硅超大规模集成电路工艺技术 封测

微电子工艺技术第十一讲封装技术简介钱鹤清华大学微纳电子系传统封装技术（Package）系统封装技术（SysteminPackage,SIP）InternationalTechnologyRoadmapforSemiconductor(ITRS)对封装技术的要求三种主要的I/O形式-Leadframe-Pingrid-Ballgrid衬底(Substrate)的功能与制备三种连接形式-Wirebonding-Solderballflip-chip-Throughsiliconvia(TSV)封装技术半导体封装的主要工艺步骤晶片切割（dise）也需要“寸土必争”，其中防崩边和颗粒（particle）是关键半导体封装工艺需考虑的核心问题小尺寸高强度高平整度，低引线寄生参数，高导热性AwirebondedchiponaHighEndDualInlinePackage(DIP)三种主要的I/O形式(Leadframe)PingridarrayPinsareonaceramicchipcarrier.Chipisupsidedown.Contactswithcarrierviasolderballs.三种主要的I/O形式(PinGrid)4rowdipperipheralpingridarrayprovidesI/OfortheIntelPentium三种主要的I/O形式(PinGrid)High(er)I/OpackagingWhenlinearpackaging(DIP)reachedthelimittheindustrywentto2-Dgridarrays.Theycanbewirebondedbutmoreusuallyuseanothertechnique=solderballsTheycomeintoversion•PinGridArray(PGA)•BallonGrid(BGA)三种主要的I/O形式(SolderBallGrid)Lowendpingridarray.Pinsaremountedinaglass-fiberepoxyboard.Chipiswirebonded.Thevia’sarecalled“platedthroughhole”.SolderballsmakecontactstoICboards三种主要的I/O形式(SolderBallGrid)BondingthechipwithAu“Solder”(expensive)ormetalparticlefilledpolymer(cheaper)tosubstrate.衬底(Substrate)的功能与制备衬底(Substrate)的功能与制备1millAuwire(25mm)isheatedtoformaball(a)whichisthanfrictionandcompressionbonded(ultrasonic)tothebondingpadonthesubstrate.三种连接形式(Wirebonding)Ballispressedonheated(~150C)bondingpadorBallispressedatRTwithultrasonicagitationonbondingpadWirebonderhead(artisticallyinsertedbackgroundarebondingpads)三种连接形式(Wirebonding)三种连接形式(Wirebonding)TapeautomatedbondingThe“wires”arepreformedonaflexibletape,usuallybyelectroplatingcopper.Permitsautomaticalignmentof“centipede”wiresonthetapetobondingpadsonchipandleadcarrier.Manyvariations…..三种连接形式(SolderBall)Theflipchip(IBMinvention)•Chipisupsidedown•Doesnothavebondingpads,hasarrayofsolderballs•Substratehassolderballs(orjusthighlywet-ableCupads)三种连接形式(Wirebondingflip-chip)SolderBallWafer-levelpackage(WLP)多种多样的封装形式(BGA)多种多样的封装形式(BGA)多种多样的封装形式(MCM)多种多样的封装形式(PoP)多种多样的封装形式(MemoryCard)多种多样的封装形式(SIMCard)多种多样的封装形式(tapecarrierpackage,TCP)散热是个大问题!Theflipchippermitsefficientcooling!MetalPistonAtonetimepistonshadimperceptiblycurvedmetalpistontoensureoptimumcontact散热是个大问题!Aschipdissipatespower(~40Wattsisnotunusual)thechipheatsup,expands,and“shearsover”thesolderballs.Thesameexpansionstretchestheunderfill.Results:Fatiguefailure,underfill“pumping”可靠性也是个大问题!Solderballfatiguefailure可靠性也是个大问题!Underfillfailure,breakingsolderballFiniteElementAnalyis可靠性也是个大问题!传统封装技术（Package）系统封装技术（SysteminPackage,SIP）用封装技术实现不同工艺、不同功能芯片的系统集成是最经济、最快捷的途径Asinglepingridarraymaycontainseveralchips.最简单的系统封装形式(MCM)利用芯片堆叠（stack）和压焊引出（wirebonding）实现多芯片封装(MCP)核心技术是芯片减薄(grinding)和压焊引线路径的精确控制（loopcontrol）实现堆叠MCP的关键技术：压焊引线路径的精确控制芯片减薄技术三种减薄技术TSV是实现MCP更先进的技术TSV制作的关键技术：深孔刻蚀深孔填充，应力控制TSV的剖面照片KGDPackageProcessRequirementsforSiPSiContactPOPContactLowCostSub.SiinterposerFCContactPTPLowCostPTPPTPJissoPOPMCMToshibaSiPTechnologies多种多样的系统封装形式(SiP)“InterconnectProductTechnology(IPT)”ratherthan“Package”小结：瞄准应用需求，巧妙组合上述关键技术，成就了多种多样的封装形式。录象:(12分钟)uvs061026-005.MPG作业(下周上课时交!):1.简述用BGA实现flip-chip和封装引出的工艺过程。2.什么叫系统级封装，简述实现系统级封装可能用到的关键技术。