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AD896操作手冊開啟電源:開啟電源後電腦會提示:PRESSANYKEYTOBECONTIUE(約1分鐘)屏幕顯示:SELECTWARM/COLDSTARTWARMCOLD選擇WARM進入主菜單BONDSETUPSERVHELP1.BOND0.AUTOBOND1.PICKANDBOND2.SYSTEMCOUNTER3.CHANGEPASSWORD4.WAFERIMDEXLETD.N5.SYSTEMMODEUSER6.BONDOPTIONS按▼進入BOND菜單項的第5項,按ENTER鍵,屏幕會跳出一個提示語PLEASEENTERPASSWARD再橫框裡輸入896密碼,再按ENTER,第5項子菜單將顯示為5.SYSTEMMODESERVICE設定完後,接下來就可以做程序了.按►,現在主菜單中選擇,SETUP項2.SETUP0.PROCESSSETUP1.VISIONSETUP2.PACKAGEDATAFILE3.PACKAGEFILENAME4.BINTABLE5.TEACHPCB按5進SETUP菜單第5項TEACHPCB屏幕顯示為25TEACHPCB0.TEACHPCBALIGMENTS1.PCBPRSSETUP2TEACHPCBMATRIX3.PCBNO4.GROUP5.PEPEAT6.TEACHBONDPTMATRIX7.DELETEPCBPROGRAM然後開始做程序,做程序之前,先要把原有的程序給刪除,按7.進入第7項子菜單7.DELETEPCBPROGRAM,顯示為:257PCBPROGRAIMOPTION0.MAXPCBPROGVAM1.DELECEPCBPROGVAM按1跳出菜單AREYOUSURETODELETE(1)--ALL(2)--BONDPTONLY(ESC)--CANCEL再按1,刪除原有的程序屏幕會變為PCBPROGRAMAREDELETED-------1.INPUTMAXPCBPGM2.RE-ASSIGNPCBPGM接下來就做程序,先選擇第0項0.TEACHPCBALIGMENTS按回車顯為PREVIOUSCURRENT2POINT2POINT按回車,屏幕會顯示USEJOYSTICKMOVETOALIGNPOIN1ANDPRESSENTER移動方向桿,給第一個角定位按ENTER屏幕又顯示為USEJOYSTICKMOVETOALIGNPOIN2ANDPRESSENTER移動方向桿,給第二個角定位按ENTER定位後,按1選擇1.PCBPRSSETUP設角的PR.屏幕顯示1.PRSALIGNMENTENBLE2.ALINGNMENTTOLERANCE(X:Y)33.SKIPNON-ALIGNABLELIMITDISABLE44.MAX.SKIPPCBALLOW05.TEMPLATESHAPENOMAL16.TEACHOPTION7.SEARCHOPTION0MSEC8.TEACHPCBPRS9.SEARCHPCBPRSPOINT1按0.選擇0.PCBCALIBRATION,做CALIBRATION(選擇合適的光纖)再1.選擇PRS.ALIGNMENT使其在ENBLE狀態,再按8選擇TEACHPCBPRS(保存角的光纖,及位置,只要按ENTER鍵即可),角做好退回到TEACHPCB菜單25TEACHPCB0.TEACHPCBALIGNMENTS1.PCBPRSSETUP2.TEACHPCBMATRIX8STEP3.PCBNO14.GROUP115.REPEAT16.TEACHBONDPTMATRIX7.DELETEPCBPROGRAM按2.選擇2.TEACHPCBMATRIX編PCB板的塊數,屏幕會顯示TEACHPCBOPERATIONINPUTROWN.行SELECETEACHMETHODINPUTCOLS.N列輸入行數,列數,按回車,用方向桿把屏幕十字架移到屏幕提示的那塊PCB板的角上,再按回車,通常是在最左上方,左下方,右下方按6.選擇6.TEACHBONDPTMATRIX顯示為PLEASEINPUTPCBPGMTOTEACH/EDIT(1-2)1(如果做二種晶片,選2)251PCBPRSTUP0.TEACHMATRIX1.PCBNO2.DIENO3.ADV(向前)4.RTD(向後)5.INSERT(新增點)6.DELETE(刪除點)7.EDIT(編輯點)8.GROUP9.REPEAT按55.INSERT粗略的編點,點編好後,在按7選擇7.EDIT把點編到精確位置,全部點編輯完後,返回到第1顆.(2.DIENO1)接下來做晶片光纖:先返回到SETUP主菜單,選擇1項1.VISIONSETUP進入屏幕顯示:21VISIONSETUP0.DIETUPELED1.LOADGOODDIEYES2.LOADINKDIENO3.DIECALIBRATEYES4.LEARHPITCHYES5.SEARCHAREASMALL6.LOOKAHEADSEARCHDISABLE7.SHOWLOOKAHEADWINDOWYES8.LOODMOREDIE9.SEARCHDIEPARAMETER10.AUTOBONDSCREENMODE移動方向桿,使屏幕十字架中心在晶片中心,然後進入1.LOADGOODDIEYES屏幕會彈出一個提示框,一般保持默認值,不需要更改,一直按ENTER,直到最後跳出MANUALLOADDIECOMPELETE提示框為止,按ESC鍵再按3鍵進入3..DIECALIBRATEYES,按ENTER看到屏幕跳動,等一會兒,CALIBRATE就做好,接下來按4進入4.LEARNPITCH做晶片間距.一直按ENTER.會自動進行,這樣光纖就好了.做好後做三點一線,先按STOP把菜單退回到SETUP主菜單2SETUP0.POCESSSETUP1.VISIONSETUP2.PACKAGEFILENAME3.PACKAGEFILENAME4.BINTABLE5.WAFERMAPSETUP按0進入0.PROCESSSETUP.屏幕會顯示為20.PROCESSSETUP0.STAMPINGPROCESS1.BONDINGPROCESS2.WAGERPROCESS3.WORKHOLDERPROCESS4.MULTI-WAFERPROCESS按1進入BONDINGPROCESS屏幕顯示為201BONDINGPROCES0.BONDHEADSETUP1.EJECTORSETUP2.BONDINGDELAY3.PROGILESETUP按0進入0.BONDHEADSETUP2110BONDHEADSETUP0.PREPICKPOSITION400STEP1.PICKDIEPOSITION-400STEP2.BONDDIEPOSITION6270STEP3.PREBONDPOSITION5500STEP4.CLEANCOLLETPOSITION3000STEP5.CHANGECARRIERPOSITION-2000STEP6.MISSINGDIECHECK4250STEP7.PICKDIELEVEL5000STEP8.BONDDIELEVEL5000STEP9.REPLACEDIELEVEL5000STEP按7鍵.選擇7.PICKDIELEVEL5000STEP屏幕會跳出一個提示框,按►▲使光纖達到最亮.按回車.然後用顯微鏡看吸嘴的高度以及吸嘴是否在晶片正中心按▲▼鍵,使吸嘴碰到晶片,若不是,調節機器上的旋鈕,直到吸嘴再晶片中心為止.→吸嘴調好後按STOP退出,再按8.BONDDIE調整吸嘴與PCB板的高度,用顯微鏡看,按►▲調節→晶片光纖到最高,按ENTER,用顯微鏡看,按▲▼鍵,調整高度度這些調整好,開始對頂針與屏幕的十字線將屏幕退到201BONDINGPROCESS0.BONDHEADSETUP1.EJECTORSETUP2.BONDINGDELAY3.PROFILESETUP按F7,取出晶片環,按SHIFE+F6按1,進入1.EJECTORSETUP屏幕顯現為2021EJECTORSETOP0.HOMEEJECTOR1.STANDBYLEVEL150STEP2.EJECTORUPLEVEL238STEP3.EJECTORUP&BHDAWN238STEP4.SYNCMOVELEVE05.PRE–EJECTPROCESSSETUP6.EJEVTORVALVEOPP按2.選2.EJECTORUPLEVEL會顯示調節光纖屏幕按►▲使屏幕達到最亮,按ENTER,屏幕會顯示一個小白光點,將小白光點對準十字線正中心,頂針就調好,按STOP退出,接下來對三點,退到202EJECTORSETOP0.HOMEEJECTOR1.STANDBYLEVEL150STEP2.EJECTORUPLEVEL238STEP3.EJECTORUP&BHDAWN238STEP4.SYNCMOVELEVE05.PRE–EJECTPROCESSSETUP6.EJEVTORVALVEOPP先將十字線移到晶片正中心,按6.EJECTORVALVE,按ENTER,使OFF----ON再按2.EJECTORUP&BH,按回車,再用顯微鏡,三點要再同一直線上,(三點:頂針,晶片,吸嘴)三點一線對好,接下來設銀膠擺臂,將銀幕退回到20.PROCESSSETUP子菜單,20.PROCESSSETUP0.STAMPINGPROCESS1.BONDINGPROCESS2.WAGERPROCESS3.WORKHOLDERPROCESS4.MULTI-WAFERPROCESS按0.進入0.STAMPINGPROCESS.屏幕顯示為200.STAMPINGPROCESS0.STAMPINGHEADSETUP1.STAMPINGDELAY2.EXTRAEPOXY3.EPOXYSCRUB4.PROFILESETUP按0進入0.STAMPINGHEADSETUP屏幕會顯示為2010STAMPINGHEADSETUP0.ARMPICKPOSITION–748STEP1.ARMDISPENSEPOSITION105STEP2.HEADPICKLECEL-15373.HEADDISPENSELEVEL-36274.SQUEEZEEPOXYONCE按3.HEADDISPENSELEVEL調整點膠頭與PCB板高度,按▲▼調整高度,調好後按STOP.再按2.HEADPICKLEVEL調整點膠頭與銀膠座高度,按▲▼鍵調整高度.做晶片範圍,及吸晶顆數,更改在SETUP主菜單下的0.PEOCESSSETUP下的2.WAFERPROCESS菜單202WAFERPOROCESS0.TEACHWAGERLIMIT1.WAGERSIZE(0.1INCH)452.SHOWWAFERLIMIT(X10)1406263.INDEXINGPATH(SIZEDIR)6VRT4.WAFTERENDSTREETLIMIT205.WAGEREDGENUMBER86.WAGERHOLENUMBER8進入0.TEACHWAGERLIMIT設晶片範圍,機器會自動提示,第一點為右上點,第二點為左下點(一定要這樣設)三點設好後,1.WAGERSIZE(0.1INCH)45會自動計算出晶片範圍值,一般再40多一點3.INDEXINGPATH(SIZE,DIR)6VRT為吸晶顆數,可隨意更改(按規格分單改顆數)F6WHOPERATIMHOMEWORKHOLDERNOFUNCTIONRESETWORKHOLDRESET2PLATFORMNOFUNCTIONCHANGECARRIERMEASURINGRULERTOGGLEPCBVACUUMF10OPTIC&OPERATIONALJUSTWAFERLIGHTINGBONDCLEARPRSCREENFREEALLRECORDSF2BHOPERATIONHOMEBH&BAHOMEEJECTORRESETBH&BAWAFERXPOWERWAGERYPOWERMORETORINGWAFERSTAT