaynotbereproducedwithoutpermission.Organizationsmayobtainpermissiontoreproducealimitednumberofcopiesthroughenteringintoalicenseagreement.Forinformation,contact:JEDECSolidStateTechnologyAssociation2500WilsonBoulevardArlington,Virginia22201-3834orcall(703)907-7559JEDECStandardNo.22-B109-i-TestMethodB109TESTMETHODB109FLIPCHIPTENSILEPULLForewordThistestisperformedtodeterminethefracturemodeandstrengthofthesolderbumpinterconnectionbetweentheflipchipdieandthesubstrate.Flipchiptensilepullisadestructivetest.JEDECStandardNo.22-B109TestMethodB109-ii-JEDECStandardNo.22-B109Page1TestMethodB109TESTMETHODB109FLIPCHIPTENSILEPULL(FromJEDECBoardBallotJCB-02-35,formulatedunderthecognizanceoftheJC-14.1SubcommitteeonReliabilityTestmethodsforPackagedDevices.)1ScopeThistestmethodisapplicabletoflipchipdieafterthedieandsubstratesolderjointisformed,butpriortoapplicationofunderfillorothermaterialsthatincreasetheapparentbondstrength.Itshouldbeusedtoassesstheconsistencyofthechipjoinprocessacrossagivenflipchipdie.2Termsanddefinitions2.1FlipchipdieAnunpackageddiethatformsitsinterconnectiontoasubstratethroughsolderjoints.2.2SolderbumpAdiscreteamountofsolderattachedtothedieexternalmetallurgythatisintendedtoformtheinterconnectiontoasubstrate.2.3SubstrateThesupportingmaterialuponwhichasemiconductordieormultipledieareattached.2.4StudThetoolthatisattachedtothebacksideoftheflipchipdietoperformtensilepulltest.2.5BacksideofflipchipdieThesurfaceofthedeviceoppositethefacetowhichthesolderbumpinterconnectionsareattached.2.6Non-wetsolderbumpsSolderbumpsthatdonotmakebondtothesubstratepadmetallurgyduringthesolderreflowprocess.Itisdetectedasanareaonthesubstratepadwhere,aftertensilepull,thesubstratepadmetallurgydisplaystheoriginalcolorandtexturewithnoevidenceofsolderfusion.Depopulatedareas,wherenosolderjointformationisexpected,areexcluded.JEDECStandardNo.22-B109Page2TestMethodB1092Termsanddefinitions(cont’d)2.7SoldervoidAcavitywithinthesolderjointthatexposesdeviceorthesubstratemetallurgy.2.8SolderpullfractureFracturewithinthebulkofthesolderbumpcolumn.2.9InterconnectTheresultingsolderconnectionbetweendeviceandsubstrateafterreflow.2.10IntermetallicfractureFailurefoundintensilepullofflipchipsolderjoints,whereanyportionofthefracturesurfaceoccursatanintermetallicformedbetweenthesolderandthedeviceorsubstratemetallurgy.2.11DiefractureFailurefoundintensilepullofflipchipsolderjoints,wherethebodyofthedieisfracturedanddamagedbeforeallthesolderbumpsareseparated.2.12ToolfailureFailureofstud,fixture,orothermechanicalapparatusthatpreventstheexecutionofatensilepullonthedie.2.13SubstratefractureFailurefoundintensilepullofflipchipsolderjoints,wherethesubstrateisfracturedanddamagedbeforeallthesolderbumpsareseparated.2.14DelaminationFailurefoundinfortensilepullofflipchipsolderjoints,wherethesolderbumpinterconnectionmetallurgyisatleastpartiallyremovedfromeitherthesubstrateordie,withthesolderbumpremainingcontinuous.2.15UnderfillAdhesivematerialappliedbetweenthesolderbumpsideoftheflipchipdieandthesubstrate.JEDECStandar