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基于VB和单片机的多点温度采集系统【摘要】：测温系统是以数据采集原理为主要理论依据，将传感器DS18B20所测的温度转换成为电信号，再由AT89C51单片机对其进行量化编码，转化为整型数据和浮点型数据；整型数据为了方便AT89C51单片机与PC之间的通讯，浮点型数据是用来显示在液晶显示器12864上面的。根据串行通讯原理，设计了AT89C51单片机与PC机的接口电路，建立了AT89C51单片机与PC机之间的串行通讯协议，并利用VB6.0对测温系统实现了对象化操作——将采集到的温度信号编码进行接受和描述，将其直接显示在可视的界面当中，对信号进行分析和处理，并将其用曲线实时显示出来。本设计在选择仪器方面的宗旨是使用起来方便快捷，成本低廉，而且大幅度提高了测量精度，最终目的能实现人机的对话且能及时知道系统的运行状况等功能。【关键词】：AT89C51单片机，编码，温度，实时曲线，DS18B20，VB6.0BasedonVBandMCUmultipointtemperaturecollectionsystemFangLi（Grade08,Class4,MajorAutomation,ElectricalEngineeringDept.,ShaanxiUniversityofTechnology,Hanzhong723003,Shaanxi）Tutor：HuBo【Abstract】：Temperaturemeasurementsystemtodatacollectionprincipleasthemaintheoreticalbasis,thetemperaturesensorDS18B20convertedintoelectricalsignals,againbyAT89C51single-chipmicrocomputerthequantitativecoding,intothewholemodeldataandfloatingpointtypedata;IntegerdatainordertofacilitatetheAT89C51single-chipmicrocomputerandofthecommunicationbetweenaPC,thefloating-pointdataisusedtodisplaytypeinLCDmonitorabove12864.Accordingtotheserialcommunicationprinciple,designtheAT89C51single-chipmicrocomputerandPCinterfacecircuit,establishedtheAT89C51single-chipmicrocomputerandPCofserialcommunicationbetweenagreement,anduseoftemperaturemeasurementsystemthroughVB6.0realizedtheobjectivityoperation-willthecollectedtemperaturesignalencodingtoacceptanddescription,itsdirectlydisplayinvisualinterfaceofthesignalanalysisandprocessing,anduseitscurvereal-timedisplay.Purposeofthisdesignchoiceofinstrumentistouseaconvenient,lowcost,andgreatlyimprovethemeasurementaccuracy,theultimateaimtoachievethesystemofman-machinedialogueandcanknowintimetorunstatus.【Keywords】:VB;database;temperature;monitoring目录1引言.................................................................................................................11.1概述...............................................................................................................11.2国内、外现状...............................................................................................11.3系统设计的任务要求...................................................................................21.4系统方案论证...............................................................................................21.5系统设计原理框图及各部分功能简介.......................................................31.6系统设计进度安排.......................................................................................32系统硬件设计..................................................................................................42.1控制器的设计...............................................................................................42.1.1控制器的选择...............................................................................42.1.2AT89C52主要特性........................................................................42.2液晶显示LCD设计........................................................................................92.2.1HS12864-15C液晶显示介绍........................................................92.2.2HS12864-15C液晶模块的硬件说明............................................92.2.3HS12864-15C液晶模块指令集..................................................102.2.4LCD显示硬件电路设计..............................................................142.3温度采集模块设计.....................................................................................142.3.1温度传感器的基本知识..............................................................142.3.2传感器的选用及系统中的应用.................................................142.3.3温度传感器的选择.....................................................................162.3.4温度传感器DS18B20工作原理..................................................162.3.5DS18B20的使用........................................................................162.3.6温度采集模块硬件电路设计......................................................182.4系统硬件电路设计.....................................................................................182.4.1主机控制部分.............................................................................182.4.2温度采样与显示电路.................................................................192.4.3RS232通讯接口电路设计........................................................193系统软件设计...............................................................................................................................203.1下位机软件设计.........................................................................................203.1.1液晶显示部分设计.....................................................................203.1.2温度采集模块部分设计.............................................................213.1.3串口通讯（下位机部分）软件设计.........................................253.2上位机软件设计.........................................................................................273.2.1系统主界面的设计.....................................................................283.2.2串口设置界面.............................................................................283.2.3串口通讯（上位机部分）设计.................................................294系统的调试.......................................................................................................