LED产业发展机遇与挑战-4

0ThebestwaytopushLEDLightingcommercializedThebestwaytopushLEDLightingcommercializedNeoNeo--NeonNeon’’sVerticalIntegrationsVerticalIntegrationNeo-NeonHoldingLTD.JurgenYeh2010.3.171OutlineOutlineLEDandLEDLightingFuturePlansandProspectsCompanyOverviewLEDIndustryDevelopmentLEDCoreCompetenceEgΔEcΔEvvcgEEEhΔ+Δ+=νRadiativeRecombinationWhat is LED?†LED(LightEmittingDiode)†CompoundSemiconductorMaterialGaNGaAs….ConductionbandValanceBandmomentumEnergyDirectbandgapEg2inchwaferSapphireNlayerLamppackage0.07W0.1W….Powerchippackage1W3W…..QWlayerPowerchip1mm*1mmStandardchip0.23mm*0.27mmHowtoprocesstheLED?Wd400、465、505、520nmP-layerchippackageassemblyapplicationLEDLightingProcessepitaxy5CompanyOverview6CompanyOverviewCompanyOverviewCompanytoIndustryCompanytoIndustry7CompanyOverviewCompanyOverviewCompetitiveAdvantageCompetitiveAdvantageUpstreamtoDownstreamControls:ClearDifferentialstoMaintainMarketDominanceandstaveoffCompetitionMostDiversifiedProductRangeofanycompanygloballyStrongIndustrialBase:RecognizedGlobalLeaderVerticallyIntegrated:SelfproductionofLEDCHIP:CompetitiveCostStructureMostDiversifiedCustomerBasewithmorethan4,000customersinover80Countries8StrongManufacturingCapabilitiesStrongManufacturingCapabilitiesStrongCustomerFocusStrongCustomerFocus¾VerticallyIntegrated–LEDChips,LEDEncapsulation,DriversandPSU’sCopperWire,PCB’s,AllmainfixturecomponentstoincludeAluminumExtrusion,Casting,InjectionMolding.¾ISO9001,ISO14001,OSHA18001,QC080000FacilitieswithafocusonQA/QC¾FullInhouseStandardsLab¾InhouseR&D¾Fastandresponsivepreandpostsalecustomerservice.¾QualityAssurancetoCustomersCompanyOverviewCompanyOverviewCompetitiveAdvantageCompetitiveAdvantageLEDGeneralandCommercialLEDArchitecturalLEDApplicationLEDSignageLEDDecorativeLEDEntertainment9CompanyOverviewCompanyOverviewProductCategoriesProductCategories2010ShanghaiExpo.2008BeijingOlympic10LEDIndustrialDevelopment11Threenotableelectronicsinventionsinthe20thCenturythathaveleadtowherewearetoday.IndustryDevelopmentIndustryDevelopment2020ththCenturyInventionsCenturyInventions12ImmenseopportunitiesforNeo-NeonHighefficiency,lowheatemissionandlongdurabilityHighlyversatilelightingdevicewithdiverseapplicationsfordecorative,illuminationandcommercialpurposesLEDlightingproventobeaperfectreplacementforconventionallightingRecentsurgeinoilpricesandrisingenvironmentconcernsgloballyhavepropelledtheuseofclean,energysavinglightingsourcesIndustryDevelopmentIndustryDevelopmentGlobalLEDLightingMarketGlobalLEDLightingMarketLEDMainMarketLCDBacklightLightingBackLight:CellPhone:90%ofMarket,OLEDiscompetitorNB:Over100%increasingtill2011,In2010,60%ofCCFLwillbereplacedbyLEDLCDTV:In2009,TheMarketwas2.5million,in2010,itwillbe15million.Lighting:In2012,LEDLightingMarketwillbeatleast1.4billionUSD,notover1.5%ofLightingMarket(over100billionUSD/year)IndustryDevelopmentIndustryDevelopmentGlobalLEDLightingMarketGlobalLEDLightingMarket2010mainapplicationofLEDproductsProductMarketLED/setLEDneedsLED/2inchwaferWafer(pcs)MOCVD(31pcs)SetsLCDTV90%yield50%yield15kkNB90%yield50%yield250kk6015billion50003kk6kk125250Total(yield)90%50%6.7kk12.7kk297547decorative20billion40000500k20CellPhone1200kk5~67billion10000700k30??more100015billion50003kk6kk125250Lighting??more??more??more??moreOver500In2010,weneedmoreMOCVD2010,2011,2012MarkettrendNotincludingLightingandotherapplication(decorative,display,tools,advertising….)ThetotalneedsofLCDbacklight(cellphone,NB,TV)is12.7millionwafers(2inch)in2010547setsMOCVDforLCDbacklight480setsMOCVD(productiontypeover19pcs)havesetuntil1stQuarterof2010Taiwan:4.5millionpcs(400sets);Mainland:0.84millionpcs(80sets)MOCVDproductionexpandingisnotenoughin2010Until2ndquarterof2011,expansionofMOCVDisenoughforLCDbacklightBecauseofLEDLightingbooming,after3rdquarter2011and2012,LEDisshortofLightingapplication.WeneedmoreMOCVDsatthattime.ThenextMergerandAcquisitionin2012.16LEDCoreCompetenceLEDwaferandchiplightingdecorativeLCDbacklightLEDCoreCompetenceWideapplicationofLEDFromlowendtohighendLED,wecanuseinalldifferentapplication10x23milchip6x9milchip45x45milchip45x45milflipchipSMDLampHighpowerWefocusonHighbrightnessChip,butwecanWidelyUselowendandLowbrightnesschipHighbrightnessLowbrightness18WehavesetupLEDwafer/chipprocessline(Jiangmen,Guangdong)Epitaxyproductionline5setsof31x2MOCVDsystem12,000pcs/monthChipprocesslineNowweproduce,Smallsizechip(7milx9mil)Mediumsizechip(10milx23mil)Highpowerchip(40milx40mil)LEDCoreCompetencyLEDCoreCompetencyChipProductionExpansionChipProductionExpansion19Theadvantageof31×2CCSMOCVDsystemTotalwaferarea30×2inch=607cm2increasing60%areaTotalwaferarea19×2inch=385cm2LEDCoreCompetencyLEDCoreCompetencyOurChipAdvantageOurChipAdvantage•Thelatestequipmentandtechnique.•TechnicalTeamarefromJapan,Taiwan(fromtopLEDcompany)andMainlandChina.•OurTeammemberhavematuremassproductionexperienceinMainlandChina.•Weknowourtarget:costdownandusingourtechniquetoletLEDmorebright.20LEDCoreCompetencyLEDCoreCompetencyLEDTechnologyPatentsLEDTechnologyPatentsNeo-Neonwasranked6thintheworldforthetotalnumberofLEDTechnologyPatents.NS