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ThermallyConductiveInterfaceMaterialsforCoolingElectronicAssembliesSil-Pad®SELECTIONGUIDESPDG_Cover_0511v7.qxp6/22/201112:25PMPage2Allstatements,technicalinformationandrecommendationshereinarebasedontestswebelievetobereliable,andTHEFOLLOWINGISMADEINLIEUOFALLWARRANTIES,EXPRESSEDORIMPLIED,INCLUDINGTHEIMPLIEDWARRANTIESOFMARKETABILITYANDFITNESSFORPURPOSE.Sellers'andmanufacturers'onlyobligationshallbetoreplacesuchquantityoftheproductprovedtobedefective.Beforeusing,usershalldeterminethesuitabilityoftheproductforitsintendeduse,andtheuserassumesallrisksandliabilitywhatsoeverinconnectionthere-with.NEITHERSELLERNORMANUFACTURERSHALLBELIABLEEITHERINTORTORINCONTRACTFORANYLOSSORDAMAGE,DIRECT,INCIDENTAL,ORCONSEQUENTIAL,INCLUDINGLOSSOFPROFITSORREVENUEARISINGOUTOFTHEUSEORTHEINABILITYTOUSEAPRODUCT.Nostatement,purchaseorderorrecommendationsbysellerorpurchasernotcontainedhereinshallhaveanyforceoreffectunlessinanagreementsignedbytheofficersofthesellerandmanufacturer.©Copyright2011,TheBergquistCompany.Allrightsreserved.June2011SPDG_Cover_0511v7.qxp6/22/201112:25PMPage3TableofContents1Introduction2ThermalPropertiesandTesting4InterfaceMaterialSelectionGuide5GapPad®ThermallyConductiveMaterials6GapPadComparisonData7FrequentlyAskedQuestions8GapPadVO9GapPadVOSoft10GapPadVOUltraSoft11GapPadVOUltimate12GapPad1000SF13GapPadHC100014GapPad150015GapPad1500R16GapPad1500S3017GapPadA200018GapPad2000S4019GapPad2200SF20GapPad2500S2021GapPad250022GapPadA300023GapPad3000S3024GapPad5000S3525GapFillerComparisonData26FrequentlyAskedQuestions27GapFiller1000(Two-Part)28GapFiller1100SF(Two-Part)29GapFiller1500(Two-Part)30GapFiller2000(Two-Part)31GapFiller3500S35(Two-Part)32TIC™ThermalInterfaceCompound33ComparisonDataandFrequentlyAskedQuestions33TIC1000A34TIC400035Hi-Flow®PhaseChangeInterfaceMaterials36Hi-FlowComparisonData37FrequentlyAskedQuestions38Hi-Flow10539Hi-Flow225F-AC40Hi-Flow225UT41Hi-Flow225U42Hi-Flow62543Hi-Flow300P44Hi-Flow300G45Hi-Flow565U46Hi-Flow565UT47Hi-Flow650P48Sil-Pad®ThermallyConductiveInsulators49FrequentlyAskedQuestions50ChoosingSil-PadThermallyConductiveInsulators51Mechanical,ElectricalandThermalProperties52Sil-PadApplications54Sil-PadSelectionTable54Sil-PadComparisonData56Sil-Pad40057Sil-Pad80058Sil-Pad900S59Sil-Pad98060Sil-Pad1100ST61Sil-Pad120062Sil-PadA150063Sil-Pad1500ST64Sil-Pad200065Sil-PadA200066Sil-PadK-467Sil-PadK-668Sil-PadK-1069Q-Pad®II70Q-Pad371Poly-Pad®40072Poly-Pad100073Poly-PadK-474Poly-PadK-1075Sil-PadTubes76Sil-PadShield77Bond-Ply®andLiqui-Bond®Adhesives78Bond-PlyandLiqui-BondComparisonData79FrequentlyAskedQuestions79Bond-Ply10080Bond-Ply40081Bond-Ply660P82Liqui-BondSA1000(One-Part)83Liqui-BondSA1800(One-Part)84Liqui-BondSA2000(One-Part)85SolutionsforSurfaceMountApplications86OrderingInformation88Sil-PadConfigurations-Imperial90Hi-FlowConfigurations-Imperial93Sil-PadConfigurations-Metric94Hi-FlowConfigurations-Metric97Sil-PadShieldConfigurations-Imperial98Notes99SEL_SP_0511_Chpt1v25.qxp1/10/20122:38PMPage12INTRODUCTIONAtBergquist,developinghighqualitycomponentsfortheelectronicsindus-tryisourfirstpriority.Asaworld-leadingmanufacturerwithstate-of-the-artfacilities,weserveamultitudeofindustriesworldwideincludingautomotive,computer,consumerelectronics,lighting/LED,solar,mili-tary,motorcontrol,powerconver-sion,telecommunicationsandmore.Wemakeitourbusinesstoknowyourbusiness.Weunderstandyourproblems.Wealsoknowthattherewillalwaysbeabetterwaytohelpyoureachyourgoalsandobjectives.Tothatend,ourcompanycontinuallyinvestsconsiderabletimeandmoneyintoresearchanddevelopment.TheBergquistCompanyisfocusedonasinglepurpose–discoveringtheneed,thendevelopinganddeliveringtechnologicallyadvancedsolutionsbackedbysuperiorservice.WorldLeaderinThermalManagementThroughTechnology,InnovationandServiceBergquistTakestheHeatThermalManagementProductsBergquist'sThermalProductsGroupisaworld-leadingdeveloperandmanufacturerofthermalmanagementmaterialswhichprovideproductsolutionstocontrolandmanageheatinelectronicassembliesandprintedcircuitboards.Usedbymanyoftheworld’slargestOEMsinvariousindustriesincludingauto-motive,computer,powersupply,militaryandmotorcontrol,thesematerialsinclude:Sil-Pad®–ThermallyConductiveInsulatorsBond-Ply®andLiqui-Bond®–ThermallyConductiveAdhesivesGapFiller–ThermallyConductiveLiquidGapFillingMaterialsGapPad®–ThermallyConductiveGapFillingMaterialsHi-Flow®–PhaseChangeInterfaceMaterialsTIC™–ThermalInterfaceCompoundsThermalClad®–InsulatedMetalSubstratesWorldClassOperationsAroundtheGlobeWorldwideLocationsIntheUnitedStates,theThermalProductsGroup’s90,000square-footmanufacturingfacilityislocatedinCannonFalls,Minnesota.A95,000square-footfacilityinPrescott,WisconsinhousestheThermalCladprintedcircuitboardoperations.A130,000square-footfacilityinChanhassen,MinnesotaisthelocationforBergquist’scorporateheadquartersandstate-of-the-artresearchanddevelopmentfacilities.A36,000squarefootfacilitywasbuiltinBrandon,SouthDakotatoservethegrow-ingdemandforBergquistthermalmanage-mentmaterials.Worldwide,BergquisthasfacilitiesinTheNetherlands,Germany,Taiwan,