PCB印刷电路板制程介绍

PCBEngineeringReportSheet0印刷电路板制程介绍PCBEngineeringReportSheet1FlowChartofPCBProcess123487651211109IQCTRIMDRILLBLACKHOLEDRYFILMLAMINATING1819201415101723222127262524EXPOSURE13DEVELOPMENTPATTERNPLATINGETCHINGINSPECTINGS/MSURFACECLEAN1’STLIQULDSCREENPRINTPRE-CURE2’STLIQULDSCREENPRINTPRE-CURES/MEXPOSURES/MDEVELOPMENTPOST-CURELEGENDPRINTCUREHAL/ENIGG/FPUNCH/NC-RV-CUTFINALCLEANCUREO/STEST/OSPHOLECOUNT2829303132FQCOQCPACKINGWARHHOUSHOUTGOINGSYMBOL□:QUANTITYINSPECTION◇:QULITYINSPECTION▽:STORAGE○:WORKING▲:100%INSPECTIONPCBEngineeringReportSheet2(1)前制程治工具制作流程顾客CUSTOMER裁板LAMINATESHEAR业务SALESDEP.生产管理P&MCONTROLMASTERA/W底片DISK,M/T磁片磁带蓝图DRAWING数据传送MODEM,FTP网版制作STENCILDRAWING图面RUNCARD制作规范PROGRAM程式带钻孔,成型机D.N.C.工程制前FRONT-ENDDEP.工作底片WORKINGA/WPCBEngineeringReportSheet3(2)多层板内层制作流程曝光EXPOSURE压膜LAMINATION前处理PRELIMINARYTREATMENT去膜STRIPPING蚀铜ETCHING显影DEVELOPING黑化处理BLACKOXIDE烘烤BAKINGLAY-UP及预迭板迭板后处理POSTTREATMENT压合LAMINATION内层干膜INNERLAYERIMAGE预迭板及迭板LAY-UP蚀铜I/LETCHING钻孔DRILLING压合LAMINATION多层板内层流程INNERLAYERPRODUCTMLBAOI检查AOIINSPECTION裁板LAMINATESHEARDOUBLESIDE雷射钻孔LASERABLATIONBlindedViaPCBEngineeringReportSheet4(3)外层制作流程通孔电镀P.T.H.钻孔DRILLING外层干膜OUTERLAYERIMAGE二次铜及锡铅电镀PATTERNPLATING检查INSPECTION前处理PRELIMINARYTREATMENT二次铜电镀PATTERNPLATING蚀铜ETCHING全板电镀PANELPLATING外层制作OUTER-LAYERO/LETCHING蚀铜TENTINGPROCESSDESMER除胶渣E-LESSCU通孔电镀前处理PRELIMINARYTREATMENT剥锡铅T/LSTRIPPING去膜STRIPPING压膜LAMINATION锡铅电镀T/LPLATING曝光EXPOSUREPCBEngineeringReportSheet5液态防焊LIQUIDS/M外观检查VISUALINSPECTION成型FINALSHAPING检查INSPECTION电测ELECTRICALTEST出货前检查OQC包装出货PACKING&SHIPPING涂布印刷S/MCOATING前处理PRELIMINARYTREATMENT曝光EXPOSUREDEVELOPING显影POSTCURE后烘烤预干燥PRE-CURE喷锡HOTAIRLEVELING铜面防氧化处理OSP(EntekCu106A)HOTAIRLEVELINGG/FPLATING镀金手指镀化学镍金E-lessNi/Au印文字SCREENLEGEND选择性镀镍镀金SELECTIVEGOLD全面镀镍金GOLDPLATING(4)外观及成型制作流程PCBEngineeringReportSheet6典型多层板制作流程1.内层THINCORE2.内层线路制作(压膜)PCBEngineeringReportSheet7典型多层板制作流程4.内层线路制作(显影)3.内层线路制作(曝光)PCBEngineeringReportSheet8典型多层板制作流程5.内层线路制作(蚀刻)6.内层线路制作(去膜)PCBEngineeringReportSheet9典型多层板制作流程7.迭板8.压合LAYER2LAYER3LAYER4LAYER5LAYER1LAYER6PCBEngineeringReportSheet10典型多层板制作流程9.钻孔10.黑孔PCBEngineeringReportSheet11典型多层板制作流程11.外层线路压膜12.外层线路曝光PCBEngineeringReportSheet12典型多层板制作流程13.外层线路制作(显影)14.镀二次铜及锡铅PCBEngineeringReportSheet13典型多层板制作流程15.去干膜16.蚀铜(碱性蚀刻液)PCBEngineeringReportSheet14典型多层板制作流程17.剥锡铅18.防焊(绿漆)制作PCBEngineeringReportSheet15典型多层板制作流程15.浸金(喷锡……)制作PCBEngineeringReportSheet16干膜制作流程基板壓膜壓膜後曝光顯影蝕銅去膜PCBEngineeringReportSheet17典型之多层板迭板及压合结构...COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ迭合用之钢板迭合用之钢板10-12层迭合压合机之热板压合机之热板COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ迭合用之钢板迭合用之钢板PCBEngineeringReportSheet181.下料裁板(PanelSize)COPPERFOILEpoxyGlassPhotoResist2.内层板压干膜(光阻剂)PCBEngineeringReportSheet193.曝光4.曝光后Artwork(底片)Artwork(底片)PhotoResist光源PCBEngineeringReportSheet205.内层板显影PhotoResist6.酸性蚀刻(Power/Ground或Signal)PhotoResistPCBEngineeringReportSheet218.黑化(OxideCoating)7.去干膜(StripResist)PCBEngineeringReportSheet229.迭板Layer1Layer2Layer3Layer4CopperFoilCopperFoilInnerLayerPrepreg(胶片)Prepreg(胶片)PCBEngineeringReportSheet2310.压合(Lamination)11.钻孔(P.T.H.或盲孔Via)(Drill&Deburr)墊木板鋁板PCBEngineeringReportSheet2412.镀通孔附着碳粉13.外层压膜(干膜Tenting)PhotoResistPCBEngineeringReportSheet2514.外层曝光(patternplating)15.曝光后(patternplating)PCBEngineeringReportSheet2616.外层显影17.线路镀铜及锡铅PCBEngineeringReportSheet2718.去膜19.蚀铜(碱性蚀刻)PCBEngineeringReportSheet2820.剥锡铅21.喷涂(液状绿漆)PCBEngineeringReportSheet2922.23.绿漆显影光源S/MA/WPCBEngineeringReportSheet3024.印文字25.喷锡(浸金……)R105WWEI94V-0R105WWEI94V-0PCBEngineeringReportSheet31光分解反应(正性工作)→底片,STENCIL(网版)PCBEngineeringReportSheet32光聚合反应(负性工作)→底片,STENCIL(网版)PCBEngineeringReportSheet33BURIEDVIALAY-UPA=THROUGHVIAHOLE(导通孔)B=BURIEDVIAHOLE(埋孔)C=BLINDVIAHOLE(盲孔)D=BLINDHOLEMLBVIA(多层盲孔)BLINDVIALAY-UPBLINDVIASEQUENTIALLAY-UPABBACCARESINB-STAGEBLINDANDBURIEDVIAOPTION(盲埋孔之选择)DPCBEngineeringReportSheet346–SpindleDrillingMachinePCBEngineeringReportSheet35BlackHoleLineDesmearPCBEngineeringReportSheet36DryFilmLaminatorAutomaticExposureMachinePCBEngineeringReportSheet37PatternPlatingLinePCBEngineeringReportSheet38EtchingLinePCBEngineeringReportSheet39AutomaticS/MPrintingLineAutomaticExposureMachinePCBEngineeringReportSheet40PostCureLineAutomaticLegendPrintingLinePCBEngineeringReportSheet41SolderLevelingMachineO/STesterTheEnd