基于PID-的水温控制系统(毕业论文)

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单位代码01学号100119026分类号TP273密级毕业设计说明书基于PID的水温控制系统设计院(系)名称信息工程学院专业名称测控技术与仪器学生姓名指导教师2014年4月25日黄河科技学院毕业设计说明第Ⅰ页基于PID的水温控制系统设计摘要本次设计采用proteus仿真软件,以AT89C51单片机做为主控单元,运用PID控制算法,仿真实现了一个恒温控制系统。设计中使用温度传感器DS18B20采集实时温度,不需要复杂的信号调理电路和A/D转换电路,能直接与单片机完成数据的采集和处理,使用PID算法控制加热炉仿真模型进行温度控制,总体实现了一个恒温控制仿真系统。系统设计中包含硬件设计和软件设计两部分,硬件设计包含显示模块、按键模块、温度采集模块、温度加热模块、蜂鸣器报警模块。软件设计的部分,采用分层模块化设计,主要有:键盘扫描、按键处理程序、数码管显示程序、继电器控制程序、温度信号处理程序、超温报警程序。另外以AT89C51单片机为控制核心,利用PID控制算法提高了水温的控制精度,使用PID控制算法实施自动控制系统,具有控制参数精度高、反映速度快和稳定性好的特点。关键词:proteus仿真,PID,AT89C51,DS18B20温度控制黄河科技学院毕业设计说明第Ⅱ页TheDesignofWaterTemperatureControlBasedonPIDAuthor:Tutor:AbstractThisdesignusesproteussimulationsoftwareandtakesAT89C51asmasterunit,usingPIDcontrolalgorithmtosimulationatemperaturecontrolsystem.TheDesignusestemperaturesensorDS18B20acquisitionreal-timetemperature,anddoesnotrequirecomplexsignalconditioningcircuitryandA/DconvertercircuitwiththeMCUcompletingtheacquisitionandprocessingofdatadirectly.TheuseofPIDalgorithmcontrolfurnacetemperaturecontrolsimulationmodel,theoverallimplementationofatemperaturecontrolsimulationsystem.ThesystemdesigncontainshardwaredesignandsoftwaredesigntwopartsandtheHardwaredesignincludetemperaturecontrolcircuit,temperaturedetectionandLEDdisplaycircuitandsoon.Partofthesoftwaredesignadoptsmodularstructure.ThemainmoduleisKeypadscanning.Keyprocessingprogramdigitalpipedisplayprocedures,relaycontrolprocedures,temperaturesignalprocessingprogramandsupertemperaturealarmingprogram.InadditiontoAT89C51controlcore,theuseofPIDcontrolalgorithmtoimprovetheaccuracyoftemperaturecontrolusingPIDcontrolalgorithmtoimplementautomaticcontrolsystemwithhighprecisioncontrolparameters,reflectingthespeedandstabilitycharacteristics.Keywords:proteussimulation,PID,AT89C51,DS18B20TemperatureControl黄河科技学院毕业设计说明书第Ⅲ页目录1绪论........................................................................................................................................11.1背景意义.......................................................................................................................11.2温度控制系统国内外发展现状...................................................................................11.3本课题研究的主要内容...............................................................................................22系统总体设计方案论证........................................................................................................42.1设计要求.......................................................................................................................42.2总体设计方案...............................................................................................................43系统的硬件设计....................................................................................................................63.1系统硬件构成概述.......................................................................................................63.2各单元总体说明...........................................................................................................63.3按键单元.......................................................................................................................63.4LED数码管显示单元...................................................................................................73.5温度超、低温与异常情况报警单元...........................................................................83.6温度测试单元...............................................................................................................93.7温度控制器件单元.....................................................................................................104恒温控制算法研究(PID)................................................................................................114.1PID控制器的设计.......................................................................................................114.2PID算法的流程实现方法与具体程序.......................................................................125系统的软件设计..................................................................................................................165.1统软件设计概述.........................................................................................................165.2系统软件程序流程及程序流程图.............................................................................175.3温度数据显示模块分析.............................................................................................185.4测试分析.....................................................................................................................206模拟仿真结果......................................................................................................................22黄河科技学院毕业设计说明书第Ⅳ页结论......................................................................................................................................25致谢......................................................................................................................................26参考文献..................................................................................................................................27附录..................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