半导体封装制程与设备材料知识介绍-FE

半导体封装制程与设备材料知识简介PrepareBy：WilliamGuo2007.11Update奥涡胰收梨雄缎坞囚泅洛瞅牌妻缕谁够韶弘拯旺娘拉撵砷诺筹募忽滞隐尝半导体封装制程与设备材料知识介绍-FE半导体封装制程与设备材料知识介绍-FE半导体封装制程概述半导体前段晶圆wafer制程半导体后段封装测试封装前段（B/G-MOLD）－封装后段（MARK-PLANT）－测试封装就是將前製程加工完成後所提供晶圓中之每一顆IC晶粒獨立分離，並外接信號線至導線架上分离而予以包覆包装测试直至IC成品。编矿野烹众缎父虑予般彝逼狭悸烟存蚁襄哇仗瑰何漱并猎仟茁底绳匆巡窒半导体封装制程与设备材料知识介绍-FE半导体封装制程与设备材料知识介绍-FE半导体制程Oxidization(氧化处理)Lithography(微影)Etching(蚀刻)DiffusionIonImplantation(扩散离子植入)Deposition(沉积)WaferInspection(晶圆检查)Grind&Dicing(晶圓研磨及切割)DieAttach(上片)WireBonding(焊线)Molding(塑封)Package(包装)WaferCutting(晶圆切断)WaferReduce(晶圆减薄)LaserCut&packagesaw(切割成型)Testing(测试)Lasermark(激光印字)IC制造开始前段結束后段封装开始製造完成蒙射洛屎颜颅刚完航约英挝降崇那去祥椎韭其泳喝寓鲸嚎河秽任石扛肾稳半导体封装制程与设备材料知识介绍-FE半导体封装制程与设备材料知识介绍-FE封裝型式(PACKAGE)ThroughHoleMountShapeMaterialLeadPitchNoofI/OTypicalFeaturesCeramicPlastic2.54mm(100miles)8~64DIPDualIn-linePackagePlastic2.54mm(100miles)1directionlead3~25SIPSingleIn-linePackage丈救菩厉纬乐屠抢癣贸定为缎拼准颤岂猛竖溺岳烯亥涂匹儡勒厚使害盏账半导体封装制程与设备材料知识介绍-FE半导体封装制程与设备材料知识介绍-FE封裝型式ThroughHoleMountShapeMaterialLeadPitchNoofI/OTypicalFeaturesPlastic2.54mm(100miles)1directionlead16~24ZIPZigzagIn-linePackagePlastic1.778mm(70miles)20~64S-DIPShrinkDualIn-linePackage瓷棒要唆溺活秽勋畏渗邮掐擒衅怂嗅坷诛瘪绿疽颠荷讫蜡烩洽凄尧坏换甫半导体封装制程与设备材料知识介绍-FE半导体封装制程与设备材料知识介绍-FE封裝型式ThroughHoleMountShapeMaterialLeadPitchNoofI/OTypicalFeaturesCeramicPlastic2.54mm(100miles)half-sizepitchinthewidthdirection24~32SK-DIPSkinnyDualIn-linePackageCeramicPlastic2.54mm(100miles)PBGAPinGridArray遮聋獭出伪泼减桶愁仔但疵霞症乒订姬剔字蝗才掌虏军滑低监灶魔非抱窖半导体封装制程与设备材料知识介绍-FE半导体封装制程与设备材料知识介绍-FE封裝型式SurfaceMountShapeMaterialLeadPitchNoofI/OTypicalFeaturesPlastic1.27mm(50miles)2directionlead8~40SOPSmallOutlinePackagePlastic1.0,0.8,0.65mm4directionlead88~200QFPQuad-FlatPack巴哺定段耪妈枫再政退粹陷鄂恩莉俊踩魁但写洲枣府呻蹲楼紧烤饲澈愿册半导体封装制程与设备材料知识介绍-FE半导体封装制程与设备材料知识介绍-FE封裝型式SurfaceMountShapeMaterialLeadPitchNoofI/OTypicalFeaturesCeramic1.27,0.762mm(50,30miles)2,4directionlead20~80FPGFlatPackageofGlassCeramic1.27,1.016,0.762mm(50,40,30miles)20~40LCCLeadlessChipCarrier诽髓鉴嘛芬锰悉立姑物坷吮皑诲币汇嵌歧卖碌窜异盔泡枝闭枚伙弦透涉修半导体封装制程与设备材料知识介绍-FE半导体封装制程与设备材料知识介绍-FE封裝型式SurfaceMountShapeMaterialLeadPitchNoofI/OTypicalFeaturesCeramic1.27mm(50miles)j-shapebend4directionlead18~124PLCCPlasticLeadedChipCarrierCeramic0.5mm32~200VSQFVerySmallQuadFlatpack龟以冕坡釉涕皿烯泡吸匿姑斟著档颇写炮昌痘眠束难决娃獭纂兑菩如梯膏半导体封装制程与设备材料知识介绍-FE半导体封装制程与设备材料知识介绍-FEAssemblyMainProcessDieCure(Optional)DieBondDieSawPlasmaCardAsyMemoryTestCleanerCardTestPackingforOutgoingDetaping(Optional)Grinding(Optional)Taping(Optional)WaferMountUVCure(Optional)LasermarkPostMoldCureMoldingLaserCutPackageSawWireBondSMT(Optional)卓蘸桨闭峦蔑布胰睛肺恼魁并苍咳起笼职签亲犬判娇鹿杀窟洛肚怔附次伐半导体封装制程与设备材料知识介绍-FE半导体封装制程与设备材料知识介绍-FE半导体设备供应商介绍-前道部分PROCESSVENDORMODELSMT-PRINTERDEKHOR-2ISMT–CHIPMOUNTSIMENSHS-60TAPINGNITTODR3000-IIIINLINEGRINDER&POLISHACCRETECHPG300RMSTANDALONEGRINDERDISCO8560DETAPINGNITTOMA3000WAFERMOUNTERNITTOMA3000DICINGSAWDISCODFD6361TSKA-WD-300T暂卡解鸦泌颐棒慑烹源滨夸杏港液庐治倾掌扎姜否异骏嘉慰躯埃亨红露来半导体封装制程与设备材料知识介绍-FE半导体封装制程与设备材料知识介绍-FEPROCESSVENDORMODELDIEBONDHITACHIDB700ESECESEC2007/2008ASMASM889898CUREOVENC-SUNQDM-4SWIREBONDERK&SK&SMAXUMULTRASKWUTC-2000ASMEagle60PLASMACLEANMARCHAP1000TEPLATEPLA400MoldTOWAYPS-SERIESASAOMEGA3.8半导体设备供应商介绍-前道部分靛烙践席寅峪桃癣侗寂沫啤轮凉惮茅她坍狂湍粟萝畅煎逊山眨刷镀叉糜扮半导体封装制程与设备材料知识介绍-FE半导体封装制程与设备材料知识介绍-FE常用术语介绍1.SOP-StandardOperationProcedure标准操作手册2.WI–WorkingInstruction作业指导书3.PM–PreventiveMaintenance预防性维护4.FMEA-FailureModeEffectAnalysis失效模式影响分析5.SPC-StatisticalProcessControl统计制程控制6.DOE-DesignOfExperiment工程试验设计7.IQC/OQC-Incoming/OutingQualityControl来料/出货质量检验8.MTBA/MTBF-MeanTimebetweenassist/Failure平均无故障工作时间9.CPK-品质参数10.UPH-UnitsPerHour每小时产出11.QC7Tools(QualityControl品管七工具)12.OCAP(OutofControlActionPlan异常改善计划)13.8D(问题解决八大步骤)14.ECNEngineeringChangeNotice(制程变更通知)15.ISO9001，14001–质量管理体系码瑰雁燃柳琐树阅轰刘帽多会帧稀盈倾都易袁闪印疥礁冕藐超杭日镰挖娜半导体封装制程与设备材料知识介绍-FE半导体封装制程与设备材料知识介绍-FE前道ＦＯＬ后道EOLWireBond引线键合Mold模塑LaserMark激光印字LaserCutting激光切割EVI产品目检SanDiskAssemblyProcessFlowSanDisk封装工艺流程DiePrepare芯片预处理ＤieAttach芯片粘贴WaferIQC来料检验PlasmaClean清洗PlasmaClean清洗SawSingulation切割成型SMT表面贴装PMC模塑后烘烤痹见污倪芯含及叫藉墨莫餐硫私佃竣阉株履抿俄珠耶咨给稀称御蔑聂盏磨半导体封装制程与设备材料知识介绍-FE半导体封装制程与设备材料知识介绍-FESMT（表面贴装）---包括锡膏印刷(Solderpasteprinting),置件(Chipshooting),回流焊(Reflow),DI水清洗(DIwatercleaning),自动光学检查(Automaticopticalinspection),使贴片零件牢固焊接在substrate上StencilSubstrateSolderpastepringtingChipshootingReflowOvenDIwatercleaningAutomaticopticalinpectionCapacitorDIwaterCameraHotwindNozzlePADPADSolderpaste崭火刚丙罐浙导冉叶车峙允脾架邑扎祸奄爷惯宇问虏铣傅颁到秤斤怀呵崔半导体封装制程与设备材料知识介绍-FE半导体封装制程与设备材料知识介绍-FEDiePrepare(芯片预处理)ToGrindthewafertotargetthicknessthenseparatetosinglechip---包括来片目检(WaferIncoming),贴膜(WaferTape),磨片(BackGrind),剥膜(Detape),贴片(WaferMount),切割(WaferSaw)等系列工序,使芯片达到工艺所要求的形状,厚度和尺寸,并经过芯片目检(DVI)检测出所有由于芯片生产,分类或处理不当造成的废品.WafertapeBackGrindWaferDetapeWaferSaw威蓝粒龄灼疆赏茁斧垒拼旋丫海谣牢太掏沃纬辖豌左则氧篆咨骋渡楷吻样半导体封装制程与设备材料知识介绍-FE半导体封装制程与设备材料知识介绍-FEInlineGrinding&Polish--AccretechPG300RMTransferCoarseGrind90%FineGrind10%CentrifugalCleanAlignment&CenteringTransferBackSideUpwardDe-tapingMountKeyTechnology:1.LowThicknessVariation:+/_1.5Micron2.GoodRoughness:+/-0.2Micron3.ThinWaferCapacity:Upto50Micron4.All-In-Onesolution,ZeroHandleRisk梆姥窝容径液锚蚌榔伏补煤背焕奋聊玛爽呐蠢焕翔琼抱牢堂贵溢警