无铅组装工艺实践指南

1SMT2ScreenPrintP&PReflowTestMI/AOIMI/AOIMI/AOI/XRay/‘SMT23AOIandXrayScreenPrintP&PReflowTestSMTAOIXray4BGA..ScreenPrintP&PReflowTestSMT35SMT6SMT--47SMT--8TimeTemp.200C250Ctc1–smallSMDtc1–mediumSMDtc3–largeSMD50C50CPeak:200–250C59TimeTemp.230C250Ctc1–smallSMDtc1–mediumSMDtc3–largeSMD20C20CTooHot!TooCold!Peak:230–250C10611—(seconds)C3090230240250217260245245CBGASAC230CPCBÆÅ22812PCBAg713SMTBGABGAPCBBGAPCBPCBBGA14SMTBGABGABGA815W/S—PCBSn63Pb37Sn3.0Ag0.5Cu24552605PCBENIGAgOSP16W/SzzzVoc-freez917W/SzSAC18W/SzSAC¾¾¾1019W/SFilletliftingzSAC;20W/S1.02.0Sn63Pb37Sn99.3Cu0.7SAC1121SACCuzz22SACCuzz1223W/Sz¾PCBENIGAg¾OSPSACVoc-free;¾24zMIL-STD/IPCz40C25z60/40228(188)zSn3.8Ag0.7Cu257(217)zSn0.7Cu267(227)1325050100150200250300350012345678TheoreticalActualMeltingPoint.217CThermalEnergy=AreaUnderCurveVsFluxActivationJointFormationPhaseChange26142735S@37035S@34035S@340HAKKO9362835S@37035S@34035S@340ERSA20001529-z—z30BGAZoneTinLeadLeadFreeTempTimeTempTimePre-Heat100C-120C.60-90s130C-140C.100sSoak160C-170C.90s140C-170C.90sRampNONE170C-225C.100sReflowMax220C.60s225C-235C.15-30sCool60C.30-60s60C.30-60s1631BGA250C!!235CPCB190C32BGA¾¾10CTempDelta17335deg.∆5°cPCB10240250CBGA34∆∆∆∆∆∆10CBGA1835PrintingonPBGA&µBgaSolderpastedepositiononPBGASolderpastedepositiononIntelµBGABGA/CSP36BGASMT1937SOPSMT38SOP203940z:zzOSPzAXIAOI2141zIPCA610CzzOSP42XrayAXIBGABGA2243XrayAXIBGABGAThicknessBGABGA44zBGAzBGABGABGAzOpenBGABGAzShortBGAzVoidingBGA5VoidingXrayAXIBGA2345QFPXrayAXISOPQFP46zFilletLengthQFPSPCPinLengthzQFPQFPHeel/Center/Toe/FilletzOpenOpenSignalzJAXIXrayAXISOPQFP2447AOI--zAOIAOIAOI48AOI--zSOPChipSMT2549AOI--zAOIOMRONAOI“LANDTIP”“DOMETIP”AGILENTAOIzAGILENTAOIOMRONAOIzPCBOSPPCBAOIPCBOMRONAOI“DOMETIP”AGILENTAOI“JOINTINSPECTION”50