AlSiC电子封装基片的制备与性能

AlSiC电子封装基片的制备与性能作者：熊德赣，刘希从，鲍小恒，白书欣，杨盛良，赵恂，XIONGDe-gan，LIUXi-cong，BAOXiao-heng，BAIShu-xin，YANGSheng-liang，ZHAOXun作者单位：国防科技大学,航天与材料工程学院,长沙,410073刊名：中国有色金属学报英文刊名：THECHINESEJOURNALOFNONFERROUSMETALS年，卷(期)：2006,16(11)参考文献(16条)1.OcchioneroMA;HayRA;AdamsRWAluminumsiliconcarbide(AlSiC)thermalmanagementpackagingforhighdensitypackagingapplications19992.SoonHH;HyoSL;KyungYJProcessforpreparingapreformwithhighvolumefractionSiC20013.BugeauJ;ConghlinWⅢ;PrioloMAdvancedMMICT/Rmodulefor6to18GHzmultifunctionarrays[外文会议]19924.ZwebenCAdvancesincompositematerialsforthermalmanagementinelectronicpackaging[外文期刊]1998(06)5.PechMI;KatzRN;MakhloufMMOptimumparametersforwettingsiliconcarbidebyaluminumalloys[外文期刊]20006.YunDI;SawtellRR;HuntWHFabricationofMetalMatrixCompositesbyVacuumDieCasting19937.PremkumarMK;YunDI;SawtellRRAdvancedaluminumcompositesforhigh-performanceapplicationsinelectronicpackaging19938.喻学斌;张国定;吴人杰真空压浸铸造铝基电子封装复合材料研究[期刊论文]-材料工程1994(06)9.LaiSW;ChungDDLFabricationofparticulatealumininum-matrixcompositesbyliquidmetalinfiltration199410.LeeHS;JeonKY;KimHYFabricationprocessandthermalpropertiesofSiCp/Almetalmatrixcompositesforelectronicpackagingapplications[外文期刊]200011.CookAJPlatingforMetalMatrixComposites199512.武高辉;张强;姜龙涛SiCp/Al复合材料在电子封装应用中的基础研究[期刊论文]-电子元件与材料2003(06)13.于家康;梁建芳;王涛高导热金属基复合材料的热物理性能[期刊论文]-功能材料2004(zk)14.张强;修子杨;宋美惠电子封装用SiCp/Al复合材料的组织与性能[期刊论文]-功能材料2004(zk)15.张建云;孙良新;王磊电子封装SiCp/356Al复合材料制备及热膨胀性能[期刊论文]-功能材料2004(04)16.JohnsonWB;SonuparlakBDiamond/Almetalmatrixcompositesformedbythepressurelessmetalinfiltrationprocess1993(03)本文链接：