真空扩散焊接设备与工艺技术

()VaeuumDiffusionBondingEquiPmentandTeehniqueDo9Baong(BeijingAeronauiealManufaeturingTeehnologyResearehInstitute)AbstraetVaeuumbonding15oneoftheadvaneedteehniqueofmeehaniealProeedure.Inh15paper,aninensiveanalysisofthesrueureoftheDBequipmenandi’5featureshavebeenmadewithregardtovaeuumdiffusionbondingfurnaeesdesignandmanufaeturing.TheteehniqueproeedureofDBwasalsobrieflyinrodueed.。,,。:、、,。,。’,,,、,、,。,、,。,、、。ZKL3,。2990731100024、ZKL3,,,、、、。,、,:1.:300x4202.:1240℃3.:10002℃4.:30kw5.:5000kg26.:8.6x10“`Pa(6.5xlo“,:3.99xlo。Pa(3xlo’:3.6K10ZPaL/S(2.7xl0`·:))/)10.:,。、,,,,,,。ZKL3,,,,。,,,,X1F19.1VaeuomDBfurnacemeehani:aldiagram。ZKL31。、、、,。,`Gr`8N`i9T,。,,,52,,,2。,,,,,,,`,。-,,。、、、、、。2Fig.2Strueturediagramofringtypeofheater2.,10`Pa。ZX30A,6xl。ZPa。JK300T,2.6xl0`Pa。D3,,13.3~1.33x10“`Pa,LED,,。,,、。3.,,3。,D,YB。WU,I10BNYQ,,.YX,,DB10。4WE,,。ZZFS,。,,20。Qlllllll3F19.3011oPeratedtransmissionbloekdiagram,,。534.lSTD、(),4。、、,。~5,、,。(PID4F19.4Bloekdiagromoftemperatueeontrollingsyem),,,。。、,,。,、、、、,、,、、。,、,,,。,。、、,,Ti6%AI4%V、、、,。:,,;;,,。·TC4(Ti6%AI4%V),。,,,,、,,HNO:HF,。、、、,,、,。、、,,。,a,4256℃,996℃Ti6%AI4%V927945℃,,,。4,go,SMPa(0.5~541.okgf/mmZ)。、、。,,,13.3Pa,,,10’Pa。,:1.,,。2.,,。3.,,,,。、,,,,。,,、,。:1.,,,,,。2.,、,、、、、,。3.,。,、、。〔l〕.,,,1986〔2〕,.,1988(62)、,。、、,、、,,。〔1〕,〔2〕4911721〔3〕354(1990)〔4〕J.Vae.Sei.Teehnol.A.Vo].2No.2Apr,June1984〔5〕J.Vae.Sei.Toehnol.20(4),198255