EMC-training-塑封树脂技术

1ValueInnovationFirst!Best!Smart!TheBestFineChemicalCompanyElectronicpackagingmaterialteam2012.02EMCTrainingMaterialEMC培训资料2ValueInnovationFirst!Best!Smart!TheBestFineChemicalCompanyContents目录1.Abstract摘要2.RawMaterial原材料3.Manufacture制造4.Properties&Characteristic特性5.CommonMold-abilityProblem&Possibleremedies常见注塑问题及建议3ValueInnovationFirst!Best!Smart!TheBestFineChemicalCompanyAbstract摘要4ValueInnovationFirst!Best!Smart!TheBestFineChemicalCompanyWhatisinsideEMC?EMC中有什么EpoxyResin环氧树脂OCH2CHCH2ORCharacteristicsofepoxyresins环氧树脂的特性1.ResinasathermosettingresinsuitableforEMC热固性树脂适合用于EMC2.Excellentmechanicalstrength.很好的机械强度3.easierthanceramiccanbeusedasgeneral-purposeresin与陶瓷相比制作简单，通用性强4.Invarioustypesofresinshavebeendeveloped树脂种类多5.Hardenersystemshavebeenstudiedinseveralresin.可选择的硬化剂种类多EPOXYMOLDINGCOMPOUND5ValueInnovationFirst!Best!Smart!TheBestFineChemicalCompanyMakeaframeworkintheshapeofthemoldingprocessisaconstant.使得注塑工艺固定SomeofSemiconductorPackagingProcess一些半导体的包封工艺WhatisinsideEMC?EMC中有什么EPOXYMOLDINGCOMPOUND6ValueInnovationFirst!Best!Smart!TheBestFineChemicalCompanyOrganic&inorganiccompounds有机和无机化合物Organic有机EpoxyResin环氧树脂HardenerResin硬化剂Silicone有机硅Wax；蜡OrganicFlameRetardant有机阻燃剂Catalyst催化剂Silica硅微粉InorganicFlameRetardant无机阻燃剂Inorganic无机CouplingAgent偶联剂Colorant着色剂WhatisinsideEMC?EMC中有什么EPOXYMOLDINGCOMPOUND7ValueInnovationFirst!Best!Smart!TheBestFineChemicalCompanyEpoxyMoldCompoundRolesEMC的作用•Protecttheelectriccomponentfromtheenvironment(moisture,temperature,contamination,andetc).保护电子元器件不受环境影响(湿度，温度，污染等)•Protectthechipfrommechanicalshock.保护芯片不受撞击•Providestructureandsupport.提供结构支撑•Provideelectricalinsulation.提供电绝缘性•Heatdissipationonthepackageoperation包封过程中易于热扩散GoodEMCshouldhave:好的EMC应该包含：1.GoodMoldability好的成模性•Goodvisualinspection–Novisualdefectslikeincompletefill,moldvoids,flash,waxstain,sticky,etc.好的视觉检查能力-没有视觉缺陷如为填充，气孔，毛刺，油污，粘模等•Goodwiresweepperformance,Gooddelaminationperformance好的金线冲歪和分层表现•Fastcuring快速固化2.GoodReliability好的可靠性•Goodmoistureresistance(PCTTest)好的潮湿抵抗性（PCT测试）•Goodthermalshockresistance(TCTest)好的抗热冲击性（TC测试）•Othersreliabilitytesting其他可靠性测试8ValueInnovationFirst!Best!Smart!TheBestFineChemicalCompanyCatalyst催化剂Acceleratereactionspeed加速反应进程Below0.5%CouplingAgent偶联剂Bondingbetweenresin&filler使得树脂与硅粉键合Below1%Flameretardant阻燃剂TomeetUL-94requirement达到UL-94标准1~5%WaxProvidereleasebetweenmold&EMC促使EMC与模具分离Below0.5%Lowstressabsorbers低应力吸收剂Reducestress减少应力Below3%Colorant着色剂Coloring,Marking着色,印字below0.5%CompositionofEMCandtheirFunctionalitiesEMC的组分及其作用Epoxy+Hardener环氧树脂和硬化剂Providecrosslinkingreaction提供交联反应10~30%Silica硅粉Givethestrength提供强度72~90%9ValueInnovationFirst!Best!Smart!TheBestFineChemicalCompanyWhatistheCross-linkingreaction?什么是交联反应10ValueInnovationFirst!Best!Smart!TheBestFineChemicalCompanyWhatistheCross-linkingreaction?什么是交联反应A-StageA阶段Rawmaterial原材料B-StageB阶段EMCTabletEMC饼料C-StageC阶段AfterMolding封装好后C-StageC阶段AfterPMC后烘烤后11ValueInnovationFirst!Best!Smart!TheBestFineChemicalCompanyRawMaterial原材料12ValueInnovationFirst!Best!Smart!TheBestFineChemicalCompanyEpoxyResin环氧树脂OCN(Ortho-CresolNovolac邻甲酚酚醛)Bi-phenyl联苯型Multi-Functional(TPM)多官能团DCPD(Di-Cyclopentadiene)环戊二烯Multi-Aromatic(Bi-phenylcontained)多环芳烃CH2OCH2CHCH2OCH2OCH2CHCH2O()nOCH2CHCH2OCH3CH3CH3-Lowcost,Goodmold-ability低成本，好的成模性-MiddleTg,reactivity,waterabsorption中等Tg，反应性和吸水性-Application:应用TR,DIP,PLCC,SOP,QFPOCH2CHCH2OCH2OCHCH2OCH3CH3CH3CH3-LowestViscosity,HighCost&Adhesion低粘度,高成本高结合力-LowTg,reactivity,waterabsorption,Modulus低Tg,反应性，吸水率和模量-Application应用:ThinPKG薄型封装(TSOP,TQFP,TQFN,FBGAetc..)CH2OCHCH2OCHOCH2CHCH2OOCH2CHCH2OOCH2CHOCH2CHOCH2CHCH2O()n-HighestTg,reactivity,waterabsorption,Heatresistance-最高Tg，反应性，吸水率和抗热性-HighCost,Lowwarpage,高成本和低翘曲-Application应用:TR(Highvoltage),BGA-Lowwaterabsorption低吸水率-Highadhesion,toughness,flameretardancy高结合力，刚性和阻燃性-Highcurability高固化性-Lowwaterabsorption低吸水性-Highadhesion高结合力-Hightoughness高强度OCH2CHCH2OCH2CH2OCH2CHCH2OHnBrominatedEpoxy(Br-epoxy)溴化环氧树脂CH2OCH2CHCH2OCH2OCH2CHCH2O()nOCH2CHCH2OBrBrBr-Flameretardancy阻燃性好13ValueInnovationFirst!Best!Smart!TheBestFineChemicalCompanyEpoxyResin(cont.)环氧树脂Summary–PropertiesLevelofEpoxyresin总结—环氧树脂的特性水准Resin树脂Viscosity粘度TgWaterAbsorption吸水率Adhesion结合力Modulus模量OCN23232Biphenyl56414Multi-functional11141Naphthol12523DCPD34323Multi-aromatic4541514ValueInnovationFirst!Best!Smart!TheBestFineChemicalCompanyHardenerResin硬化剂PN(PhenolNovolac)酚醛树脂Xyloc低吸水性Multi-Functional(TPM)多官能团Multi-Aromatic(Bi-phenylcontained)多环芳烃-Lowcost,Goodmold-ability低成本，好的成模性-MiddleTg,reactivity,waterabsorption中等Tg，反应性和吸水率-Application应用:TR,DIP,PLCC,SOP,QFP-HighCost&Adhesion高成本和高结合力-LowTg,reactivity,waterabsorption,Modulus低Tg，反应性，低吸水率和低模量-Application应用:ThinPKG薄型封装(TSOP,TQFP,TQFN,FBGAetc..)-HighestTg,reactivity,waterabsorption,Heatresistance最高的Tg，反应性，吸水率和热抵抗率-HighCost,Lowwarpage,高成本，低翘曲-Application应用:TR(Highvoltage),BGA-Lowwaterabsorption低吸水性-Highadhesion,toughness,flameretardancy高结合力，高韧性，高难燃性-Highcurability高固化性CH2CH()nOHOHOH2CH2()nOHOHCH2CH2OHCH2CHCH()nOHOHOHOHOHOHCH2CH2OHnOHCH2CH215ValueInnovationFirst!Best!Smart!TheBestFineChemic