光刻工艺的研究

毕业设计（论文）报告题目光刻工艺的研究系别尚德光伏学院专业微电子技术（液晶显示技术与应用）班级0902学生姓名赵俊学号090425指导教师丁兰2012年4月无锡科技职业学院毕业设计（论文）光刻工艺的研究i光刻工艺的研究摘要：光刻工艺是半导体制造中最为重要的工艺步骤之一。最重要的光刻工艺是在晶圆便面建立图形复制到硅片上，为下一步进行刻蚀或者离子注入工序做好准备。最后的步骤则是光刻胶的显影到最终检验。本文主要介绍了传统光刻技术和高级光刻工艺。开始介绍了光刻工艺的概述，以及光刻蚀工艺的概况。系统介绍了关于光刻蚀和光刻胶的内容，包括光刻胶的组成及正负胶的比较。然后以传统的十步法分类解析其内容，系统的介绍了这十步流程，然后介绍了光刻质量的分析方法。最后为了展望未来光刻工艺的前景，本文又介绍了高级光刻工艺技术，先是提出集成电路中存在的问题，然后介绍了两种新型的光刻工艺技术，进一步深化我们对于光刻工艺的新技术、新工艺的认识。关键词：光刻胶、曝光、最终检验、前景无锡科技职业学院毕业设计（论文）光刻工艺的研究iiSemiconductorLithographyTechnologyAbstract：Lithographyisoneofthemostimportantprocessinsemiconductormanufacturingsteps.Photolithographyprocessisthemostimportantestablishedcopythegraphictothesiliconwafersurface,readyforetchingorionimplantationprocesstobedonenext.Laststepisphotoresistdevelopertotheultimatetest.ThisarticleprimarilydescribestraditionallithographyandadvancedPhotolithographyprocess.Starttheoverviewoflithography,etchingandlithographyprofiles.Corrosionsystemintroducedonthelithographyandphotoresists,includingcompositionofthephotoresistandpositiveandnegativecomparisonofrubber.Andthenthetraditionalten-stepclassificationanalysisoftheircontent,describesthetenstepsofsystemprocessesanddescribesqualityanalysismethodoflithography.Finallyinordertolooktothefutureprospectsoflithography,thisarticlealsodescribesadvancedlithographytechnology,firstraisedproblemsintheintegratedcircuit,andthenintroducedthetwonewlithographytechnology,furtherdeepeningourawarenessofnewtechnologyandnewprocessofPhotolithographyprocess.KeyWords:Photoresist、Exposure、Finaltesting、Prospects无锡科技职业学院毕业设计（论文）光刻工艺的研究iii目录前言................................................................................................................................11.1光刻工艺的概述.....................................................................................................21.2光刻蚀工艺概况.....................................................................................................21.3光刻胶的组成材料及感光原理..............................................................................51.3.1光刻胶的组成材料........................................................................................51.3.3正胶和负胶的比较........................................................................................6第2章光刻工艺流程..................................................................................................72.1光刻工艺十步法.....................................................................................................72.1.1表面准备.......................................................................................................72.1.2涂光刻胶.......................................................................................................72.1.3软烘焙...........................................................................................................72.1.4对准和曝光...................................................................................................82.1.5显影...............................................................................................................82.1.6坚膜...............................................................................................................82.1.7显影检验.......................................................................................................92.1.8刻蚀................................................................................................................92.1.9光刻胶去除..................................................................................................102.1.10最终目检....................................................................................................102.2光刻质量分析.......................................................................................................112.2.1溶胶.............................................................................................................112.2.2小岛.............................................................................................................112.2.3针孔.............................................................................................................12第3章高级光刻工艺................................................................................................133.1ULSI/VLSI集成电路图形处理过程中存在的问题...........................................133.2晶圆表面问题.......................................................................................................143.2.1光刻胶的光散现象.....................................................................................143.2.2光刻胶里的反射现象..................................................................................143.3先进光刻胶工艺...................................................................................................153.3.1复层光刻胶/表面成像.................................................................................153.3.2铜制造工艺..................................................................................................163.3.3化学机械研磨..............................................................................................17附录........................................