Dicing-saw刀具简介

DicingProducts:Blades&FlangesBladesMatrixThroughput&QualityProcessParameters震動轉速TheEffectofDiamondConcentration•Hardercuttingcharacteristics•Highload•Morechippingonhardandbrittlematerials•Min.wear•Lessloading•Freerdicing•Higherwear•BettercutqualityRecommendedSpindleR.P.M.RangeofR.P.M.ONMainApplications:TiC,landdefinitionNickelblade12-14KR.P.M.TiC,cuttingthroughNickelblade12-15KR.P.M.SiliconNickelblade18-20KR.P.M.HardaluminaResinoidblade14KR.P.M.Greenceramic,wetNickelblade12-16KR.P.M.Greenceramic,dryT.Carbideblade10KR.P.M.Sapphire,S.O.S.Resinoidblade8-10KR.P.M.FerritesNickelblade14-18KR.P.M.Resinoidblade10-14KR.P.M.GlassResinoidblade12-14KR.P.M.Siliconon2”sawsNickeltypeblade30-60KR.P.M.ProcessParametersBladeWear-CoolingCompensationBladeSelectionBlades-1•Bladetypeandbinders:---SteelCore:•Thehardestbinderinuse.•Thediamondsonthesebladesarecoatingonlythecuttingedgeoftheblade.•ThesebladesareusedmainlyforsoftmaterialssuchasGreenCeramic.--Nickel:•VerycommonforsoftmaterialssuchasPCB,PZT,GreenCeramicandSilicon.•TheNickelbindergrowstogetherwiththediamondssoallthevolumeofthebladeisequallyfilledwithdiamonds.•Thicknessvariesbetween0.6to15mil.Blades-2•Bladetypeandbinders:--Sintered:•Thesebladesareveryflatandhaveanaccuratethickness.•UsedmainlyforTiC,Quartzandglass.•Verybrittlebinder.•Thicknessvariesbetween5to30mil.--Resinoid::•Softbladesthatareselfdressed.canbeusedforalmostallmaterialswithgoodresults.•Highbladewear.•Diamondgritsizerangesfrom3to200mic.•Thicknessvariesbetween3to50mil.BladesBladesBladesLateralCrackFormationUnderaPointIndentorIndentorCraterTheMechanismofDicingAlternatingStressesUnderAbrasiveParticlePackageSingulationDicingPBGAMountingMethodTheBladeForCSPSingulationMulti-BladeCapabilityTroubleshootingTroubleshooting